AMD Ryzen 9 7950X3D vs AMD Ryzen 9 7950X
Comparative analysis of AMD Ryzen 9 7950X3D and AMD Ryzen 9 7950X processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.
Differences
Reasons to consider the AMD Ryzen 9 7950X3D
- 2x more L3 cache, more data can be stored in the L3 cache for quick access later
- Around 42% lower typical power consumption: 120 Watt vs 170 Watt
| L3 cache | 128 MB vs 64 MB |
| Thermal Design Power (TDP) | 120 Watt vs 170 Watt |
Reasons to consider the AMD Ryzen 9 7950X
- CPU is newer: launch date 3 month(s) later
- Around 12% higher maximum core temperature: 100 °C vs 89 °C
- Around 3% better performance in PassMark - Single thread mark: 4271 vs 4149
- Around 10% better performance in 3DMark Fire Strike - Physics Score: 15686 vs 14290
| Specifications (specs) | |
| Launch date | 4 Jan 2023 vs 27 Sep 2022 |
| Maximum core temperature | 100 °C vs 89 °C |
| Benchmarks | |
| PassMark - Single thread mark | 4271 vs 4149 |
| PassMark - CPU mark | 62567 vs 62439 |
| 3DMark Fire Strike - Physics Score | 15686 vs 14290 |
Compare benchmarks
CPU 1: AMD Ryzen 9 7950X3D
CPU 2: AMD Ryzen 9 7950X
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| 3DMark Fire Strike - Physics Score |
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| Name | AMD Ryzen 9 7950X3D | AMD Ryzen 9 7950X |
|---|---|---|
| PassMark - Single thread mark | 4149 | 4271 |
| PassMark - CPU mark | 62439 | 62567 |
| 3DMark Fire Strike - Physics Score | 14290 | 15686 |
Compare specifications (specs)
| AMD Ryzen 9 7950X3D | AMD Ryzen 9 7950X | |
|---|---|---|
Essentials |
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| Architecture codename | Zen 4 | Zen 4 |
| Launch date | 27 Sep 2022 | 4 Jan 2023 |
| OPN Tray | 100-000000908 | 100-000000514 |
| Place in performance rating | 55 | 38 |
| Vertical segment | Desktop | Desktop |
| Launch price (MSRP) | $699 | |
Performance |
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| Base frequency | 4.2 GHz | 4.5 GHz |
| Die size | 71 mm² | 70 mm² |
| L1 cache | 1 MB | 1 MB |
| L2 cache | 16 MB | 16 MB |
| L3 cache | 128 MB | 64 MB |
| Manufacturing process technology | 5 nm | 5 nm |
| Maximum case temperature (TCase) | 47 °C | 47 °C |
| Maximum core temperature | 89 °C | 100 °C |
| Maximum frequency | 5.7 GHz | 5.7 GHz |
| Number of cores | 16 | 16 |
| Number of threads | 32 | 32 |
| Transistor count | 13140 million | 13140 million |
| Unlocked | ||
Memory |
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| ECC memory support | ||
| Max memory channels | 2 | 2 |
| Supported memory types | DDR5-5200 | DDR5-5200 |
Compatibility |
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| Max number of CPUs in a configuration | 1 | 1 |
| Sockets supported | AM5 | AM5 |
| Thermal Design Power (TDP) | 120 Watt | 170 Watt |
Peripherals |
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| Max number of PCIe lanes | 24 | 24 |
| PCI Express revision | 5.0 | 5.0 |
Advanced Technologies |
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| Enhanced Virus Protection (EVP) | ||
| Fused Multiply-Add 3 (FMA3) | ||
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® Advanced Vector Extensions 2 (AVX2) | ||
| Intel® AES New Instructions | ||
Virtualization |
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| AMD Virtualization (AMD-V™) | ||
