AMD Phenom II X3 720 BE vs Intel Atom 230
Comparative analysis of AMD Phenom II X3 720 BE and Intel Atom 230 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: CompuBench 1.5 Desktop - T-Rex (Frames/s), PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the AMD Phenom II X3 720 BE
- CPU is newer: launch date 11 month(s) later
- Processor is unlocked, an unlocked multiplier allows for easier overclocking
- 2 more cores, run more applications at once: 3 vs 1
- Around 75% higher clock speed: 2.8 GHz vs 1.6 GHz
- 6x more L1 cache, more data can be stored in the L1 cache for quick access later
- 3x more L2 cache, more data can be stored in the L2 cache for quick access later
Launch date | February 2009 vs 1 March 2008 |
Unlocked | Unlocked vs Locked |
Number of cores | 3 vs 1 |
Maximum frequency | 2.8 GHz vs 1.6 GHz |
L1 cache | 128 KB (per core) vs 64 KB (per core) |
L2 cache | 512 KB (per core) vs 512 KB |
Reasons to consider the Intel Atom 230
- 23.8x lower typical power consumption: 4 Watt vs 95 Watt
Thermal Design Power (TDP) | 4 Watt vs 95 Watt |
Compare benchmarks
CPU 1: AMD Phenom II X3 720 BE
CPU 2: Intel Atom 230
Name | AMD Phenom II X3 720 BE | Intel Atom 230 |
---|---|---|
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.161 | |
PassMark - Single thread mark | 185 | |
PassMark - CPU mark | 169 | |
Geekbench 4 - Single Core | 436 | |
Geekbench 4 - Multi-Core | 552 |
Compare specifications (specs)
AMD Phenom II X3 720 BE | Intel Atom 230 | |
---|---|---|
Essentials |
||
Architecture codename | Heka | Diamondville |
Launch date | February 2009 | 1 March 2008 |
Place in performance rating | 3211 | 3219 |
Vertical segment | Desktop | Desktop |
Processor Number | 230 | |
Series | Legacy Intel Atom® Processors | |
Status | Discontinued | |
Performance |
||
64 bit support | ||
Die size | 258 mm | 26 mm2 |
L1 cache | 128 KB (per core) | 64 KB (per core) |
L2 cache | 512 KB (per core) | 512 KB |
L3 cache | 6144 KB (shared) | |
Manufacturing process technology | 45 nm | 45 nm |
Maximum frequency | 2.8 GHz | 1.6 GHz |
Number of cores | 3 | 1 |
Transistor count | 758 million | 47 million |
Unlocked | ||
Base frequency | 1.60 GHz | |
Bus Speed | 533 MHz FSB | |
Front-side bus (FSB) | 533 MHz | |
Maximum core temperature | 85.2°C | |
Number of threads | 2 | |
VID voltage range | 0.9V-1.1625V | |
Memory |
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Supported memory types | DDR3 | |
Compatibility |
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Max number of CPUs in a configuration | 1 | 1 |
Sockets supported | AM3 | PBGA437 |
Thermal Design Power (TDP) | 95 Watt | 4 Watt |
Low Halogen Options Available | ||
Package Size | 22mm x 22mm | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
FSB parity | ||
Idle States | ||
Instruction set extensions | Intel® SSE2, Intel® SSE3, Intel® SSSE3 | |
Intel 64 | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Thermal Monitoring | ||
Virtualization |
||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) |