AMD Ryzen Embedded V2718 vs Intel Core i7-4960HQ
Comparative analysis of AMD Ryzen Embedded V2718 and Intel Core i7-4960HQ processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Compatibility, Peripherals, Graphics API support, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Fps).
Differences
Reasons to consider the AMD Ryzen Embedded V2718
- CPU is newer: launch date 7 year(s) 2 month(s) later
- 4 more cores, run more applications at once: 8 vs 4
- 8 more threads: 16 vs 8
- Around 9% higher clock speed: 4.15 GHz vs 3.80 GHz
- Around 5% higher maximum core temperature: 105 °C vs 100°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm vs 22 nm
- 2x more L1 cache, more data can be stored in the L1 cache for quick access later
- 4x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 33% more L3 cache; more data can be stored in the L3 cache for quick access later
- 2x more maximum memory size: 64 GB vs 32 GB
- 3.1x lower typical power consumption: 15 Watt vs 47 Watt
- Around 7% better performance in PassMark - Single thread mark: 2240 vs 2087
- 2.5x better performance in PassMark - CPU mark: 16075 vs 6365
Specifications (specs) | |
Launch date | 10 Nov 2020 vs 1 September 2013 |
Number of cores | 8 vs 4 |
Number of threads | 16 vs 8 |
Maximum frequency | 4.15 GHz vs 3.80 GHz |
Maximum core temperature | 105 °C vs 100°C |
Manufacturing process technology | 7 nm vs 22 nm |
L1 cache | 512 KB vs 256 KB |
L2 cache | 4 MB vs 1 MB |
L3 cache | 8 MB vs 6 MB |
Maximum memory size | 64 GB vs 32 GB |
Thermal Design Power (TDP) | 15 Watt vs 47 Watt |
Benchmarks | |
PassMark - Single thread mark | 2240 vs 2087 |
PassMark - CPU mark | 16075 vs 6365 |
Compare benchmarks
CPU 1: AMD Ryzen Embedded V2718
CPU 2: Intel Core i7-4960HQ
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD Ryzen Embedded V2718 | Intel Core i7-4960HQ |
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PassMark - Single thread mark | 2240 | 2087 |
PassMark - CPU mark | 16075 | 6365 |
Geekbench 4 - Single Core | 889 | |
Geekbench 4 - Multi-Core | 3297 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 4.937 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 83.321 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.641 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 2.182 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 5.984 | |
GFXBench 4.0 - Manhattan (Frames) | 4832 | |
GFXBench 4.0 - T-Rex (Frames) | 7935 | |
GFXBench 4.0 - Manhattan (Fps) | 4832 | |
GFXBench 4.0 - T-Rex (Fps) | 7935 |
Compare specifications (specs)
AMD Ryzen Embedded V2718 | Intel Core i7-4960HQ | |
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Essentials |
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Architecture codename | Zen 2 | Crystal Well |
Launch date | 10 Nov 2020 | 1 September 2013 |
OPN Tray | 100-000000242 | |
Place in performance rating | 970 | 956 |
Launch price (MSRP) | $657 | |
Price now | $623 | |
Processor Number | i7-4960HQ | |
Series | 4th Generation Intel® Core™ i7 Processors | |
Status | Launched | |
Value for money (0-100) | 4.62 | |
Vertical segment | Mobile | |
Performance |
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Base frequency | 1.7 GHz | 2.60 GHz |
L1 cache | 512 KB | 256 KB |
L2 cache | 4 MB | 1 MB |
L3 cache | 8 MB | 6 MB |
Manufacturing process technology | 7 nm | 22 nm |
Maximum core temperature | 105 °C | 100°C |
Maximum frequency | 4.15 GHz | 3.80 GHz |
Number of cores | 8 | 4 |
Number of threads | 16 | 8 |
64 bit support | ||
Bus Speed | 5 GT/s DMI2 | |
Die size | 260 mm | |
Maximum case temperature (TCase) | 100 °C | |
Transistor count | 1700 Million | |
Memory |
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ECC memory support | ||
Max memory channels | 2 | 2 |
Maximum memory bandwidth | 63.58 GB/s | 25.6 GB/s |
Maximum memory size | 64 GB | 32 GB |
Supported memory types | DDR4-3200, LPDDR4x-4266 | DDR3L 1333/1600 |
Graphics |
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Graphics max frequency | 1600 MHz | 1.3 GHz |
iGPU core count | 7 | |
Number of pipelines | 448 | |
Processor graphics | Radeon Vega 7 | Intel® Iris® Pro Graphics 5200 |
Device ID | 0xD26 | |
Graphics base frequency | 200 MHz | |
Graphics max dynamic frequency | 1.30 GHz | |
Intel® Clear Video HD technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Max video memory | 2 GB | |
Graphics interfaces |
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DisplayPort | ||
HDMI | ||
Number of displays supported | 4 | 3 |
eDP | ||
VGA | ||
Wireless Display (WiDi) support | ||
Graphics image quality |
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Max resolution over DisplayPort | 4096x2160 | 3840x2160@60Hz |
Max resolution over HDMI 1.4 | 4096x2160 | 3840x2160@60Hz |
Max resolution over VGA | 2880x1800@60Hz | |
Compatibility |
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Configurable TDP | 10-25 Watt | |
Max number of CPUs in a configuration | 1 | 1 |
Sockets supported | FP6 | FCBGA1364 |
Thermal Design Power (TDP) | 15 Watt | 47 Watt |
Low Halogen Options Available | ||
Package Size | 37.5mm x 32mm x 1.65mm | |
Peripherals |
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Max number of PCIe lanes | 20 | 16 |
PCI Express revision | 3.0 | 3 |
PCIe configurations | 1x16 or 2x8 or 1x8 2x4 | |
Graphics API support |
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DirectX | 11.2/12 | |
OpenGL | 4.3 | |
Security & Reliability |
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Anti-Theft technology | ||
Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Flexible Display interface (FDI) | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | |
Intel 64 | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
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AMD Virtualization (AMD-V™) | ||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |