AMD Phenom II X3 715 BE vs Intel Pentium III 1133

Comparative analysis of AMD Phenom II X3 715 BE and Intel Pentium III 1133 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the AMD Phenom II X3 715 BE

  • CPU is newer: launch date 9 year(s) 3 month(s) later
  • Processor is unlocked, an unlocked multiplier allows for easier overclocking
  • 2 more cores, run more applications at once: 3 vs 1
  • Around 148% higher clock speed: 2.8 GHz vs 1.13 GHz
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 130 nm
  • 48x more L1 cache, more data can be stored in the L1 cache for quick access later
  • 6x more L2 cache, more data can be stored in the L2 cache for quick access later
  • 9.3x better performance in PassMark - CPU mark: 2649 vs 284
Specifications (specs)
Launch date October 2010 vs July 2001
Unlocked Unlocked vs Locked
Number of cores 3 vs 1
Maximum frequency 2.8 GHz vs 1.13 GHz
Manufacturing process technology 45 nm vs 130 nm
L1 cache 128 KB (per core) vs 8 KB
L2 cache 512 KB (per core) vs 256 KB
Benchmarks
PassMark - CPU mark 2649 vs 284

Reasons to consider the Intel Pentium III 1133

  • 3.3x lower typical power consumption: 29.1 Watt vs 95 Watt
Thermal Design Power (TDP) 29.1 Watt vs 95 Watt

Compare benchmarks

CPU 1: AMD Phenom II X3 715 BE
CPU 2: Intel Pentium III 1133

PassMark - CPU mark
CPU 1
CPU 2
2649
284
Name AMD Phenom II X3 715 BE Intel Pentium III 1133
PassMark - Single thread mark 0 0
PassMark - CPU mark 2649 284

Compare specifications (specs)

AMD Phenom II X3 715 BE Intel Pentium III 1133

Essentials

Architecture codename Heka Tualatin
Launch date October 2010 July 2001
Place in performance rating 3319 3353
Vertical segment Desktop Desktop
Series Legacy Intel® Pentium® Processor
Status Discontinued

Performance

64 bit support
Die size 258 mm 80 mm2
L1 cache 128 KB (per core) 8 KB
L2 cache 512 KB (per core) 256 KB
L3 cache 6144 KB (shared)
Manufacturing process technology 45 nm 130 nm
Maximum frequency 2.8 GHz 1.13 GHz
Number of cores 3 1
Transistor count 758 million 44 million
Unlocked
Base frequency 1.13 GHz
Bus Speed 133 MHz FSB
Maximum case temperature (TCase) 69 °C
Maximum core temperature 69°C
VID voltage range 1.5V

Compatibility

Max number of CPUs in a configuration 1 1
Sockets supported AM2+ PPGA370
Thermal Design Power (TDP) 95 Watt 29.1 Watt
Low Halogen Options Available

Advanced Technologies

Intel® Turbo Boost technology

Virtualization

Intel® Virtualization Technology (VT-x)