AMD Ryzen 5 7540U vs AMD Ryzen 9 7940HS

Comparative analysis of AMD Ryzen 5 7540U and AMD Ryzen 9 7940HS processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.

AMD Ryzen 5 7540U

AMD Ryzen 9 7940HS

Differences

Reasons to consider the AMD Ryzen 5 7540U

CPU is newer: launch date 4 month(s) later
786432x more L2 cache, more data can be stored in the L2 cache for quick access later
1048576x more L3 cache, more data can be stored in the L3 cache for quick access later
Around 25% lower typical power consumption: 28 Watt vs 35 Watt

Launch date	3 May 2023 vs Jan 2023
L2 cache	1 MB (per core) vs 1MB (per core)
L3 cache	16 MB (shared) vs 16MB (shared)
Thermal Design Power (TDP)	28 Watt vs 35 Watt

Reasons to consider the AMD Ryzen 9 7940HS

2 more cores, run more applications at once: 8 vs 6
4 more threads: 16 vs 12
Around 6% higher clock speed: 5.2 GHz vs 4.9 GHz
Around 33% more L1 cache; more data can be stored in the L1 cache for quick access later
Around 8% better performance in PassMark - Single thread mark: 3901 vs 3617
Around 62% better performance in PassMark - CPU mark: 30351 vs 18743

Specifications (specs)
Number of cores	8 vs 6
Number of threads	16 vs 12
Maximum frequency	5.2 GHz vs 4.9 GHz
L1 cache	64K (per core) vs 64 KB (per core)
Benchmarks
PassMark - Single thread mark	3901 vs 3617
PassMark - CPU mark	30351 vs 18743

Compare benchmarks

CPU 1: AMD Ryzen 5 7540U
CPU 2: AMD Ryzen 9 7940HS

PassMark - Single thread mark

CPU 1

CPU 2

3617

3901

PassMark - CPU mark

CPU 1

CPU 2

18743

30351

Name	AMD Ryzen 5 7540U	AMD Ryzen 9 7940HS
PassMark - Single thread mark	3617	3901
PassMark - CPU mark	18743	30351
3DMark Fire Strike - Physics Score		7717

Compare specifications (specs)

	AMD Ryzen 5 7540U	AMD Ryzen 9 7940HS
Essentials
Launch date	3 May 2023	Jan 2023
Place in performance rating	345	341
Performance
Base frequency	3.2 GHz	4 GHz
Die size	178 mm²	178 mm²
L1 cache	64 KB (per core)	64K (per core)
L2 cache	1 MB (per core)	1MB (per core)
L3 cache	16 MB (shared)	16MB (shared)
Manufacturing process technology	4 nm	4 nm
Maximum core temperature	100°C	100°C
Maximum frequency	4.9 GHz	5.2 GHz
Number of cores	6	8
Number of threads	12	16
Transistor count	25,000 million	25,000 million
Unlocked
Memory
ECC memory support
Supported memory types	DDR5	DDR5-5600 MHz, Dual-channel
Compatibility
Configurable TDP	15-30 Watt	54 Watt
Max number of CPUs in a configuration	1	1
Sockets supported	FP7	FP8
Thermal Design Power (TDP)	28 Watt	35 Watt
Peripherals
PCIe configurations	Gen 4, 20 Lanes, (CPU only)	Gen 4, 20 Lanes, (CPU only)