AMD Ryzen 3 PRO 5475U vs Intel Xeon W-1270TE
Comparative analysis of AMD Ryzen 3 PRO 5475U and Intel Xeon W-1270TE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Graphics image quality, Graphics API support, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the AMD Ryzen 3 PRO 5475U
- CPU is newer: launch date 1 year(s) 11 month(s) later
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm vs 14 nm
- 2.3x lower typical power consumption: 15 Watt vs 35 Watt
- Around 4% better performance in PassMark - Single thread mark: 2905 vs 2796
Specifications (specs) | |
Launch date | 19 Apr 2022 vs 13 may 2020 |
Manufacturing process technology | 7 nm vs 14 nm |
Thermal Design Power (TDP) | 15 Watt vs 35 Watt |
Benchmarks | |
PassMark - Single thread mark | 2905 vs 2796 |
Reasons to consider the Intel Xeon W-1270TE
- Around 7% higher clock speed: 4.40 GHz vs 4.1 GHz
- Around 5% higher maximum core temperature: 100°C vs 95 °C
- 2x more L1 cache, more data can be stored in the L1 cache for quick access later
- 2x more L3 cache, more data can be stored in the L3 cache for quick access later
- Around 19% better performance in PassMark - CPU mark: 13553 vs 11381
Specifications (specs) | |
Maximum frequency | 4.40 GHz vs 4.1 GHz |
Maximum core temperature | 100°C vs 95 °C |
L1 cache | 512 KB vs 256 KB |
L3 cache | 16 MB vs 8 MB |
Benchmarks | |
PassMark - CPU mark | 13553 vs 11381 |
Compare benchmarks
CPU 1: AMD Ryzen 3 PRO 5475U
CPU 2: Intel Xeon W-1270TE
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD Ryzen 3 PRO 5475U | Intel Xeon W-1270TE |
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PassMark - Single thread mark | 2905 | 2796 |
PassMark - CPU mark | 11381 | 13553 |
Compare specifications (specs)
AMD Ryzen 3 PRO 5475U | Intel Xeon W-1270TE | |
---|---|---|
Essentials |
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Architecture codename | Zen 2 | Comet Lake |
Family | Ryzen 3 | |
Launch date | 19 Apr 2022 | 13 may 2020 |
OPN Tray | 100-000000587 | |
Place in performance rating | 719 | 742 |
Vertical segment | Mobile | Embedded |
Launch price (MSRP) | $367 | |
Processor Number | W-1270TE | |
Series | Intel Xeon W Processor | |
Status | Launched | |
Performance |
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Base frequency | 2.7 GHz | 2.00 GHz |
Die size | 180 mm² | |
L1 cache | 256 KB | 512 KB |
L2 cache | 2 MB | 2 MB |
L3 cache | 8 MB | 16 MB |
Manufacturing process technology | 7 nm | 14 nm |
Maximum core temperature | 95 °C | 100°C |
Maximum frequency | 4.1 GHz | 4.40 GHz |
Number of cores | 4 | |
Number of threads | 8 | |
Transistor count | 10700 million | |
Unlocked | ||
64 bit support | ||
Bus Speed | 8 GT/s | |
Memory |
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ECC memory support | ||
Max memory channels | 2 | 2 |
Supported memory types | DDR4-3200 | DDR4-2933 |
Maximum memory bandwidth | 45.8 GB/s | |
Maximum memory size | 128 GB | |
Graphics |
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Graphics base frequency | 1600 MHz | 350 MHz |
iGPU core count | 6 | |
Processor graphics | AMD Radeon Graphics | Intel UHD Graphics 630 |
Device ID | 0x9BC6 | |
Graphics max dynamic frequency | 1.15 GHz | |
Intel® Clear Video HD technology | ||
Intel® Clear Video technology | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Max video memory | 64 GB | |
Graphics interfaces |
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DisplayPort | ||
HDMI | ||
DVI | ||
eDP | ||
Number of displays supported | 3 | |
Compatibility |
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Configurable TDP | 15-25 Watt | |
Sockets supported | FP6 | FCLGA1200 |
Thermal Design Power (TDP) | 15 Watt | 35 Watt |
Max number of CPUs in a configuration | 1 | |
Package Size | 37.5mm x 37.5mm | |
Thermal Solution | PCG 2015B | |
Peripherals |
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Max number of PCIe lanes | 8 | 16 |
PCI Express revision | 3.0 | 3.0 |
PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | |
Scalability | 1S Only | |
Graphics image quality |
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4K resolution support | ||
Max resolution over DisplayPort | 4096x2304@60Hz | |
Max resolution over eDP | 4096x2304@60Hz | |
Graphics API support |
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DirectX | 12 | |
OpenGL | 4.5 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Intel® Trusted Execution technology (TXT) | ||
Secure Boot | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel SSE4.1, Intel SSE4.2, Intel AVX2 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |