AMD Ryzen 3 4300U vs Intel Core i7-9700TE
Comparative analysis of AMD Ryzen 3 4300U and Intel Core i7-9700TE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Graphics image quality, Graphics API support, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the AMD Ryzen 3 4300U
- Around 5% higher maximum core temperature: 105 °C vs 100°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm vs 14 nm
- 2.3x lower typical power consumption: 15 Watt vs 35 Watt
- Around 4% better performance in PassMark - Single thread mark: 2308 vs 2214
Specifications (specs) | |
Maximum core temperature | 105 °C vs 100°C |
Manufacturing process technology | 7 nm vs 14 nm |
Thermal Design Power (TDP) | 15 Watt vs 35 Watt |
Benchmarks | |
PassMark - Single thread mark | 2308 vs 2214 |
Reasons to consider the Intel Core i7-9700TE
- 4 more cores, run more applications at once: 8 vs 4
- 4 more threads: 8 vs 4
- Around 3% higher clock speed: 3.80 GHz vs 3.7 GHz
- 2x more L1 cache, more data can be stored in the L1 cache for quick access later
- 3x more L3 cache, more data can be stored in the L3 cache for quick access later
- Around 37% better performance in PassMark - CPU mark: 10203 vs 7440
Specifications (specs) | |
Number of cores | 8 vs 4 |
Number of threads | 8 vs 4 |
Maximum frequency | 3.80 GHz vs 3.7 GHz |
L1 cache | 512 KB vs 256 KB |
L3 cache | 12 MB vs 4 MB |
Benchmarks | |
PassMark - CPU mark | 10203 vs 7440 |
Compare benchmarks
CPU 1: AMD Ryzen 3 4300U
CPU 2: Intel Core i7-9700TE
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD Ryzen 3 4300U | Intel Core i7-9700TE |
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PassMark - Single thread mark | 2308 | 2214 |
PassMark - CPU mark | 7440 | 10203 |
Compare specifications (specs)
AMD Ryzen 3 4300U | Intel Core i7-9700TE | |
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Essentials |
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Architecture codename | Zen 2 | Coffee Lake |
Family | Ryzen 3 | |
Launch date | 6 Jan 2020 | Q2'19 |
OPN Tray | 100-000000085 | |
Place in performance rating | 1065 | 1070 |
Processor Number | 4300U | i7-9700TE |
Vertical segment | Laptop | Embedded |
Launch price (MSRP) | $323 | |
Series | 9th Generation Intel Core i7 Processors | |
Status | Launched | |
Performance |
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Base frequency | 2.7 GHz | 1.80 GHz |
L1 cache | 256 KB | 512 KB |
L2 cache | 2 MB | 2 MB |
L3 cache | 4 MB | 12 MB |
Manufacturing process technology | 7 nm | 14 nm |
Maximum core temperature | 105 °C | 100°C |
Maximum frequency | 3.7 GHz | 3.80 GHz |
Number of cores | 4 | 8 |
Number of GPU cores | 5 | |
Number of threads | 4 | 8 |
64 bit support | ||
Bus Speed | 8 GT/s | |
Memory |
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Supported memory types | DDR4-3200, LPDDR4-4266 | DDR4-2666 |
Max memory channels | 2 | |
Maximum memory bandwidth | 41.6 GB/s | |
Maximum memory size | 128 GB | |
Graphics |
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Graphics base frequency | 1400 MHz | 350 MHz |
iGPU core count | 5 | |
Processor graphics | AMD Radeon Graphics | Intel UHD Graphics 630 |
Device ID | 0x3E98 | |
Graphics max dynamic frequency | 1.15 GHz | |
Intel® Clear Video HD technology | ||
Intel® Clear Video technology | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Max video memory | 128 GB | |
Graphics interfaces |
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DisplayPort | ||
HDMI | ||
DVI | ||
eDP | ||
Number of displays supported | 3 | |
Compatibility |
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Configurable TDP | 10-25 Watt | |
Sockets supported | FP6 | FCLGA1151 |
Thermal Design Power (TDP) | 15 Watt | 35 Watt |
Max number of CPUs in a configuration | 1 | |
Package Size | 37.5mm x 37.5mm | |
Peripherals |
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PCI Express revision | 3.0 | 3.0 |
Max number of PCIe lanes | 16 | |
PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | |
Scalability | 1S Only | |
Graphics image quality |
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4K resolution support | ||
Max resolution over DisplayPort | 4096x2304@60Hz | |
Max resolution over eDP | 4096x2304@60Hz | |
Max resolution over HDMI 1.4 | 4096x2160@30Hz | |
Graphics API support |
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DirectX | 12 | |
OpenGL | 4.5 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Memory Protection Extensions (Intel® MPX) | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Intel® Trusted Execution technology (TXT) | ||
Secure Boot | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel SSE4.1, Intel SSE4.2, Intel AVX2 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Optane™ Memory Supported | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |