AMD Ryzen 3 3200G vs Intel Core i7-870S
Comparative analysis of AMD Ryzen 3 3200G and Intel Core i7-870S processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.
Differences
Reasons to consider the AMD Ryzen 3 3200G
- CPU is newer: launch date 9 year(s) 0 month(s) later
- Processor is unlocked, an unlocked multiplier allows for easier overclocking
- Around 11% higher clock speed: 4 GHz vs 3.60 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 12 nm vs 45 nm
- Around 50% more L1 cache; more data can be stored in the L1 cache for quick access later
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 26% lower typical power consumption: 65 Watt vs 82 Watt
- Around 47% better performance in PassMark - Single thread mark: 2195 vs 1493
- 2.6x better performance in PassMark - CPU mark: 7071 vs 2765
| Specifications (specs) | |
| Launch date | 7 July 2019 vs July 2010 |
| Unlocked | Unlocked vs Locked |
| Maximum frequency | 4 GHz vs 3.60 GHz |
| Manufacturing process technology | 12 nm vs 45 nm |
| L1 cache | 384 KB vs 64 KB (per core) |
| L2 cache | 2 MB vs 256 KB (per core) |
| Thermal Design Power (TDP) | 65 Watt vs 82 Watt |
| Benchmarks | |
| PassMark - Single thread mark | 2195 vs 1493 |
| PassMark - CPU mark | 7071 vs 2765 |
Reasons to consider the Intel Core i7-870S
- 4 more threads: 8 vs 4
- 2x more L3 cache, more data can be stored in the L3 cache for quick access later
| Number of threads | 8 vs 4 |
| L3 cache | 8192 KB (shared) vs 4 MB |
Compare benchmarks
CPU 1: AMD Ryzen 3 3200G
CPU 2: Intel Core i7-870S
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | AMD Ryzen 3 3200G | Intel Core i7-870S |
|---|---|---|
| Geekbench 4 - Single Core | 886 | |
| Geekbench 4 - Multi-Core | 2901 | |
| PassMark - Single thread mark | 2195 | 1493 |
| PassMark - CPU mark | 7071 | 2765 |
| 3DMark Fire Strike - Physics Score | 1933 |
Compare specifications (specs)
| AMD Ryzen 3 3200G | Intel Core i7-870S | |
|---|---|---|
Essentials |
||
| Family | Ryzen | |
| Launch date | 7 July 2019 | July 2010 |
| OPN PIB | YD3200C5FHBOX | |
| OPN Tray | YD3200C5M4MFH | |
| Place in performance rating | 1693 | 1712 |
| Series | Ryzen 3 | Legacy Intel® Core™ Processors |
| Vertical segment | Desktop | Desktop |
| Architecture codename | Lynnfield | |
| Processor Number | i7-870S | |
| Status | Discontinued | |
Performance |
||
| 64 bit support | ||
| Base frequency | 3.6 GHz | 2.66 GHz |
| L1 cache | 384 KB | 64 KB (per core) |
| L2 cache | 2 MB | 256 KB (per core) |
| L3 cache | 4 MB | 8192 KB (shared) |
| Manufacturing process technology | 12 nm | 45 nm |
| Maximum core temperature | 95 °C | |
| Maximum frequency | 4 GHz | 3.60 GHz |
| Number of cores | 4 | 4 |
| Number of GPU cores | 8 | |
| Number of threads | 4 | 8 |
| Unlocked | ||
| Bus Speed | 2.5 GT/s DMI | |
| Die size | 296 mm2 | |
| Transistor count | 774 million | |
| VID voltage range | 0.6500V-1.4000V | |
Memory |
||
| Max memory channels | 2 | 2 |
| Supported memory frequency | 2933 MHz | |
| Supported memory types | DDR4-2933 | DDR3 1066/1333 |
| Maximum memory bandwidth | 21 GB/s | |
| Maximum memory size | 16 GB | |
Graphics |
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| Graphics base frequency | 1250 MHz | |
| iGPU core count | 8 | |
| Processor graphics | Radeon Vega 8 Graphics | |
Graphics interfaces |
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| DisplayPort | ||
| HDMI | ||
Compatibility |
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| Configurable TDP | 45-65 Watt | |
| Sockets supported | AM4 | LGA1156 |
| Thermal Design Power (TDP) | 65 Watt | 82 Watt |
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | |
| Package Size | 37.5mm x 37.5mm | |
Peripherals |
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| PCI Express revision | 3.0 | 2.0 |
| PCIe configurations | x8 | 1x16, 2x8 |
| Max number of PCIe lanes | 16 | |
Security & Reliability |
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| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Instruction set extensions | Intel® SSE4.2 | |
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Demand Based Switching | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Physical Address Extensions (PAE) | 36-bit | |
| Thermal Monitoring | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||