AMD Phenom II 42 TWKR Black Edition vs Intel Pentium III 1000

Comparative analysis of AMD Phenom II 42 TWKR Black Edition and Intel Pentium III 1000 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the AMD Phenom II 42 TWKR Black Edition

  • 3 more cores, run more applications at once: 4 vs 1
  • Around 100% higher clock speed: 2 GHz vs 1 GHz
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 180 nm
  • 64x more L1 cache, more data can be stored in the L1 cache for quick access later
  • 8x more L2 cache, more data can be stored in the L2 cache for quick access later
  • 14.2x better performance in PassMark - CPU mark: 3489 vs 245
Specifications (specs)
Number of cores 4 vs 1
Maximum frequency 2 GHz vs 1 GHz
Manufacturing process technology 45 nm vs 180 nm
L1 cache 128 KB (per core) vs 8 KB
L2 cache 512 KB (per core) vs 256 KB
Benchmarks
PassMark - CPU mark 3489 vs 245

Reasons to consider the Intel Pentium III 1000

  • 4.3x lower typical power consumption: 29 Watt vs 125 Watt
Thermal Design Power (TDP) 29 Watt vs 125 Watt

Compare benchmarks

CPU 1: AMD Phenom II 42 TWKR Black Edition
CPU 2: Intel Pentium III 1000

PassMark - CPU mark
CPU 1
CPU 2
3489
245
Name AMD Phenom II 42 TWKR Black Edition Intel Pentium III 1000
PassMark - Single thread mark 0 0
PassMark - CPU mark 3489 245

Compare specifications (specs)

AMD Phenom II 42 TWKR Black Edition Intel Pentium III 1000

Essentials

Architecture codename Deneb Coppermine
Launch date June 2009 Q1'00
Place in performance rating 3314 3352
Vertical segment Desktop Desktop
Series Legacy Intel® Pentium® Processor
Status Discontinued

Performance

64 bit support
Die size 258 mm 80 mm
L1 cache 128 KB (per core) 8 KB
L2 cache 512 KB (per core) 256 KB
L3 cache 6144 KB (shared)
Manufacturing process technology 45 nm 180 nm
Maximum frequency 2 GHz 1 GHz
Number of cores 4 1
Transistor count 758 million 44 million
Base frequency 1.00 GHz
Bus Speed 133 MHz FSB
Maximum case temperature (TCase) 69 °C
Maximum core temperature 75°C
VID voltage range 1.75V

Memory

Supported memory types DDR3

Compatibility

Max number of CPUs in a configuration 1 1
Sockets supported AM3 PPGA370, SECC2, SECC2495
Thermal Design Power (TDP) 125 Watt 29 Watt
Low Halogen Options Available

Advanced Technologies

Intel® Turbo Boost technology

Virtualization

Intel® Virtualization Technology (VT-x)