AMD Ryzen 9 6900HS vs Intel Core i7-10700TE
Comparative analysis of AMD Ryzen 9 6900HS and Intel Core i7-10700TE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Compatibility, Peripherals, Advanced Technologies, Virtualization, Graphics interfaces, Graphics image quality, Graphics API support, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.
Differences
Reasons to consider the AMD Ryzen 9 6900HS
- CPU is newer: launch date 1 year(s) 8 month(s) later
- Around 11% higher clock speed: 4.9 GHz vs 4.40 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 6 nm vs 14 nm
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 27% better performance in PassMark - Single thread mark: 3298 vs 2594
- Around 77% better performance in PassMark - CPU mark: 23712 vs 13368
| Specifications (specs) | |
| Launch date | Jan 2022 vs 30 Apr 2020 |
| Maximum frequency | 4.9 GHz vs 4.40 GHz |
| Manufacturing process technology | 6 nm vs 14 nm |
| L2 cache | 4 MB vs 2 MB |
| Benchmarks | |
| PassMark - Single thread mark | 3298 vs 2594 |
| PassMark - CPU mark | 23712 vs 13368 |
Reasons to consider the Intel Core i7-10700TE
- Around 5% higher maximum core temperature: 100°C vs 95 °C
| Maximum core temperature | 100°C vs 95 °C |
Compare benchmarks
CPU 1: AMD Ryzen 9 6900HS
CPU 2: Intel Core i7-10700TE
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | AMD Ryzen 9 6900HS | Intel Core i7-10700TE |
|---|---|---|
| PassMark - Single thread mark | 3298 | 2594 |
| PassMark - CPU mark | 23712 | 13368 |
| 3DMark Fire Strike - Physics Score | 6852 |
Compare specifications (specs)
| AMD Ryzen 9 6900HS | Intel Core i7-10700TE | |
|---|---|---|
Essentials |
||
| Architecture codename | Zen 3+ | Comet Lake |
| Launch date | Jan 2022 | 30 Apr 2020 |
| Place in performance rating | 607 | 728 |
| Vertical segment | Mobile | Embedded |
| Launch price (MSRP) | $330 | |
| Processor Number | i7-10700TE | |
| Series | 10th Generation Intel Core i7 Processors | |
| Status | Launched | |
Performance |
||
| Base frequency | 3.3 GHz | 2.00 GHz |
| Die size | 208 mm² | |
| L1 cache | 512 KB | 512 KB |
| L2 cache | 4 MB | 2 MB |
| L3 cache | 16 MB | 16 MB |
| Manufacturing process technology | 6 nm | 14 nm |
| Maximum core temperature | 95 °C | 100°C |
| Maximum frequency | 4.9 GHz | 4.40 GHz |
| Number of cores | 8 | 8 |
| Number of threads | 16 | 16 |
| Unlocked | ||
| 64 bit support | ||
| Bus Speed | 8 GT/s | |
Memory |
||
| ECC memory support | ||
| Max memory channels | 2 | 2 |
| Supported memory types | DDR5-4800 | DDR4-2933 |
| Maximum memory bandwidth | 45.8 GB/s | |
| Maximum memory size | 128 GB | |
Graphics |
||
| Graphics max frequency | 2400 MHz | |
| Device ID | 0x9BC5 | |
| Graphics base frequency | 350 MHz | |
| Graphics max dynamic frequency | 1.15 GHz | |
| Intel® Clear Video HD technology | ||
| Intel® Clear Video technology | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
| Max video memory | 64 GB | |
| Processor graphics | Intel UHD Graphics 630 | |
Compatibility |
||
| Sockets supported | FP7 | FCLGA1200 |
| Thermal Design Power (TDP) | 35 Watt | 35 Watt |
| Max number of CPUs in a configuration | 1 | |
| Package Size | 37.5mm x 37.5mm | |
| Thermal Solution | PCG 2015B | |
Peripherals |
||
| Max number of PCIe lanes | 20 | 16 |
| PCI Express revision | 4.0 | 3.0 |
| PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | |
| Scalability | 1S Only | |
Advanced Technologies |
||
| AMD SenseMI | ||
| AMD StoreMI technology | ||
| Fused Multiply-Add 3 (FMA3) | ||
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® Advanced Vector Extensions 2 (AVX2) | ||
| Intel® AES New Instructions | ||
| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Instruction set extensions | Intel SSE4.1, Intel SSE4.2, Intel AVX2 | |
| Intel 64 | ||
| Intel® Hyper-Threading technology | ||
| Intel® Stable Image Platform Program (SIPP) | ||
| Intel® Turbo Boost technology | ||
| Thermal Monitoring | ||
Virtualization |
||
| AMD Virtualization (AMD-V™) | ||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
Graphics interfaces |
||
| DisplayPort | ||
| DVI | ||
| eDP | ||
| HDMI | ||
| Number of displays supported | 3 | |
Graphics image quality |
||
| 4K resolution support | ||
| Max resolution over DisplayPort | 4096 x 2304@60Hz | |
| Max resolution over eDP | 4096 x 2304@60Hz | |
Graphics API support |
||
| DirectX | 12 | |
| OpenGL | 4.5 | |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Identity Protection technology | ||
| Intel® OS Guard | ||
| Intel® Secure Key technology | ||
| Intel® Software Guard Extensions (Intel® SGX) | ||
| Intel® Trusted Execution technology (TXT) | ||
| Secure Boot | ||
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