AMD Ryzen 5 7640U vs AMD Ryzen 7 7840HS

Comparative analysis of AMD Ryzen 5 7640U and AMD Ryzen 7 7840HS processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.

AMD Ryzen 5 7640U

AMD Ryzen 7 7840HS

Differences

Reasons to consider the AMD Ryzen 5 7640U

2.3x lower typical power consumption: 15 Watt vs 35 Watt

Thermal Design Power (TDP)	15 Watt vs 35 Watt

Reasons to consider the AMD Ryzen 7 7840HS

2 more cores, run more applications at once: 8 vs 6
4 more threads: 16 vs 12
Around 4% higher clock speed: 5.1 GHz vs 4.9 GHz
Around 33% more L1 cache; more data can be stored in the L1 cache for quick access later
Around 33% more L2 cache; more data can be stored in the L2 cache for quick access later
Around 7% better performance in PassMark - Single thread mark: 3784 vs 3522
Around 36% better performance in PassMark - CPU mark: 28902 vs 21177

Specifications (specs)
Number of cores	8 vs 6
Number of threads	16 vs 12
Maximum frequency	5.1 GHz vs 4.9 GHz
L1 cache	64K (per core) vs 64K (per core)
L2 cache	1MB (per core) vs 1MB (per core)
Benchmarks
PassMark - Single thread mark	3784 vs 3522
PassMark - CPU mark	28902 vs 21177

Compare benchmarks

CPU 1: AMD Ryzen 5 7640U
CPU 2: AMD Ryzen 7 7840HS

PassMark - Single thread mark

CPU 1

CPU 2

3522

3784

PassMark - CPU mark

CPU 1

CPU 2

21177

28902

Name	AMD Ryzen 5 7640U	AMD Ryzen 7 7840HS
PassMark - Single thread mark	3522	3784
PassMark - CPU mark	21177	28902
3DMark Fire Strike - Physics Score		7338

Compare specifications (specs)

	AMD Ryzen 5 7640U	AMD Ryzen 7 7840HS
Essentials
Launch date	Jan 2023	Jan 2023
Place in performance rating	352	394
Architecture codename		Zen 4
Performance
Base frequency	3.5 GHz	3.8 GHz
Die size	178 mm²	178 mm²
L1 cache	64K (per core)	64K (per core)
L2 cache	1MB (per core)	1MB (per core)
L3 cache	16MB (shared)	16MB (shared)
Manufacturing process technology	4 nm	4 nm
Maximum core temperature	100°C	100°C
Maximum frequency	4.9 GHz	5.1 GHz
Number of cores	6	8
Number of threads	12	16
Transistor count	25,000 million
Unlocked
Memory
ECC memory support
Supported memory types	DDR5-5600 MHz, Dual-channel	DDR5-5600 MHz, Dual-channel
Compatibility
Configurable TDP	28 Watt
Max number of CPUs in a configuration	1	1
Sockets supported	FP8	FP8
Thermal Design Power (TDP)	15 Watt	35 Watt
Peripherals
PCIe configurations	Gen 4, 20 Lanes, (CPU only)	Gen 4, 20 Lanes, (CPU only)