AMD Ryzen Embedded V2516 vs AMD Ryzen 3 PRO 4350GE

Comparative analysis of AMD Ryzen Embedded V2516 and AMD Ryzen 3 PRO 4350GE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Compatibility, Peripherals, Graphics interfaces. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the AMD Ryzen Embedded V2516

  • CPU is newer: launch date 3 month(s) later
  • 2 more cores, run more applications at once: 6 vs 4
  • 4 more threads: 12 vs 8
  • Around 11% higher maximum core temperature: 105 °C vs 95 °C
  • Around 50% more L1 cache; more data can be stored in the L1 cache for quick access later
  • Around 50% more L2 cache; more data can be stored in the L2 cache for quick access later
  • 3.5x lower typical power consumption: 10 Watt vs 35 Watt
  • Around 19% better performance in PassMark - CPU mark: 13016 vs 10964
Specifications (specs)
Launch date 10 Nov 2020 vs 21 Jul 2020
Number of cores 6 vs 4
Number of threads 12 vs 8
Maximum core temperature 105 °C vs 95 °C
L1 cache 384 KB vs 256 KB
L2 cache 3 MB vs 2 MB
Thermal Design Power (TDP) 10 Watt vs 35 Watt
Benchmarks
PassMark - CPU mark 13016 vs 10964

Reasons to consider the AMD Ryzen 3 PRO 4350GE

  • Around 1% higher clock speed: 4.0 GHz vs 3.95 GHz
  • Around 4% better performance in PassMark - Single thread mark: 2528 vs 2439
Specifications (specs)
Maximum frequency 4.0 GHz vs 3.95 GHz
Benchmarks
PassMark - Single thread mark 2528 vs 2439

Compare benchmarks

CPU 1: AMD Ryzen Embedded V2516
CPU 2: AMD Ryzen 3 PRO 4350GE

PassMark - Single thread mark
CPU 1
CPU 2
2439
2528
PassMark - CPU mark
CPU 1
CPU 2
13016
10964
Name AMD Ryzen Embedded V2516 AMD Ryzen 3 PRO 4350GE
PassMark - Single thread mark 2439 2528
PassMark - CPU mark 13016 10964

Compare specifications (specs)

AMD Ryzen Embedded V2516 AMD Ryzen 3 PRO 4350GE

Essentials

Launch date 10 Nov 2020 21 Jul 2020
OPN Tray 100-000000243 100-000000154
Place in performance rating 818 808
Architecture codename Zen 2
Vertical segment Desktop

Performance

Base frequency 2.1 GHz 3.5 GHz
Die size 156 mm²
Front-side bus (FSB) 8 MB
L1 cache 384 KB 256 KB
L2 cache 3 MB 2 MB
Manufacturing process technology 7 nm 7 nm
Maximum core temperature 105 °C 95 °C
Maximum frequency 3.95 GHz 4.0 GHz
Number of cores 6 4
Number of threads 12 8
Transistor count 9800 million
Unlocked
L3 cache 4 MB
Number of GPU cores 6

Memory

ECC memory support
Max memory channels 2 2
Supported memory types DDR4-3200 DDR4-3200
Maximum memory size 32 GB

Graphics

Graphics max frequency 1500 MHz
Graphics base frequency 1700 MHz
iGPU core count 6
Processor graphics Radeon Graphics

Compatibility

Configurable TDP 10-25 Watt
Max number of CPUs in a configuration 1
Sockets supported FP6 AM4
Thermal Design Power (TDP) 10 Watt 35 Watt

Peripherals

Max number of PCIe lanes 20
PCI Express revision 3.0 3.0

Graphics interfaces

DisplayPort
HDMI