AMD Ryzen 9 7950X3D vs AMD Ryzen 9 7950X
Comparative analysis of AMD Ryzen 9 7950X3D and AMD Ryzen 9 7950X processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.
Differences
Reasons to consider the AMD Ryzen 9 7950X3D
- 2x more L3 cache, more data can be stored in the L3 cache for quick access later
- Around 42% lower typical power consumption: 120 Watt vs 170 Watt
L3 cache | 128 MB vs 64 MB |
Thermal Design Power (TDP) | 120 Watt vs 170 Watt |
Reasons to consider the AMD Ryzen 9 7950X
- CPU is newer: launch date 3 month(s) later
- Around 12% higher maximum core temperature: 100 °C vs 89 °C
- Around 3% better performance in PassMark - Single thread mark: 4275 vs 4149
- Around 10% better performance in 3DMark Fire Strike - Physics Score: 15782 vs 14319
Specifications (specs) | |
Launch date | 4 Jan 2023 vs 27 Sep 2022 |
Maximum core temperature | 100 °C vs 89 °C |
Benchmarks | |
PassMark - Single thread mark | 4275 vs 4149 |
PassMark - CPU mark | 62684 vs 62502 |
3DMark Fire Strike - Physics Score | 15782 vs 14319 |
Compare benchmarks
CPU 1: AMD Ryzen 9 7950X3D
CPU 2: AMD Ryzen 9 7950X
PassMark - Single thread mark |
|
|
||||
PassMark - CPU mark |
|
|
||||
3DMark Fire Strike - Physics Score |
|
|
Name | AMD Ryzen 9 7950X3D | AMD Ryzen 9 7950X |
---|---|---|
PassMark - Single thread mark | 4149 | 4275 |
PassMark - CPU mark | 62502 | 62684 |
3DMark Fire Strike - Physics Score | 14319 | 15782 |
Compare specifications (specs)
AMD Ryzen 9 7950X3D | AMD Ryzen 9 7950X | |
---|---|---|
Essentials |
||
Architecture codename | Zen 4 | Zen 4 |
Launch date | 27 Sep 2022 | 4 Jan 2023 |
OPN Tray | 100-000000908 | 100-000000514 |
Place in performance rating | 58 | 44 |
Vertical segment | Desktop | Desktop |
Launch price (MSRP) | $699 | |
Performance |
||
Base frequency | 4.2 GHz | 4.5 GHz |
Die size | 71 mm² | 70 mm² |
L1 cache | 1 MB | 1 MB |
L2 cache | 16 MB | 16 MB |
L3 cache | 128 MB | 64 MB |
Manufacturing process technology | 5 nm | 5 nm |
Maximum case temperature (TCase) | 47 °C | 47 °C |
Maximum core temperature | 89 °C | 100 °C |
Maximum frequency | 5.7 GHz | 5.7 GHz |
Number of cores | 16 | 16 |
Number of threads | 32 | 32 |
Transistor count | 13140 million | 13140 million |
Unlocked | ||
Memory |
||
ECC memory support | ||
Max memory channels | 2 | 2 |
Supported memory types | DDR5-5200 | DDR5-5200 |
Compatibility |
||
Max number of CPUs in a configuration | 1 | 1 |
Sockets supported | AM5 | AM5 |
Thermal Design Power (TDP) | 120 Watt | 170 Watt |
Peripherals |
||
Max number of PCIe lanes | 24 | 24 |
PCI Express revision | 5.0 | 5.0 |
Advanced Technologies |
||
Enhanced Virus Protection (EVP) | ||
Fused Multiply-Add 3 (FMA3) | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® Advanced Vector Extensions 2 (AVX2) | ||
Intel® AES New Instructions | ||
Virtualization |
||
AMD Virtualization (AMD-V™) |