AMD Phenom II X3 720 BE vs Intel Pentium III 1400
Comparative analysis of AMD Phenom II X3 720 BE and Intel Pentium III 1400 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Advanced Technologies, Virtualization. Benchmark processor performance analysis: CompuBench 1.5 Desktop - T-Rex (Frames/s), PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the AMD Phenom II X3 720 BE
- CPU is newer: launch date 7 year(s) 2 month(s) later
- Processor is unlocked, an unlocked multiplier allows for easier overclocking
- 2 more cores, run more applications at once: 3 vs 1
- Around 100% higher clock speed: 2.8 GHz vs 1.4 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 130 nm
- 48x more L1 cache, more data can be stored in the L1 cache for quick access later
- 6x more L2 cache, more data can be stored in the L2 cache for quick access later
Launch date | February 2009 vs December 2001 |
Unlocked | Unlocked vs Locked |
Number of cores | 3 vs 1 |
Maximum frequency | 2.8 GHz vs 1.4 GHz |
Manufacturing process technology | 45 nm vs 130 nm |
L1 cache | 128 KB (per core) vs 8 KB |
L2 cache | 512 KB (per core) vs 256 KB |
Reasons to consider the Intel Pentium III 1400
- 3.1x lower typical power consumption: 31.2 Watt vs 95 Watt
Thermal Design Power (TDP) | 31.2 Watt vs 95 Watt |
Compare benchmarks
CPU 1: AMD Phenom II X3 720 BE
CPU 2: Intel Pentium III 1400
Name | AMD Phenom II X3 720 BE | Intel Pentium III 1400 |
---|---|---|
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.161 | |
PassMark - Single thread mark | 272 | |
PassMark - CPU mark | 193 |
Compare specifications (specs)
AMD Phenom II X3 720 BE | Intel Pentium III 1400 | |
---|---|---|
Essentials |
||
Architecture codename | Heka | Tualatin |
Launch date | February 2009 | December 2001 |
Place in performance rating | 3211 | 3256 |
Vertical segment | Desktop | Desktop |
Series | Legacy Intel® Pentium® Processor | |
Status | Discontinued | |
Performance |
||
64 bit support | ||
Die size | 258 mm | 80 mm2 |
L1 cache | 128 KB (per core) | 8 KB |
L2 cache | 512 KB (per core) | 256 KB |
L3 cache | 6144 KB (shared) | |
Manufacturing process technology | 45 nm | 130 nm |
Maximum frequency | 2.8 GHz | 1.4 GHz |
Number of cores | 3 | 1 |
Transistor count | 758 million | 44 million |
Unlocked | ||
Base frequency | 1.40 GHz | |
Bus Speed | 133 MHz FSB | |
Maximum case temperature (TCase) | 69 °C | |
Maximum core temperature | 69°C | |
VID voltage range | 1.5V | |
Memory |
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Supported memory types | DDR3 | |
Compatibility |
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Max number of CPUs in a configuration | 1 | 1 |
Sockets supported | AM3 | PPGA370 |
Thermal Design Power (TDP) | 95 Watt | 31.2 Watt |
Low Halogen Options Available | ||
Advanced Technologies |
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Intel® Turbo Boost technology | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) |