AMD Phenom II X4 900e vs Intel Pentium 4 HT 551

Comparative analysis of AMD Phenom II X4 900e and Intel Pentium 4 HT 551 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

AMD Phenom II X4 900e

Intel Pentium 4 HT 551

Differences

Reasons to consider the AMD Phenom II X4 900e

CPU is newer: launch date 4 year(s) 0 month(s) later
3 more cores, run more applications at once: 4 vs 1
A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 90 nm
32x more L1 cache, more data can be stored in the L1 cache for quick access later
2x more L2 cache, more data can be stored in the L2 cache for quick access later
Around 29% lower typical power consumption: 65 Watt vs 84 Watt

Launch date	June 2009 vs June 2005
Number of cores	4 vs 1
Manufacturing process technology	45 nm vs 90 nm
L1 cache	128 KB (per core) vs 16 KB
L2 cache	512 KB (per core) vs 1024 KB
Thermal Design Power (TDP)	65 Watt vs 84 Watt

Reasons to consider the Intel Pentium 4 HT 551

Around 42% higher clock speed: 3.4 GHz vs 2.4 GHz

Maximum frequency	3.4 GHz vs 2.4 GHz

Compare benchmarks

CPU 1: AMD Phenom II X4 900e
CPU 2: Intel Pentium 4 HT 551

Name	AMD Phenom II X4 900e	Intel Pentium 4 HT 551
PassMark - Single thread mark	917
PassMark - CPU mark	1505
Geekbench 4 - Single Core		916
Geekbench 4 - Multi-Core		1039

Compare specifications (specs)

	AMD Phenom II X4 900e	Intel Pentium 4 HT 551
Essentials
Architecture codename	Deneb	Prescott
Launch date	June 2009	June 2005
Place in performance rating	2380	2366
Vertical segment	Desktop	Desktop
Processor Number		551
Series		Legacy Intel® Pentium® Processor
Status		Discontinued
Performance
64 bit support
Die size	258 mm	112 mm2
L1 cache	128 KB (per core)	16 KB
L2 cache	512 KB (per core)	1024 KB
L3 cache	6144 KB (shared)
Manufacturing process technology	45 nm	90 nm
Maximum frequency	2.4 GHz	3.4 GHz
Number of cores	4	1
Transistor count	758 million	125 million
Base frequency		3.40 GHz
Bus Speed		800 MHz FSB
Maximum core temperature		67.7°C
VID voltage range		1.200V-1.425V
Memory
Supported memory types	DDR3	DDR1, DDR2, DDR3
Compatibility
Max number of CPUs in a configuration	1	1
Sockets supported	AM3	PLGA775
Thermal Design Power (TDP)	65 Watt	84 Watt
Low Halogen Options Available
Package Size		37.5mm x 37.5mm
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Virtualization
Intel® Virtualization Technology (VT-x)