AMD Phenom II X3 715 BE vs Intel Pentium III 1000

Comparative analysis of AMD Phenom II X3 715 BE and Intel Pentium III 1000 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

AMD Phenom II X3 715 BE

Intel Pentium III 1000

Differences

Reasons to consider the AMD Phenom II X3 715 BE

Processor is unlocked, an unlocked multiplier allows for easier overclocking
2 more cores, run more applications at once: 3 vs 1
Around 180% higher clock speed: 2.8 GHz vs 1 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 180 nm
48x more L1 cache, more data can be stored in the L1 cache for quick access later
6x more L2 cache, more data can be stored in the L2 cache for quick access later
10.8x better performance in PassMark - CPU mark: 2649 vs 245

Specifications (specs)
Unlocked	Unlocked vs Locked
Number of cores	3 vs 1
Maximum frequency	2.8 GHz vs 1 GHz
Manufacturing process technology	45 nm vs 180 nm
L1 cache	128 KB (per core) vs 8 KB
L2 cache	512 KB (per core) vs 256 KB
Benchmarks
PassMark - CPU mark	2649 vs 245

Reasons to consider the Intel Pentium III 1000

3.3x lower typical power consumption: 29 Watt vs 95 Watt

Thermal Design Power (TDP)	29 Watt vs 95 Watt

Compare benchmarks

CPU 1: AMD Phenom II X3 715 BE
CPU 2: Intel Pentium III 1000

PassMark - CPU mark

CPU 1

CPU 2

2649

245

Name	AMD Phenom II X3 715 BE	Intel Pentium III 1000
PassMark - Single thread mark	0	0
PassMark - CPU mark	2649	245

Compare specifications (specs)

	AMD Phenom II X3 715 BE	Intel Pentium III 1000
Essentials
Architecture codename	Heka	Coppermine
Launch date	October 2010	Q1'00
Place in performance rating	3319	3352
Vertical segment	Desktop	Desktop
Series		Legacy Intel® Pentium® Processor
Status		Discontinued
Performance
64 bit support
Die size	258 mm	80 mm
L1 cache	128 KB (per core)	8 KB
L2 cache	512 KB (per core)	256 KB
L3 cache	6144 KB (shared)
Manufacturing process technology	45 nm	180 nm
Maximum frequency	2.8 GHz	1 GHz
Number of cores	3	1
Transistor count	758 million	44 million
Unlocked
Base frequency		1.00 GHz
Bus Speed		133 MHz FSB
Maximum case temperature (TCase)		69 °C
Maximum core temperature		75°C
VID voltage range		1.75V
Compatibility
Max number of CPUs in a configuration	1	1
Sockets supported	AM2+	PPGA370, SECC2, SECC2495
Thermal Design Power (TDP)	95 Watt	29 Watt
Low Halogen Options Available
Advanced Technologies
Intel® Turbo Boost technology
Virtualization
Intel® Virtualization Technology (VT-x)