AMD Ryzen 7 3700X vs Intel Pentium G3430

Comparative analysis of AMD Ryzen 7 3700X and Intel Pentium G3430 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Advanced Technologies, Virtualization, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Peripherals, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).

AMD Ryzen 7 3700X

Intel Pentium G3430

Differences

Reasons to consider the AMD Ryzen 7 3700X

CPU is newer: launch date 6 year(s) 2 month(s) later
Processor is unlocked, an unlocked multiplier allows for easier overclocking
10 more cores, run more applications at once: 12 vs 2
22 more threads: 24 vs 2
Around 52% higher clock speed: 5 GHz vs 3.3 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm vs 22 nm
9x more L1 cache, more data can be stored in the L1 cache for quick access later
12x more L2 cache, more data can be stored in the L2 cache for quick access later
Around 39% better performance in PassMark - Single thread mark: 2659 vs 1912
10.6x better performance in PassMark - CPU mark: 22528 vs 2127
Around 56% better performance in Geekbench 4 - Multi-Core: 8651 vs 5528

Specifications (specs)
Launch date	December 2019 vs September 2013
Unlocked	Unlocked vs Locked
Number of cores	12 vs 2
Number of threads	24 vs 2
Maximum frequency	5 GHz vs 3.3 GHz
Manufacturing process technology	7 nm vs 22 nm
L1 cache	96K (per core) vs 64 KB (per core)
L2 cache	512K (per core) vs 256 KB (per core)
Benchmarks
PassMark - Single thread mark	2659 vs 1912
PassMark - CPU mark	22528 vs 2127
Geekbench 4 - Multi-Core	8651 vs 5528

Reasons to consider the Intel Pentium G3430

98304x more L3 cache, more data can be stored in the L3 cache for quick access later
Around 98% lower typical power consumption: 53 Watt vs 105 Watt
2.6x better performance in Geekbench 4 - Single Core: 3295 vs 1253

Specifications (specs)
L3 cache	3072 KB (shared) vs 32MB
Thermal Design Power (TDP)	53 Watt vs 105 Watt
Benchmarks
Geekbench 4 - Single Core	3295 vs 1253

Compare benchmarks

CPU 1: AMD Ryzen 7 3700X
CPU 2: Intel Pentium G3430

PassMark - Single thread mark

CPU 1

CPU 2

2659

1912

PassMark - CPU mark

CPU 1

CPU 2

22528

2127

Geekbench 4 - Single Core

CPU 1

CPU 2

1253

3295

Geekbench 4 - Multi-Core

CPU 1

CPU 2

8651

5528

Name	AMD Ryzen 7 3700X	Intel Pentium G3430
PassMark - Single thread mark	2659	1912
PassMark - CPU mark	22528	2127
Geekbench 4 - Single Core	1253	3295
Geekbench 4 - Multi-Core	8651	5528
3DMark Fire Strike - Physics Score	6043
CompuBench 1.5 Desktop - Video Composition (Frames/s)	9.915
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s)	90.664

Compare specifications (specs)

	AMD Ryzen 7 3700X	Intel Pentium G3430
Essentials
Architecture codename	Zen 2	Haswell
Launch date	December 2019	September 2013
Place in performance rating	939	916
Vertical segment	Desktop	Desktop
Launch price (MSRP)		$116
Price now		$89.99
Processor Number		G3430
Series		Intel® Pentium® Processor G Series
Status		Discontinued
Value for money (0-100)		11.11
Performance
64 bit support
Base frequency	4.2 GHz	3.30 GHz
L1 cache	96K (per core)	64 KB (per core)
L2 cache	512K (per core)	256 KB (per core)
L3 cache	32MB	3072 KB (shared)
Manufacturing process technology	7 nm	22 nm
Maximum frequency	5 GHz	3.3 GHz
Number of cores	12	2
Number of threads	24	2
Transistor count	19,200 million	1400 million
Unlocked
Bus Speed		5 GT/s DMI2
Die size		177 mm
Maximum case temperature (TCase)		72 °C
Maximum core temperature		72°C
Memory
Supported memory types	DDR4	DDR3-1333/1600, DDR3L-1333/1600 @ 1.5V
ECC memory support
Max memory channels		2
Maximum memory bandwidth		25.6 GB/s
Maximum memory size		32 GB
Compatibility
Max number of CPUs in a configuration	1	1
Sockets supported	AM4	FCLGA1150
Thermal Design Power (TDP)	105 Watt	53 Watt
Low Halogen Options Available
Package Size		37.5mm x 37.5mm
Thermal Solution		PCG 2013C
Advanced Technologies
Fused Multiply-Add 3 (FMA3)
Intel® Advanced Vector Extensions (AVX)
Intel® Advanced Vector Extensions 2 (AVX2)
Intel® AES New Instructions
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions		Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® Hyper-Threading technology
Intel® Optane™ Memory Supported
Intel® Stable Image Platform Program (SIPP)
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Virtualization
AMD Virtualization (AMD-V™)
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
Graphics
Graphics base frequency		350 MHz
Graphics max dynamic frequency		1.10 GHz
Graphics max frequency		1.1 GHz
Intel® Clear Video HD technology
Intel® Quick Sync Video
Max video memory		1.7 GB
Processor graphics		Intel HD Graphics
Graphics interfaces
DisplayPort
DVI
eDP
HDMI
Number of displays supported		3
VGA
Graphics image quality
Max resolution over DisplayPort		2560x1600@60Hz
Max resolution over eDP		2560x1600@60Hz
Max resolution over HDMI 1.4		1920x1080@60Hz
Max resolution over VGA		1920x1200@60Hz
Graphics API support
DirectX		11.1/12
OpenGL		4.3
Peripherals
Max number of PCIe lanes		16
PCI Express revision		Up to 3.0
PCIe configurations		Up to 1x16, 2x8, 1x8+2x4
Scalability		1S Only
Security & Reliability
Execute Disable Bit (EDB)
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)