AMD Ryzen 3 3200G vs Intel Core i5-650

Comparative analysis of AMD Ryzen 3 3200G and Intel Core i5-650 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).

AMD Ryzen 3 3200G

Intel Core i5-650

Differences

Reasons to consider the AMD Ryzen 3 3200G

CPU is newer: launch date 9 year(s) 6 month(s) later
Processor is unlocked, an unlocked multiplier allows for easier overclocking
2 more cores, run more applications at once: 4 vs 2
Around 16% higher clock speed: 4 GHz vs 3.46 GHz
Around 31% higher maximum core temperature: 95 °C vs 72.6°C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 12 nm vs 32 nm
3x more L1 cache, more data can be stored in the L1 cache for quick access later
4x more L2 cache, more data can be stored in the L2 cache for quick access later
Around 12% lower typical power consumption: 65 Watt vs 73 Watt
Around 70% better performance in Geekbench 4 - Single Core: 886 vs 520
2.5x better performance in Geekbench 4 - Multi-Core: 2901 vs 1152
Around 61% better performance in PassMark - Single thread mark: 2195 vs 1363
3.1x better performance in PassMark - CPU mark: 7071 vs 2255

Specifications (specs)
Launch date	7 July 2019 vs January 2010
Unlocked	Unlocked vs Locked
Number of cores	4 vs 2
Maximum frequency	4 GHz vs 3.46 GHz
Maximum core temperature	95 °C vs 72.6°C
Manufacturing process technology	12 nm vs 32 nm
L1 cache	384 KB vs 64 KB (per core)
L2 cache	2 MB vs 256 KB (per core)
Thermal Design Power (TDP)	65 Watt vs 73 Watt
Benchmarks
Geekbench 4 - Single Core	886 vs 520
Geekbench 4 - Multi-Core	2901 vs 1152
PassMark - Single thread mark	2195 vs 1363
PassMark - CPU mark	7071 vs 2255

Compare benchmarks

CPU 1: AMD Ryzen 3 3200G
CPU 2: Intel Core i5-650

Geekbench 4 - Single Core

CPU 1

CPU 2

886

520

Geekbench 4 - Multi-Core

CPU 1

CPU 2

2901

1152

PassMark - Single thread mark

CPU 1

CPU 2

2195

1363

PassMark - CPU mark

CPU 1

CPU 2

7071

2255

Name	AMD Ryzen 3 3200G	Intel Core i5-650
Geekbench 4 - Single Core	886	520
Geekbench 4 - Multi-Core	2901	1152
PassMark - Single thread mark	2195	1363
PassMark - CPU mark	7071	2255
3DMark Fire Strike - Physics Score	1933
CompuBench 1.5 Desktop - Face Detection (mPixels/s)		5.924
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s)		29.917
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s)		2.394

Compare specifications (specs)

	AMD Ryzen 3 3200G	Intel Core i5-650
Essentials
Family	Ryzen
Launch date	7 July 2019	January 2010
OPN PIB	YD3200C5FHBOX
OPN Tray	YD3200C5M4MFH
Place in performance rating	1693	2691
Series	Ryzen 3	Legacy Intel® Core™ Processors
Vertical segment	Desktop	Desktop
Architecture codename		Clarkdale
Launch price (MSRP)		$35
Price now		$99.99
Processor Number		i5-650
Status		Discontinued
Value for money (0-100)		9.14
Performance
64 bit support
Base frequency	3.6 GHz	3.20 GHz
L1 cache	384 KB	64 KB (per core)
L2 cache	2 MB	256 KB (per core)
L3 cache	4 MB	4096 KB (shared)
Manufacturing process technology	12 nm	32 nm
Maximum core temperature	95 °C	72.6°C
Maximum frequency	4 GHz	3.46 GHz
Number of cores	4	2
Number of GPU cores	8
Number of threads	4	4
Unlocked
Bus Speed		2.5 GT/s DMI
Die size		81 mm2
Transistor count		382 million
VID voltage range		0.6500V-1.4000V
Memory
Max memory channels	2	2
Supported memory frequency	2933 MHz
Supported memory types	DDR4-2933	DDR3 1066/1333
Maximum memory bandwidth		21 GB/s
Maximum memory size		16.38 GB
Graphics
Graphics base frequency	1250 MHz	733 MHz
iGPU core count	8
Processor graphics	Radeon Vega 8 Graphics	Intel HD Graphics
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Graphics interfaces
DisplayPort
HDMI
Number of displays supported		2
Compatibility
Configurable TDP	45-65 Watt
Sockets supported	AM4	FCLGA1156
Thermal Design Power (TDP)	65 Watt	73 Watt
Low Halogen Options Available
Max number of CPUs in a configuration		1
Package Size		37.5mm x 37.5mm
Peripherals
PCI Express revision	3.0	2.0
PCIe configurations	x8	1x16, 2x8
Max number of PCIe lanes		16
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions		Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Physical Address Extensions (PAE)		36-bit
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)