AMD Ryzen 5 1600 AF vs Intel Xeon E5-2650 v4
Comparative analysis of AMD Ryzen 5 1600 AF and Intel Xeon E5-2650 v4 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: 3DMark Fire Strike - Physics Score, PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the AMD Ryzen 5 1600 AF
- Around 24% higher clock speed: 3.6 GHz vs 2.90 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 12 nm vs 14 nm
- Around 62% lower typical power consumption: 65 Watt vs 105 Watt
Maximum frequency | 3.6 GHz vs 2.90 GHz |
Manufacturing process technology | 12 nm vs 14 nm |
Thermal Design Power (TDP) | 65 Watt vs 105 Watt |
Reasons to consider the Intel Xeon E5-2650 v4
- 6 more cores, run more applications at once: 12 vs 6
- 12 more threads: 24 vs 12
- 24x more maximum memory size: 1.5 TB vs 64 GB
Number of cores | 12 vs 6 |
Number of threads | 24 vs 12 |
Maximum memory size | 1.5 TB vs 64 GB |
Compare benchmarks
CPU 1: AMD Ryzen 5 1600 AF
CPU 2: Intel Xeon E5-2650 v4
Name | AMD Ryzen 5 1600 AF | Intel Xeon E5-2650 v4 |
---|---|---|
3DMark Fire Strike - Physics Score | 3319 | |
PassMark - Single thread mark | 1707 | |
PassMark - CPU mark | 22929 | |
Geekbench 4 - Single Core | 2672 | |
Geekbench 4 - Multi-Core | 8676 |
Compare specifications (specs)
AMD Ryzen 5 1600 AF | Intel Xeon E5-2650 v4 | |
---|---|---|
Essentials |
||
Architecture codename | Zen+ | Broadwell |
Launch date | Q1'2020 | Q1'16 |
OPN Tray | YD1600BBAFBOX | |
Place in performance rating | 1997 | 841 |
Vertical segment | Desktop | Server |
Processor Number | E5-2650V4 | |
Series | Intel® Xeon® Processor E5 v4 Family | |
Status | Launched | |
Performance |
||
Base frequency | 3.2 GHz | 2.20 GHz |
L3 cache | 16 MB | |
Manufacturing process technology | 12 nm | 14 nm |
Maximum frequency | 3.6 GHz | 2.90 GHz |
Number of cores | 6 | 12 |
Number of threads | 12 | 24 |
64 bit support | ||
Bus Speed | 9.6 GT/s QPI | |
Maximum core temperature | 80°C | |
Number of QPI Links | 2 | |
VID voltage range | 0 | |
Memory |
||
Max memory channels | 2 | 4 |
Maximum memory bandwidth | 39.74 GB/s | 76.8 GB/s |
Maximum memory size | 64 GB | 1.5 TB |
Supported memory types | DDR4-2667 | DDR4 1600/1866/2133/2400 |
Compatibility |
||
Sockets supported | AM4 | FCLGA2011-3 |
Thermal Design Power (TDP) | 65 Watt | 105 Watt |
Low Halogen Options Available | ||
Max number of CPUs in a configuration | 2 | |
Package Size | 45mm x 52.5mm | |
Peripherals |
||
Max number of PCIe lanes | 20 | 40 |
PCI Express revision | 3.0 | |
PCIe configurations | x4, x8, x16 | |
Scalability | 2S | |
Security & Reliability |
||
Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® AVX2 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Physical Address Extensions (PAE) | 46-bit | |
Thermal Monitoring | ||
Virtualization |
||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |