AMD Ryzen 9 6900HS vs AMD Ryzen Embedded V2748

Comparative analysis of AMD Ryzen 9 6900HS and AMD Ryzen Embedded V2748 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Compatibility, Peripherals, Advanced Technologies, Virtualization, Graphics interfaces, Graphics image quality. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.

AMD Ryzen 9 6900HS

AMD Ryzen Embedded V2748

Differences

Reasons to consider the AMD Ryzen 9 6900HS

CPU is newer: launch date 1 year(s) 1 month(s) later
Around 15% higher clock speed: 4.9 GHz vs 4.25 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 6 nm vs 7 nm
2x more L3 cache, more data can be stored in the L3 cache for quick access later
Around 29% lower typical power consumption: 35 Watt vs 45 Watt
Around 23% better performance in PassMark - Single thread mark: 3298 vs 2680
Around 42% better performance in PassMark - CPU mark: 23712 vs 16706

Specifications (specs)
Launch date	Jan 2022 vs 10 Nov 2020
Maximum frequency	4.9 GHz vs 4.25 GHz
Manufacturing process technology	6 nm vs 7 nm
L3 cache	16 MB vs 8 MB
Thermal Design Power (TDP)	35 Watt vs 45 Watt
Benchmarks
PassMark - Single thread mark	3298 vs 2680
PassMark - CPU mark	23712 vs 16706

Reasons to consider the AMD Ryzen Embedded V2748

Around 11% higher maximum core temperature: 105 °C vs 95 °C

Maximum core temperature	105 °C vs 95 °C

Compare benchmarks

CPU 1: AMD Ryzen 9 6900HS
CPU 2: AMD Ryzen Embedded V2748

PassMark - Single thread mark

CPU 1

CPU 2

3298

2680

PassMark - CPU mark

CPU 1

CPU 2

23712

16706

Name	AMD Ryzen 9 6900HS	AMD Ryzen Embedded V2748
PassMark - Single thread mark	3298	2680
PassMark - CPU mark	23712	16706
3DMark Fire Strike - Physics Score	6852

Compare specifications (specs)

	AMD Ryzen 9 6900HS	AMD Ryzen Embedded V2748
Essentials
Architecture codename	Zen 3+	Zen 2
Launch date	Jan 2022	10 Nov 2020
Place in performance rating	607	644
Vertical segment	Mobile
OPN Tray		100-000000245
Performance
Base frequency	3.3 GHz	2.9 GHz
Die size	208 mm²
L1 cache	512 KB	512 KB
L2 cache	4 MB	4 MB
L3 cache	16 MB	8 MB
Manufacturing process technology	6 nm	7 nm
Maximum core temperature	95 °C	105 °C
Maximum frequency	4.9 GHz	4.25 GHz
Number of cores	8	8
Number of threads	16	16
Unlocked
Memory
ECC memory support
Max memory channels	2	2
Supported memory types	DDR5-4800	DDR4-3200, LPDDR4x-4266
Maximum memory bandwidth		63.58 GB/s
Maximum memory size		64 GB
Graphics
Graphics max frequency	2400 MHz	1600 MHz
iGPU core count		7
Number of pipelines		448
Processor graphics		Radeon Vega 7
Compatibility
Sockets supported	FP7	FP6
Thermal Design Power (TDP)	35 Watt	45 Watt
Configurable TDP		35-54 Watt
Max number of CPUs in a configuration		1
Peripherals
Max number of PCIe lanes	20	20
PCI Express revision	4.0	3.0
Advanced Technologies
AMD SenseMI
AMD StoreMI technology
Fused Multiply-Add 3 (FMA3)
Intel® Advanced Vector Extensions (AVX)
Intel® Advanced Vector Extensions 2 (AVX2)
Intel® AES New Instructions
Virtualization
AMD Virtualization (AMD-V™)
Graphics interfaces
DisplayPort
HDMI
Number of displays supported		4
Graphics image quality
Max resolution over DisplayPort		4096x2160
Max resolution over HDMI 1.4		4096x2160