AMD Ryzen 5 7640HS vs Apple A16 Bionic

Comparative analysis of AMD Ryzen 5 7640HS and Apple A16 Bionic processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Graphics. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the AMD Ryzen 5 7640HS

  • CPU is newer: launch date 3 month(s) later
  • 6 more threads: 12 vs 6
  • Around 45% higher clock speed: 5 GHz vs 3.46 GHz
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 4 nm vs 5 nm
  • 341.3x more L1 cache, more data can be stored in the L1 cache for quick access later
  • 2.1x better performance in PassMark - CPU mark: 22998 vs 11066
Specifications (specs)
Launch date Jan 2023 vs 7 Sep 2022
Number of threads 12 vs 6
Maximum frequency 5 GHz vs 3.46 GHz
Manufacturing process technology 4 nm vs 5 nm
L1 cache 64K (per core) vs 192 KB instruction + 128 KB data (per core)
Benchmarks
PassMark - CPU mark 22998 vs 11066

Reasons to consider the Apple A16 Bionic

  • 2796202.7x more L2 cache, more data can be stored in the L2 cache for quick access later
  • Around 12% better performance in PassMark - Single thread mark: 4070 vs 3633
Specifications (specs)
L2 cache 16 MB (shared) vs 1MB (per core)
Benchmarks
PassMark - Single thread mark 4070 vs 3633

Compare benchmarks

CPU 1: AMD Ryzen 5 7640HS
CPU 2: Apple A16 Bionic

PassMark - Single thread mark
CPU 1
CPU 2
3633
4070
PassMark - CPU mark
CPU 1
CPU 2
22998
11066
Name AMD Ryzen 5 7640HS Apple A16 Bionic
PassMark - Single thread mark 3633 4070
PassMark - CPU mark 22998 11066

Compare specifications (specs)

AMD Ryzen 5 7640HS Apple A16 Bionic

Essentials

Launch date Jan 2023 7 Sep 2022
Place in performance rating 296 278
Architecture codename Everest/Sawtooth
OS Support iOS 16.0, iOS 16.4.1, iPadOS 16.4.1
Processor Number APL1W10
Vertical segment Mobile

Performance

Base frequency 4.3 GHz 2.02 GHz
Die size 178 mm²
L1 cache 64K (per core) 192 KB instruction + 128 KB data (per core)
L2 cache 1MB (per core) 16 MB (shared)
L3 cache 16MB (shared)
Manufacturing process technology 4 nm 5 nm
Maximum core temperature 100°C
Maximum frequency 5 GHz 3.46 GHz
Number of cores 6 6
Number of threads 12 6
Transistor count 25,000 million 16 billion
Unlocked

Memory

ECC memory support
Supported memory types DDR5-5600 MHz, Dual-channel LPDDR5-6400
Max memory channels 1
Maximum memory bandwidth 51.2 GB/s
Maximum memory size 6 GB

Compatibility

Configurable TDP 35-54 Watt
Max number of CPUs in a configuration 1
Sockets supported FP8
Thermal Design Power (TDP) 35 Watt

Peripherals

PCIe configurations Gen 4, 20 Lanes, (CPU only)

Graphics

Execution Units 20
Graphics base frequency 1398 MHz
iGPU core count 5