AMD Ryzen 3 PRO 3300U vs AMD A12-9730P
Comparative analysis of AMD Ryzen 3 PRO 3300U and AMD A12-9730P processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics API support, Compatibility, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the AMD Ryzen 3 PRO 3300U
- Around 6% higher maximum core temperature: 95 °C vs 90°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 12 nm vs 28 nm
- 2.3x lower typical power consumption: 15 Watt vs 35 Watt
- Around 36% better performance in PassMark - Single thread mark: 1932 vs 1417
- Around 97% better performance in PassMark - CPU mark: 5961 vs 3027
Specifications (specs) | |
Maximum core temperature | 95 °C vs 90°C |
Manufacturing process technology | 12 nm vs 28 nm |
Thermal Design Power (TDP) | 15 Watt vs 35 Watt |
Benchmarks | |
PassMark - Single thread mark | 1932 vs 1417 |
PassMark - CPU mark | 5961 vs 3027 |
Compare benchmarks
CPU 1: AMD Ryzen 3 PRO 3300U
CPU 2: AMD A12-9730P
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD Ryzen 3 PRO 3300U | AMD A12-9730P |
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PassMark - Single thread mark | 1932 | 1417 |
PassMark - CPU mark | 5961 | 3027 |
Geekbench 4 - Single Core | 2143 | |
Geekbench 4 - Multi-Core | 5309 |
Compare specifications (specs)
AMD Ryzen 3 PRO 3300U | AMD A12-9730P | |
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Essentials |
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Architecture codename | Zen+ | |
Family | AMD Ryzen Processors | AMD A-Series Processors |
Launch date | 8 Apr 2019 | Q2 2016 |
OPN Tray | YM330BC4T4MFG | AM973PAEY44AB |
Place in performance rating | 1289 | 1307 |
Series | AMD Ryzen 3 Mobile Processors with Radeon Vega Graphics | AMD A12-Series APU for Laptops |
Vertical segment | Laptop | Laptop |
OS Support | Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit | |
Performance |
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Base frequency | 2.1 GHz | 2.8 GHz |
Compute Cores | 10 | |
L1 cache | 384 KB | |
L2 cache | 2 MB | 2 MB |
L3 cache | 4 MB | |
Manufacturing process technology | 12 nm | 28 nm |
Maximum core temperature | 95 °C | 90°C |
Maximum frequency | 3.5 GHz | 3.5 GHz |
Number of cores | 4 | 4 |
Number of GPU cores | 6 | 6 |
Number of threads | 4 | |
Unlocked | ||
Memory |
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ECC memory support | ||
Max memory channels | 2 | 2 |
Maximum memory bandwidth | 35.76 GB/s | |
Maximum memory size | 32 GB | |
Supported memory frequency | 2400 MHz | 2400 MHz |
Supported memory types | DDR4-2400 | |
Graphics |
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Graphics max frequency | 1200 MHz | 900 MHz |
iGPU core count | 6 | |
Processor graphics | Radeon Vega 6 Graphics | AMD Radeon R7 Graphics |
Enduro | ||
Switchable graphics | ||
Unified Video Decoder (UVD) | ||
Video Codec Engine (VCE) | ||
Graphics interfaces |
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DisplayPort | ||
HDMI | ||
Graphics API support |
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DirectX | 12 | 12 |
Vulkan | ||
Compatibility |
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Configurable TDP-down | 12 Watt | |
Configurable TDP-up | 25 Watt | |
Thermal Design Power (TDP) | 15 Watt | 35 Watt |
Configurable TDP | 25-45 Watt | |
Sockets supported | FP4 | |
Advanced Technologies |
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AMD SenseMI | ||
FreeSync | ||
AMD App Acceleration | ||
AMD HD3D technology | ||
AMD Mantle API | ||
AMD Secure technology | ||
DualGraphics | ||
Fused Multiply-Add 4 (FMA4) | ||
Intel® AES New Instructions | ||
Virtualization |
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AMD Virtualization (AMD-V™) |