AMD R-272F vs AMD GX-424CC
Comparative analysis of AMD R-272F and AMD GX-424CC processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics API support, Compatibility, Peripherals, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps).
Differences
Reasons to consider the AMD R-272F
- Around 11% higher maximum core temperature: 100 °C vs 90 °C
Maximum core temperature | 100 °C vs 90 °C |
Reasons to consider the AMD GX-424CC
- CPU is newer: launch date 2 year(s) 0 month(s) later
- 2 more cores, run more applications at once: 4 vs 2
- 2 more threads: 4 vs 2
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 28 nm vs 32 nm
- 2.7x more L1 cache, more data can be stored in the L1 cache for quick access later
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 40% lower typical power consumption: 25 Watt vs 35 Watt
Launch date | 6 June 2014 vs 21 May 2012 |
Number of cores | 4 vs 2 |
Number of threads | 4 vs 2 |
Manufacturing process technology | 28 nm vs 32 nm |
L1 cache | 256 KB vs 96 KB |
L2 cache | 2048 KB vs 1 MB |
Thermal Design Power (TDP) | 25 Watt vs 35 Watt |
Compare benchmarks
CPU 1: AMD R-272F
CPU 2: AMD GX-424CC
Name | AMD R-272F | AMD GX-424CC |
---|---|---|
PassMark - Single thread mark | 1087 | |
PassMark - CPU mark | 1215 | |
GFXBench 4.0 - Car Chase Offscreen (Frames) | 7 | |
GFXBench 4.0 - Car Chase Offscreen (Fps) | 7 | |
GFXBench 4.0 - Manhattan (Frames) | 924 | |
GFXBench 4.0 - Manhattan (Fps) | 924 | |
GFXBench 4.0 - T-Rex (Frames) | 2698 | |
GFXBench 4.0 - T-Rex (Fps) | 2698 |
Compare specifications (specs)
AMD R-272F | AMD GX-424CC | |
---|---|---|
Essentials |
||
Architecture codename | Piledriver | Steppe Eagle |
Launch date | 21 May 2012 | 6 June 2014 |
Place in performance rating | 2189 | 2215 |
Vertical segment | Embedded | Embedded |
Family | AMD G-Series | |
Performance |
||
64 bit support | ||
Base frequency | 2.7 GHz | 2400 MHz |
L1 cache | 96 KB | 256 KB |
L2 cache | 1 MB | 2048 KB |
Manufacturing process technology | 32 nm | 28 nm |
Maximum core temperature | 100 °C | 90 °C |
Maximum frequency | 3.2 GHz | |
Number of cores | 2 | 4 |
Number of threads | 2 | 4 |
Memory |
||
Max memory channels | 2 | 1 |
Maximum memory bandwidth | 25.6 GB/s | |
Supported memory types | DDR3-1600, DDR3L-1600, DDR3U-1600 | DDR3-1866 |
ECC memory support | ||
Graphics |
||
Graphics base frequency | 497 MHz | 497 MHz |
Graphics max frequency | 686 MHz | |
Number of pipelines | 192 | |
Processor graphics | Radeon HD 7520G | Radeon R5E |
Unified Video Decoder (UVD) | ||
Video Codec Engine (VCE) | ||
Graphics interfaces |
||
DisplayPort | ||
DVI | ||
HDMI | ||
Number of displays supported | 4 | 2 |
VGA | ||
Graphics API support |
||
DirectX | 11 | 11.1 |
OpenGL | 4.2 | 4.2 |
Compatibility |
||
Max number of CPUs in a configuration | 1 | |
Sockets supported | FS1 | BGA769 (FT3b) |
Thermal Design Power (TDP) | 35 Watt | 25 Watt |
Peripherals |
||
Max number of PCIe lanes | 16 | |
PCI Express revision | 2.0 | |
Advanced Technologies |
||
Enhanced Virus Protection (EVP) | ||
Fused Multiply-Add 3 (FMA3) | ||
Fused Multiply-Add 4 (FMA4) | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Virtualization |
||
AMD Virtualization (AMD-V™) |