AMD Ryzen 5 PRO 3350GE vs Intel Pentium G2140
Comparative analysis of AMD Ryzen 5 PRO 3350GE and Intel Pentium G2140 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Advanced Technologies, Security & Reliability, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the AMD Ryzen 5 PRO 3350GE
- 2 more cores, run more applications at once: 4 vs 2
- 6 more threads: 8 vs 2
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 12 nm vs 22 nm
- Around 57% lower typical power consumption: 35 Watt vs 55 Watt
- Around 27% better performance in PassMark - Single thread mark: 2340 vs 1842
- 4.6x better performance in PassMark - CPU mark: 9643 vs 2092
Specifications (specs) | |
Number of cores | 4 vs 2 |
Number of threads | 8 vs 2 |
Manufacturing process technology | 12 nm vs 22 nm |
Thermal Design Power (TDP) | 35 Watt vs 55 Watt |
Benchmarks | |
PassMark - Single thread mark | 2340 vs 1842 |
PassMark - CPU mark | 9643 vs 2092 |
Compare benchmarks
CPU 1: AMD Ryzen 5 PRO 3350GE
CPU 2: Intel Pentium G2140
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD Ryzen 5 PRO 3350GE | Intel Pentium G2140 |
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PassMark - Single thread mark | 2340 | 1842 |
PassMark - CPU mark | 9643 | 2092 |
Geekbench 4 - Single Core | 2964 | |
Geekbench 4 - Multi-Core | 4999 |
Compare specifications (specs)
AMD Ryzen 5 PRO 3350GE | Intel Pentium G2140 | |
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Essentials |
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Architecture codename | Zen+ | Ivy Bridge |
Launch date | 21 Jul 2020 | Q2'13 |
OPN Tray | YD335BC6M4MFH | |
Place in performance rating | 1012 | 1013 |
Vertical segment | Desktop | Desktop |
Processor Number | G2140 | |
Series | Intel® Pentium® Processor G Series | |
Status | Discontinued | |
Performance |
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Base frequency | 3.3 GHz | 3.30 GHz |
L1 cache | 384 KB | |
L2 cache | 2 MB | |
L3 cache | 4 MB | |
Manufacturing process technology | 12 nm | 22 nm |
Maximum core temperature | 95 °C | |
Maximum frequency | 3.9 GHz | |
Number of cores | 4 | 2 |
Number of GPU cores | 10 | |
Number of threads | 8 | 2 |
Unlocked | ||
64 bit support | ||
Bus Speed | 5 GT/s DMI | |
Memory |
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Max memory channels | 2 | 2 |
Supported memory types | DDR4-2933 | DDR3 1333/1600 |
Maximum memory bandwidth | 25.6 GB/s | |
Maximum memory size | 32 GB | |
Graphics |
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Graphics base frequency | 1200 MHz | 650 MHz |
iGPU core count | 10 | |
Processor graphics | Radeon Graphics | Intel HD Graphics |
Graphics max dynamic frequency | 1.05 GHz | |
Intel® Clear Video HD technology | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Graphics interfaces |
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DisplayPort | ||
HDMI | ||
Number of displays supported | 3 | |
Compatibility |
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Sockets supported | AM4 | FCLGA1155 |
Thermal Design Power (TDP) | 35 Watt | 55 Watt |
Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | |
Package Size | 37.5mm x 37.5mm | |
Thermal Solution | 2011C | |
Peripherals |
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PCI Express revision | 3.0 | 2.0 |
PCIe configurations | up to 1x16, 2x8, 1x8 & 2x4 | |
Advanced Technologies |
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AMD GuardMI technology | ||
Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® My WiFi technology | ||
Intel® Optane™ Memory Supported | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Security & Reliability |
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Anti-Theft technology | ||
Execute Disable Bit (EDB) | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |