AMD Ryzen 7 5700X vs Intel Xeon W-1290
Comparative analysis of AMD Ryzen 7 5700X and Intel Xeon W-1290 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Advanced Technologies, Virtualization, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.
Differences
Reasons to consider the AMD Ryzen 7 5700X
- Processor is unlocked, an unlocked multiplier allows for easier overclocking
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm vs 14 nm
- Around 60% more L3 cache; more data can be stored in the L3 cache for quick access later
- Around 23% lower typical power consumption: 65 Watt vs 80 Watt
- Around 10% better performance in PassMark - Single thread mark: 3383 vs 3086
- Around 33% better performance in PassMark - CPU mark: 26665 vs 20071
| Specifications (specs) | |
| Unlocked | Unlocked vs Locked |
| Manufacturing process technology | 7 nm vs 14 nm |
| L3 cache | 32 MB vs 20 MB |
| Thermal Design Power (TDP) | 65 Watt vs 80 Watt |
| Benchmarks | |
| PassMark - Single thread mark | 3383 vs 3086 |
| PassMark - CPU mark | 26665 vs 20071 |
Reasons to consider the Intel Xeon W-1290
- 2 more cores, run more applications at once: 10 vs 8
- 4 more threads: 20 vs 16
- Around 13% higher clock speed: 5.20 GHz vs 4.6 GHz
- Around 5% higher maximum core temperature: 100°C vs 95 °C
| Number of cores | 10 vs 8 |
| Number of threads | 20 vs 16 |
| Maximum frequency | 5.20 GHz vs 4.6 GHz |
| Maximum core temperature | 100°C vs 95 °C |
Compare benchmarks
CPU 1: AMD Ryzen 7 5700X
CPU 2: Intel Xeon W-1290
| PassMark - Single thread mark |
|
|
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| PassMark - CPU mark |
|
|
| Name | AMD Ryzen 7 5700X | Intel Xeon W-1290 |
|---|---|---|
| PassMark - Single thread mark | 3383 | 3086 |
| PassMark - CPU mark | 26665 | 20071 |
| 3DMark Fire Strike - Physics Score | 6919 |
Compare specifications (specs)
| AMD Ryzen 7 5700X | Intel Xeon W-1290 | |
|---|---|---|
Essentials |
||
| Architecture codename | Zen 3 | Comet Lake |
| Launch date | 4 Apr 2022 | Q2'20 |
| Launch price (MSRP) | $299 | $494 - $498 |
| OPN PIB | 100-100000926WOF | |
| OPN Tray | 100-000000926 | |
| Place in performance rating | 544 | 536 |
| Vertical segment | Desktop | Workstation |
| Processor Number | W-1290 | |
| Series | Intel Xeon W Processor | |
| Status | Launched | |
Performance |
||
| Base frequency | 3.4 GHz | 3.20 GHz |
| Die size | 81 mm² | |
| L1 cache | 512 KB | |
| L2 cache | 4 MB | |
| L3 cache | 32 MB | 20 MB |
| Manufacturing process technology | 7 nm | 14 nm |
| Maximum core temperature | 95 °C | 100°C |
| Maximum frequency | 4.6 GHz | 5.20 GHz |
| Number of cores | 8 | 10 |
| Number of threads | 16 | 20 |
| Transistor count | 4150 million | |
| Unlocked | ||
| 64 bit support | ||
| Bus Speed | 8 GT/s | |
Memory |
||
| ECC memory support | ||
| Max memory channels | 2 | 2 |
| Supported memory types | DDR4-3200 | DDR4-2933 |
| Maximum memory bandwidth | 45.8 GB/s | |
| Maximum memory size | 128 GB | |
Compatibility |
||
| Max number of CPUs in a configuration | 1 | 1 |
| Sockets supported | AM4 | FCLGA1200 |
| Thermal Design Power (TDP) | 65 Watt | 80 Watt |
| Package Size | 37.5mm x 37.5mm | |
| Thermal Solution | PCG 2015W | |
Peripherals |
||
| Max number of PCIe lanes | 20 | 16 |
| PCI Express revision | 4.0 | 3.0 |
| PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | |
| Scalability | 1S Only | |
Advanced Technologies |
||
| AMD SenseMI | ||
| AMD StoreMI technology | ||
| Fused Multiply-Add 3 (FMA3) | ||
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® Advanced Vector Extensions 2 (AVX2) | ||
| Intel® AES New Instructions | ||
| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Instruction set extensions | Intel SSE4.1, Intel SSE4.2, Intel AVX2 | |
| Intel 64 | ||
| Intel® Hyper-Threading technology | ||
| Intel® Optane™ Memory Supported | ||
| Intel® Thermal Velocity Boost | ||
| Intel® Turbo Boost technology | ||
| Thermal Monitoring | ||
Virtualization |
||
| AMD Virtualization (AMD-V™) | ||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
Graphics |
||
| Device ID | 0x9BC6 | |
| Graphics base frequency | 350 MHz | |
| Graphics max dynamic frequency | 1.20 GHz | |
| Intel® Clear Video HD technology | ||
| Intel® Clear Video technology | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
| Max video memory | 64 GB | |
| Processor graphics | Intel UHD Graphics P630 | |
Graphics interfaces |
||
| Number of displays supported | 3 | |
Graphics image quality |
||
| 4K resolution support | ||
| Max resolution over DisplayPort | 4096x2304@60Hz | |
| Max resolution over eDP | 4096x2304@60Hz | |
| Max resolution over HDMI 1.4 | 4096x2160@30Hz | |
Graphics API support |
||
| DirectX | 12 | |
| OpenGL | 4.5 | |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Identity Protection technology | ||
| Intel® OS Guard | ||
| Intel® Secure Key technology | ||
| Intel® Software Guard Extensions (Intel® SGX) | ||
| Intel® Trusted Execution technology (TXT) | ||
| Secure Boot | ||
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