AMD Ryzen Embedded V2516 vs AMD Ryzen 3 PRO 4350GE
Comparative analysis of AMD Ryzen Embedded V2516 and AMD Ryzen 3 PRO 4350GE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Compatibility, Peripherals, Graphics interfaces. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the AMD Ryzen Embedded V2516
- CPU is newer: launch date 3 month(s) later
- 2 more cores, run more applications at once: 6 vs 4
- 4 more threads: 12 vs 8
- Around 11% higher maximum core temperature: 105 °C vs 95 °C
- Around 50% more L1 cache; more data can be stored in the L1 cache for quick access later
- Around 50% more L2 cache; more data can be stored in the L2 cache for quick access later
- 3.5x lower typical power consumption: 10 Watt vs 35 Watt
- Around 19% better performance in PassMark - CPU mark: 13016 vs 10929
| Specifications (specs) | |
| Launch date | 10 Nov 2020 vs 21 Jul 2020 |
| Number of cores | 6 vs 4 |
| Number of threads | 12 vs 8 |
| Maximum core temperature | 105 °C vs 95 °C |
| L1 cache | 384 KB vs 256 KB |
| L2 cache | 3 MB vs 2 MB |
| Thermal Design Power (TDP) | 10 Watt vs 35 Watt |
| Benchmarks | |
| PassMark - CPU mark | 13016 vs 10929 |
Reasons to consider the AMD Ryzen 3 PRO 4350GE
- Around 1% higher clock speed: 4.0 GHz vs 3.95 GHz
- Around 3% better performance in PassMark - Single thread mark: 2521 vs 2439
| Specifications (specs) | |
| Maximum frequency | 4.0 GHz vs 3.95 GHz |
| Benchmarks | |
| PassMark - Single thread mark | 2521 vs 2439 |
Compare benchmarks
CPU 1: AMD Ryzen Embedded V2516
CPU 2: AMD Ryzen 3 PRO 4350GE
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | AMD Ryzen Embedded V2516 | AMD Ryzen 3 PRO 4350GE |
|---|---|---|
| PassMark - Single thread mark | 2439 | 2521 |
| PassMark - CPU mark | 13016 | 10929 |
Compare specifications (specs)
| AMD Ryzen Embedded V2516 | AMD Ryzen 3 PRO 4350GE | |
|---|---|---|
Essentials |
||
| Launch date | 10 Nov 2020 | 21 Jul 2020 |
| OPN Tray | 100-000000243 | 100-000000154 |
| Place in performance rating | 931 | 918 |
| Architecture codename | Zen 2 | |
| Vertical segment | Desktop | |
Performance |
||
| Base frequency | 2.1 GHz | 3.5 GHz |
| Die size | 156 mm² | |
| Front-side bus (FSB) | 8 MB | |
| L1 cache | 384 KB | 256 KB |
| L2 cache | 3 MB | 2 MB |
| Manufacturing process technology | 7 nm | 7 nm |
| Maximum core temperature | 105 °C | 95 °C |
| Maximum frequency | 3.95 GHz | 4.0 GHz |
| Number of cores | 6 | 4 |
| Number of threads | 12 | 8 |
| Transistor count | 9800 million | |
| Unlocked | ||
| L3 cache | 4 MB | |
| Number of GPU cores | 6 | |
Memory |
||
| ECC memory support | ||
| Max memory channels | 2 | 2 |
| Supported memory types | DDR4-3200 | DDR4-3200 |
| Maximum memory size | 32 GB | |
Graphics |
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| Graphics max frequency | 1500 MHz | |
| Graphics base frequency | 1700 MHz | |
| iGPU core count | 6 | |
| Processor graphics | Radeon Graphics | |
Compatibility |
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| Configurable TDP | 10-25 Watt | |
| Max number of CPUs in a configuration | 1 | |
| Sockets supported | FP6 | AM4 |
| Thermal Design Power (TDP) | 10 Watt | 35 Watt |
Peripherals |
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| Max number of PCIe lanes | 20 | |
| PCI Express revision | 3.0 | 3.0 |
Graphics interfaces |
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| DisplayPort | ||
| HDMI | ||
