AMD Ryzen 3 3200GE vs Intel Core i7-9700F
Comparative analysis of AMD Ryzen 3 3200GE and Intel Core i7-9700F processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the AMD Ryzen 3 3200GE
- CPU is newer: launch date 2 month(s) later
- Processor is unlocked, an unlocked multiplier allows for easier overclocking
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 12 nm vs 14 nm
- Around 86% lower typical power consumption: 35 Watt vs 65 Watt
Launch date | 7 Jul 2019 vs 23 April 2019 |
Unlocked | Unlocked vs Locked |
Manufacturing process technology | 12 nm vs 14 nm |
Thermal Design Power (TDP) | 35 Watt vs 65 Watt |
Reasons to consider the Intel Core i7-9700F
- 4 more cores, run more applications at once: 8 vs 4
- 4 more threads: 8 vs 4
- Around 24% higher clock speed: 4.70 GHz vs 3.8 GHz
- Around 5% higher maximum core temperature: 100 °C vs 95 °C
- Around 33% more L1 cache; more data can be stored in the L1 cache for quick access later
- 3x more L3 cache, more data can be stored in the L3 cache for quick access later
- Around 25% better performance in PassMark - Single thread mark: 2752 vs 2206
- Around 81% better performance in PassMark - CPU mark: 13250 vs 7309
Specifications (specs) | |
Number of cores | 8 vs 4 |
Number of threads | 8 vs 4 |
Maximum frequency | 4.70 GHz vs 3.8 GHz |
Maximum core temperature | 100 °C vs 95 °C |
L1 cache | 512 KB vs 384 KB |
L3 cache | 12 MB vs 4 MB |
Benchmarks | |
PassMark - Single thread mark | 2752 vs 2206 |
PassMark - CPU mark | 13250 vs 7309 |
Compare benchmarks
CPU 1: AMD Ryzen 3 3200GE
CPU 2: Intel Core i7-9700F
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD Ryzen 3 3200GE | Intel Core i7-9700F |
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PassMark - Single thread mark | 2206 | 2752 |
PassMark - CPU mark | 7309 | 13250 |
3DMark Fire Strike - Physics Score | 5121 | |
Geekbench 4 - Single Core | 1207 | |
Geekbench 4 - Multi-Core | 6657 |
Compare specifications (specs)
AMD Ryzen 3 3200GE | Intel Core i7-9700F | |
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Essentials |
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Architecture codename | Zen | Coffee Lake |
Launch date | 7 Jul 2019 | 23 April 2019 |
OPN Tray | YD3200C6M4MFH | |
Place in performance rating | 1120 | 1110 |
Vertical segment | Desktop | Desktop |
Launch price (MSRP) | $323, $335 | |
Processor Number | i7-9700F | |
Performance |
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Base frequency | 3.3 GHz | 3.00 GHz |
L1 cache | 384 KB | 512 KB |
L2 cache | 2 MB | 2 MB |
L3 cache | 4 MB | 12 MB |
Manufacturing process technology | 12 nm | 14 nm |
Maximum core temperature | 95 °C | 100 °C |
Maximum frequency | 3.8 GHz | 4.70 GHz |
Number of cores | 4 | 8 |
Number of GPU cores | 8 | |
Number of threads | 4 | 8 |
Unlocked | ||
64 bit support | ||
Bus Speed | 8 GT/s DMI3 | |
Memory |
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Max memory channels | 2 | 2 |
Supported memory types | DDR4-2933 | DDR4-2666 |
ECC memory support | ||
Maximum memory bandwidth | 41.6 GB/s | |
Maximum memory size | 128 GB | |
Graphics |
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Graphics base frequency | 1200 MHz | |
iGPU core count | 8 | |
Processor graphics | Radeon Vega 8 Graphics | |
Graphics interfaces |
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DisplayPort | ||
HDMI | ||
Compatibility |
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Sockets supported | AM4 | FCLGA1151 |
Thermal Design Power (TDP) | 35 Watt | 65 Watt |
Max number of CPUs in a configuration | 1 | |
Thermal Solution | PCG 2015C (65W) | |
Peripherals |
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PCI Express revision | 3.0 | 3.0 |
Max number of PCIe lanes | 16 | |
PCIe configurations | 1x16, 2x8, 1x8+2x4 | |
Scalability | 1S Only | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Memory Protection Extensions (Intel® MPX) | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel SSE4.1, Intel SSE4.2, Intel AVX2 | |
Intel 64 | ||
Intel® Advanced Vector Extensions 2 (AVX2) | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Optane™ Memory Supported | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |