AMD Ryzen 5 7540U vs AMD Ryzen 9 PRO 6950H

Comparative analysis of AMD Ryzen 5 7540U and AMD Ryzen 9 PRO 6950H processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Graphics, Graphics interfaces. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the AMD Ryzen 5 7540U

  • CPU is newer: launch date 1 year(s) 0 month(s) later
  • Around 5% higher maximum core temperature: 100°C vs 95 °C
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 4 nm vs 6 nm
  • Around 50% more L2 cache; more data can be stored in the L2 cache for quick access later
  • Around 61% lower typical power consumption: 28 Watt vs 45 Watt
  • Around 8% better performance in PassMark - Single thread mark: 3579 vs 3313
Specifications (specs)
Launch date 3 May 2023 vs 19 Apr 2022
Maximum core temperature 100°C vs 95 °C
Manufacturing process technology 4 nm vs 6 nm
L2 cache 1 MB (per core) vs 4 MB
Thermal Design Power (TDP) 28 Watt vs 45 Watt
Benchmarks
PassMark - Single thread mark 3579 vs 3313

Reasons to consider the AMD Ryzen 9 PRO 6950H

  • 2 more cores, run more applications at once: 8 vs 6
  • 4 more threads: 16 vs 12
  • Around 33% more L1 cache; more data can be stored in the L1 cache for quick access later
  • Around 27% better performance in PassMark - CPU mark: 23674 vs 18680
Specifications (specs)
Number of cores 8 vs 6
Number of threads 16 vs 12
L1 cache 512 KB vs 64 KB (per core)
Benchmarks
PassMark - CPU mark 23674 vs 18680

Compare benchmarks

CPU 1: AMD Ryzen 5 7540U
CPU 2: AMD Ryzen 9 PRO 6950H

PassMark - Single thread mark
CPU 1
CPU 2
3579
3313
PassMark - CPU mark
CPU 1
CPU 2
18680
23674
Name AMD Ryzen 5 7540U AMD Ryzen 9 PRO 6950H
PassMark - Single thread mark 3579 3313
PassMark - CPU mark 18680 23674

Compare specifications (specs)

AMD Ryzen 5 7540U AMD Ryzen 9 PRO 6950H

Essentials

Launch date 3 May 2023 19 Apr 2022
Place in performance rating 351 392
Architecture codename Zen 3+
Vertical segment Mobile

Performance

Base frequency 3.2 GHz 3.3 GHz
Die size 178 mm² 208 mm²
L1 cache 64 KB (per core) 512 KB
L2 cache 1 MB (per core) 4 MB
L3 cache 16 MB (shared) 16 MB
Manufacturing process technology 4 nm 6 nm
Maximum core temperature 100°C 95 °C
Maximum frequency 4.9 GHz 4.9 GHz
Number of cores 6 8
Number of threads 12 16
Transistor count 25,000 million
Unlocked

Memory

ECC memory support
Supported memory types DDR5 DDR5-4800
Max memory channels 2

Compatibility

Configurable TDP 15-30 Watt
Max number of CPUs in a configuration 1 1
Sockets supported FP7 FP7
Thermal Design Power (TDP) 28 Watt 45 Watt

Peripherals

PCIe configurations Gen 4, 20 Lanes, (CPU only)
Max number of PCIe lanes 20
PCI Express revision 4.0

Graphics

Graphics max dynamic frequency 2400 MHz

Graphics interfaces

DisplayPort
HDMI