AMD Ryzen 7 3700X vs Intel Pentium G3430

Comparative analysis of AMD Ryzen 7 3700X and Intel Pentium G3430 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Advanced Technologies, Virtualization, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Peripherals, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).

 

Differences

Reasons to consider the AMD Ryzen 7 3700X

  • CPU is newer: launch date 6 year(s) 2 month(s) later
  • Processor is unlocked, an unlocked multiplier allows for easier overclocking
  • 10 more cores, run more applications at once: 12 vs 2
  • 22 more threads: 24 vs 2
  • Around 52% higher clock speed: 5 GHz vs 3.3 GHz
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm vs 22 nm
  • 9x more L1 cache, more data can be stored in the L1 cache for quick access later
  • 12x more L2 cache, more data can be stored in the L2 cache for quick access later
  • Around 39% better performance in PassMark - Single thread mark: 2660 vs 1912
  • 10.6x better performance in PassMark - CPU mark: 22541 vs 2127
  • Around 56% better performance in Geekbench 4 - Multi-Core: 8651 vs 5528
Specifications (specs)
Launch date December 2019 vs September 2013
Unlocked Unlocked vs Locked
Number of cores 12 vs 2
Number of threads 24 vs 2
Maximum frequency 5 GHz vs 3.3 GHz
Manufacturing process technology 7 nm vs 22 nm
L1 cache 96K (per core) vs 64 KB (per core)
L2 cache 512K (per core) vs 256 KB (per core)
Benchmarks
PassMark - Single thread mark 2660 vs 1912
PassMark - CPU mark 22541 vs 2127
Geekbench 4 - Multi-Core 8651 vs 5528

Reasons to consider the Intel Pentium G3430

  • 98304x more L3 cache, more data can be stored in the L3 cache for quick access later
  • Around 98% lower typical power consumption: 53 Watt vs 105 Watt
  • 2.6x better performance in Geekbench 4 - Single Core: 3295 vs 1253
Specifications (specs)
L3 cache 3072 KB (shared) vs 32MB
Thermal Design Power (TDP) 53 Watt vs 105 Watt
Benchmarks
Geekbench 4 - Single Core 3295 vs 1253

Compare benchmarks

CPU 1: AMD Ryzen 7 3700X
CPU 2: Intel Pentium G3430

PassMark - Single thread mark
CPU 1
CPU 2
2660
1912
PassMark - CPU mark
CPU 1
CPU 2
22541
2127
Geekbench 4 - Single Core
CPU 1
CPU 2
1253
3295
Geekbench 4 - Multi-Core
CPU 1
CPU 2
8651
5528
Name AMD Ryzen 7 3700X Intel Pentium G3430
PassMark - Single thread mark 2660 1912
PassMark - CPU mark 22541 2127
Geekbench 4 - Single Core 1253 3295
Geekbench 4 - Multi-Core 8651 5528
3DMark Fire Strike - Physics Score 6043
CompuBench 1.5 Desktop - Video Composition (Frames/s) 9.915
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) 90.664

Compare specifications (specs)

AMD Ryzen 7 3700X Intel Pentium G3430

Essentials

Architecture codename Zen 2 Haswell
Launch date December 2019 September 2013
Place in performance rating 938 917
Vertical segment Desktop Desktop
Launch price (MSRP) $116
Price now $89.99
Processor Number G3430
Series Intel® Pentium® Processor G Series
Status Discontinued
Value for money (0-100) 11.11

Performance

64 bit support
Base frequency 4.2 GHz 3.30 GHz
L1 cache 96K (per core) 64 KB (per core)
L2 cache 512K (per core) 256 KB (per core)
L3 cache 32MB 3072 KB (shared)
Manufacturing process technology 7 nm 22 nm
Maximum frequency 5 GHz 3.3 GHz
Number of cores 12 2
Number of threads 24 2
Transistor count 19,200 million 1400 million
Unlocked
Bus Speed 5 GT/s DMI2
Die size 177 mm
Maximum case temperature (TCase) 72 °C
Maximum core temperature 72°C

Memory

Supported memory types DDR4 DDR3-1333/1600, DDR3L-1333/1600 @ 1.5V
ECC memory support
Max memory channels 2
Maximum memory bandwidth 25.6 GB/s
Maximum memory size 32 GB

Compatibility

Max number of CPUs in a configuration 1 1
Sockets supported AM4 FCLGA1150
Thermal Design Power (TDP) 105 Watt 53 Watt
Low Halogen Options Available
Package Size 37.5mm x 37.5mm
Thermal Solution PCG 2013C

Advanced Technologies

Fused Multiply-Add 3 (FMA3)
Intel® Advanced Vector Extensions (AVX)
Intel® Advanced Vector Extensions 2 (AVX2)
Intel® AES New Instructions
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® Hyper-Threading technology
Intel® Optane™ Memory Supported
Intel® Stable Image Platform Program (SIPP)
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring

Virtualization

AMD Virtualization (AMD-V™)
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)

Graphics

Graphics base frequency 350 MHz
Graphics max dynamic frequency 1.10 GHz
Graphics max frequency 1.1 GHz
Intel® Clear Video HD technology
Intel® Quick Sync Video
Max video memory 1.7 GB
Processor graphics Intel HD Graphics

Graphics interfaces

DisplayPort
DVI
eDP
HDMI
Number of displays supported 3
VGA

Graphics image quality

Max resolution over DisplayPort 2560x1600@60Hz
Max resolution over eDP 2560x1600@60Hz
Max resolution over HDMI 1.4 1920x1080@60Hz
Max resolution over VGA 1920x1200@60Hz

Graphics API support

DirectX 11.1/12
OpenGL 4.3

Peripherals

Max number of PCIe lanes 16
PCI Express revision Up to 3.0
PCIe configurations Up to 1x16, 2x8, 1x8+2x4
Scalability 1S Only

Security & Reliability

Execute Disable Bit (EDB)
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)