AMD Ryzen 7 PRO 8840HS vs AMD Ryzen 7 7700

Comparative analysis of AMD Ryzen 7 PRO 8840HS and AMD Ryzen 7 7700 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.

AMD Ryzen 7 PRO 8840HS

AMD Ryzen 7 7700

Differences

Reasons to consider the AMD Ryzen 7 PRO 8840HS

CPU is newer: launch date 1 year(s) 3 month(s) later
Around 5% higher maximum core temperature: 100°C vs 95 °C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 4 nm vs 5 nm
2.3x lower typical power consumption: 28 Watt vs 65 Watt

Launch date	16 Apr 2024 vs 14 Jan 2023
Maximum core temperature	100°C vs 95 °C
Manufacturing process technology	4 nm vs 5 nm
Thermal Design Power (TDP)	28 Watt vs 65 Watt

Reasons to consider the AMD Ryzen 7 7700

Processor is unlocked, an unlocked multiplier allows for easier overclocking
Around 4% higher clock speed: 5.3 GHz vs 5.1 GHz
2x more L3 cache, more data can be stored in the L3 cache for quick access later
Around 9% better performance in PassMark - Single thread mark: 4063 vs 3712
Around 27% better performance in PassMark - CPU mark: 34481 vs 27098

Specifications (specs)
Unlocked	Unlocked vs Locked
Maximum frequency	5.3 GHz vs 5.1 GHz
L3 cache	32 MB vs 16 MB (shared)
Benchmarks
PassMark - Single thread mark	4063 vs 3712
PassMark - CPU mark	34481 vs 27098

Compare benchmarks

CPU 1: AMD Ryzen 7 PRO 8840HS
CPU 2: AMD Ryzen 7 7700

PassMark - Single thread mark

CPU 1

CPU 2

3712

4063

PassMark - CPU mark

CPU 1

CPU 2

27098

34481

Name	AMD Ryzen 7 PRO 8840HS	AMD Ryzen 7 7700
PassMark - Single thread mark	3712	4063
PassMark - CPU mark	27098	34481
3DMark Fire Strike - Physics Score		8515

Compare specifications (specs)

	AMD Ryzen 7 PRO 8840HS	AMD Ryzen 7 7700
Essentials
Launch date	16 Apr 2024	14 Jan 2023
Place in performance rating	234	236
Architecture codename		Zen 4
Launch price (MSRP)		$329
OPN Tray		100-000000592
Vertical segment		Desktop
Performance
Base frequency	3.3 GHz	3.8 GHz
Die size	178 mm²	70 mm²
L1 cache	64 KB (per core)	512 KB
L2 cache	1 MB (per core)	8 MB
L3 cache	16 MB (shared)	32 MB
Manufacturing process technology	4 nm	5 nm
Maximum core temperature	100°C	95 °C
Maximum frequency	5.1 GHz	5.3 GHz
Number of cores	8	8
Number of threads	16	16
Transistor count	25,000 million	6570 million
Unlocked
Maximum case temperature (TCase)		61 °C
Memory
ECC memory support
Supported memory types	DDR5	DDR5-5200
Max memory channels		2
Compatibility
Configurable TDP	20-30 Watt
Max number of CPUs in a configuration	1	1
Sockets supported	FP7	AM5
Thermal Design Power (TDP)	28 Watt	65 Watt
Peripherals
PCIe configurations	Gen 4, 20 Lanes, (CPU only)
Max number of PCIe lanes		24
PCI Express revision		5.0
Advanced Technologies
Enhanced Virus Protection (EVP)
Fused Multiply-Add 3 (FMA3)
Intel® Advanced Vector Extensions (AVX)
Intel® Advanced Vector Extensions 2 (AVX2)
Intel® AES New Instructions
Virtualization
AMD Virtualization (AMD-V™)