AMD Ryzen Embedded R2514 vs AMD Ryzen 5 PRO 4655G

Comparative analysis of AMD Ryzen Embedded R2514 and AMD Ryzen 5 PRO 4655G processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the AMD Ryzen Embedded R2514

  • 4.3x lower typical power consumption: 15 Watt vs 65 Watt
Thermal Design Power (TDP) 15 Watt vs 65 Watt

Reasons to consider the AMD Ryzen 5 PRO 4655G

  • CPU is newer: launch date 1 month(s) later
  • 2 more cores, run more applications at once: 6 vs 4
  • 4 more threads: 12 vs 8
  • Around 14% higher clock speed: 4.2 GHz vs 3.7 GHz
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm vs 12 nm
  • Around 50% more L2 cache; more data can be stored in the L2 cache for quick access later
  • 2x more L3 cache, more data can be stored in the L3 cache for quick access later
  • Around 36% better performance in PassMark - Single thread mark: 2696 vs 1979
  • 2.4x better performance in PassMark - CPU mark: 16355 vs 6821
Specifications (specs)
Launch date 11 Nov 2022 vs 30 Sep 2022
Number of cores 6 vs 4
Number of threads 12 vs 8
Maximum frequency 4.2 GHz vs 3.7 GHz
Manufacturing process technology 7 nm vs 12 nm
L2 cache 512 KB (per core) vs 512 KB (per core)
L3 cache 8 MB (shared) vs 4 MB (shared)
Benchmarks
PassMark - Single thread mark 2696 vs 1979
PassMark - CPU mark 16355 vs 6821

Compare benchmarks

CPU 1: AMD Ryzen Embedded R2514
CPU 2: AMD Ryzen 5 PRO 4655G

PassMark - Single thread mark
CPU 1
CPU 2
1979
2696
PassMark - CPU mark
CPU 1
CPU 2
6821
16355
Name AMD Ryzen Embedded R2514 AMD Ryzen 5 PRO 4655G
PassMark - Single thread mark 1979 2696
PassMark - CPU mark 6821 16355

Compare specifications (specs)

AMD Ryzen Embedded R2514 AMD Ryzen 5 PRO 4655G

Essentials

Launch date 30 Sep 2022 11 Nov 2022
Place in performance rating 1238 743

Performance

Base frequency 2.1 GHz 3.7 GHz
Die size 210 mm² 156 mm²
L1 cache 96 KB (per core) 64 KB (per core)
L2 cache 512 KB (per core) 512 KB (per core)
L3 cache 4 MB (shared) 8 MB (shared)
Manufacturing process technology 12 nm 7 nm
Maximum core temperature 105°C
Maximum frequency 3.7 GHz 4.2 GHz
Number of cores 4 6
Number of threads 8 12
Transistor count 4,940 million 9,800 million
Unlocked
Maximum case temperature (TCase) 95°C

Memory

ECC memory support
Supported memory types DDR4 DDR4

Compatibility

Configurable TDP 12-35 Watt 45 Watt
Max number of CPUs in a configuration 1 1
Sockets supported FP5 AM4
Thermal Design Power (TDP) 15 Watt 65 Watt

Peripherals

PCIe configurations Gen 3, 16 Lanes, (CPU only) Gen 3, 20 Lanes, (CPU only)