AMD Ryzen 5 7540U vs AMD Ryzen 9 PRO 6950HS

Comparative analysis of AMD Ryzen 5 7540U and AMD Ryzen 9 PRO 6950HS processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Graphics, Graphics interfaces. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

AMD Ryzen 5 7540U

AMD Ryzen 9 PRO 6950HS

Differences

Reasons to consider the AMD Ryzen 5 7540U

CPU is newer: launch date 1 year(s) 0 month(s) later
Around 5% higher maximum core temperature: 100°C vs 95 °C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 4 nm vs 6 nm
Around 50% more L2 cache; more data can be stored in the L2 cache for quick access later
Around 25% lower typical power consumption: 28 Watt vs 35 Watt
Around 9% better performance in PassMark - Single thread mark: 3722 vs 3406

Specifications (specs)
Launch date	3 May 2023 vs 19 Apr 2022
Maximum core temperature	100°C vs 95 °C
Manufacturing process technology	4 nm vs 6 nm
L2 cache	1 MB (per core) vs 4 MB
Thermal Design Power (TDP)	28 Watt vs 35 Watt
Benchmarks
PassMark - Single thread mark	3722 vs 3406

Reasons to consider the AMD Ryzen 9 PRO 6950HS

2 more cores, run more applications at once: 8 vs 6
4 more threads: 16 vs 12
Around 33% more L1 cache; more data can be stored in the L1 cache for quick access later
Around 19% better performance in PassMark - CPU mark: 22797 vs 19213

Specifications (specs)
Number of cores	8 vs 6
Number of threads	16 vs 12
L1 cache	512 KB vs 64 KB (per core)
Benchmarks
PassMark - CPU mark	22797 vs 19213

Compare benchmarks

CPU 1: AMD Ryzen 5 7540U
CPU 2: AMD Ryzen 9 PRO 6950HS

PassMark - Single thread mark

CPU 1

CPU 2

3722

3406

PassMark - CPU mark

CPU 1

CPU 2

19213

22797

Name	AMD Ryzen 5 7540U	AMD Ryzen 9 PRO 6950HS
PassMark - Single thread mark	3722	3406
PassMark - CPU mark	19213	22797

Compare specifications (specs)

	AMD Ryzen 5 7540U	AMD Ryzen 9 PRO 6950HS
Essentials
Launch date	3 May 2023	19 Apr 2022
Place in performance rating	250	299
Architecture codename		Zen 3+
Vertical segment		Mobile
Performance
Base frequency	3.2 GHz	3.3 GHz
Die size	178 mm²	208 mm²
L1 cache	64 KB (per core)	512 KB
L2 cache	1 MB (per core)	4 MB
L3 cache	16 MB (shared)	16 MB
Manufacturing process technology	4 nm	6 nm
Maximum core temperature	100°C	95 °C
Maximum frequency	4.9 GHz	4.9 GHz
Number of cores	6	8
Number of threads	12	16
Transistor count	25,000 million
Unlocked
Memory
ECC memory support
Supported memory types	DDR5	DDR5-4800
Max memory channels		2
Compatibility
Configurable TDP	15-30 Watt
Max number of CPUs in a configuration	1	1
Sockets supported	FP7	FP7
Thermal Design Power (TDP)	28 Watt	35 Watt
Peripherals
PCIe configurations	Gen 4, 20 Lanes, (CPU only)
Max number of PCIe lanes		20
PCI Express revision		4.0
Graphics
Graphics max dynamic frequency		2400 MHz
Graphics interfaces
DisplayPort
HDMI