AMD R-272F vs Intel Core m3-6Y30

Comparative analysis of AMD R-272F and Intel Core m3-6Y30 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics API support, Compatibility, Peripherals, Advanced Technologies, Virtualization, Graphics image quality, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Fps).

AMD R-272F

Intel Core m3-6Y30

Differences

Reasons to consider the AMD R-272F

Around 45% higher clock speed: 3.2 GHz vs 2.20 GHz
2x more L2 cache, more data can be stored in the L2 cache for quick access later

Maximum frequency	3.2 GHz vs 2.20 GHz
L2 cache	1 MB vs 512 KB

Reasons to consider the Intel Core m3-6Y30

CPU is newer: launch date 3 year(s) 3 month(s) later
2 more threads: 4 vs 2
A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 32 nm
Around 33% more L1 cache; more data can be stored in the L1 cache for quick access later
7x lower typical power consumption: 4.5 Watt vs 35 Watt
Around 8% better performance in PassMark - Single thread mark: 1173 vs 1087
Around 79% better performance in PassMark - CPU mark: 2170 vs 1215

Specifications (specs)
Launch date	1 September 2015 vs 21 May 2012
Number of threads	4 vs 2
Manufacturing process technology	14 nm vs 32 nm
L1 cache	128 KB vs 96 KB
Thermal Design Power (TDP)	4.5 Watt vs 35 Watt
Benchmarks
PassMark - Single thread mark	1173 vs 1087
PassMark - CPU mark	2170 vs 1215

Compare benchmarks

CPU 1: AMD R-272F
CPU 2: Intel Core m3-6Y30

PassMark - Single thread mark

CPU 1

CPU 2

1087

1173

PassMark - CPU mark

CPU 1

CPU 2

1215

2170

Name	AMD R-272F	Intel Core m3-6Y30
PassMark - Single thread mark	1087	1173
PassMark - CPU mark	1215	2170
Geekbench 4 - Single Core		2206
Geekbench 4 - Multi-Core		3799
CompuBench 1.5 Desktop - Face Detection (mPixels/s)		5.119
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s)		27.415
CompuBench 1.5 Desktop - T-Rex (Frames/s)		0.276
CompuBench 1.5 Desktop - Video Composition (Frames/s)		1.744
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s)		13.111
GFXBench 4.0 - Car Chase Offscreen (Frames)		1257
GFXBench 4.0 - Manhattan (Frames)		1581
GFXBench 4.0 - T-Rex (Frames)		2322
GFXBench 4.0 - Car Chase Offscreen (Fps)		1257
GFXBench 4.0 - Manhattan (Fps)		1581
GFXBench 4.0 - T-Rex (Fps)		2322

Compare specifications (specs)

	AMD R-272F	Intel Core m3-6Y30
Essentials
Architecture codename	Piledriver	Skylake
Launch date	21 May 2012	1 September 2015
Place in performance rating	2189	1932
Vertical segment	Embedded	Mobile
Launch price (MSRP)		$281
Processor Number		M3-6Y30
Series		6th Generation Intel® Core™ m Processors
Status		Launched
Performance
64 bit support
Base frequency	2.7 GHz	900 MHz
L1 cache	96 KB	128 KB
L2 cache	1 MB	512 KB
Manufacturing process technology	32 nm	14 nm
Maximum core temperature	100 °C	100°C
Maximum frequency	3.2 GHz	2.20 GHz
Number of cores	2	2
Number of threads	2	4
Bus Speed		4 GT/s OPI
Die size		99 mm
L3 cache		4 MB
Memory
Max memory channels	2	2
Maximum memory bandwidth	25.6 GB/s	29.8 GB/s
Supported memory types	DDR3-1600, DDR3L-1600, DDR3U-1600	LPDDR3-1866, DDR3L-1600
Maximum memory size		16 GB
Graphics
Graphics base frequency	497 MHz	300 MHz
Graphics max frequency	686 MHz	850 MHz
Number of pipelines	192
Processor graphics	Radeon HD 7520G	Intel® HD Graphics 515
Unified Video Decoder (UVD)
Video Codec Engine (VCE)
Device ID		0x191E
Graphics max dynamic frequency		850 MHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Max video memory		16 GB
Graphics interfaces
DisplayPort
DVI
HDMI
Number of displays supported	4	3
VGA
eDP
Wireless Display (WiDi) support
Graphics API support
DirectX	11	12
OpenGL	4.2	4.5
Compatibility
Max number of CPUs in a configuration	1	1
Sockets supported	FS1	FCBGA1515
Thermal Design Power (TDP)	35 Watt	4.5 Watt
Configurable TDP-down		3.8 W
Configurable TDP-up		7 W
Low Halogen Options Available
Package Size		20mm X 16.5mm
Peripherals
Max number of PCIe lanes	16	10
PCI Express revision	2.0	3.0
PCIe configurations		1x4, 2x2, 1x2+2x1 and 4x1
Advanced Technologies
Enhanced Virus Protection (EVP)
Fused Multiply-Add 3 (FMA3)
Fused Multiply-Add 4 (FMA4)
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions		Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2
Intel 64
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® Smart Response technology
Intel® Stable Image Platform Program (SIPP)
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Virtualization
AMD Virtualization (AMD-V™)
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
Graphics image quality
4K resolution support
Max resolution over DisplayPort		3840x2160@60Hz
Max resolution over eDP		3840x2160@60Hz
Max resolution over HDMI 1.4		4096@2304@24Hz
Max resolution over VGA		N / A
Max resolution over WiDi		1080p
Security & Reliability
Execute Disable Bit (EDB)
Intel® Memory Protection Extensions (Intel® MPX)
Intel® OS Guard
Intel® Secure Key technology
Intel® Software Guard Extensions (Intel® SGX)
Intel® Trusted Execution technology (TXT)