AMD Ryzen Embedded V2718 vs Intel Core i7-5550U

Comparative analysis of AMD Ryzen Embedded V2718 and Intel Core i7-5550U processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Compatibility, Peripherals, Graphics API support, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the AMD Ryzen Embedded V2718

  • CPU is newer: launch date 5 year(s) 10 month(s) later
  • 6 more cores, run more applications at once: 8 vs 2
  • 12 more threads: 16 vs 4
  • Around 38% higher clock speed: 4.15 GHz vs 3.00 GHz
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm vs 14 nm
  • 4x more L1 cache, more data can be stored in the L1 cache for quick access later
  • 8x more L2 cache, more data can be stored in the L2 cache for quick access later
  • 2x more L3 cache, more data can be stored in the L3 cache for quick access later
  • 4x more maximum memory size: 64 GB vs 16 GB
  • Around 32% better performance in PassMark - Single thread mark: 2240 vs 1703
  • 5.6x better performance in PassMark - CPU mark: 16075 vs 2864
Specifications (specs)
Launch date 10 Nov 2020 vs 5 January 2015
Number of cores 8 vs 2
Number of threads 16 vs 4
Maximum frequency 4.15 GHz vs 3.00 GHz
Manufacturing process technology 7 nm vs 14 nm
L1 cache 512 KB vs 128 KB
L2 cache 4 MB vs 512 KB
L3 cache 8 MB vs 4 MB
Maximum memory size 64 GB vs 16 GB
Benchmarks
PassMark - Single thread mark 2240 vs 1703
PassMark - CPU mark 16075 vs 2864

Compare benchmarks

CPU 1: AMD Ryzen Embedded V2718
CPU 2: Intel Core i7-5550U

PassMark - Single thread mark
CPU 1
CPU 2
2240
1703
PassMark - CPU mark
CPU 1
CPU 2
16075
2864
Name AMD Ryzen Embedded V2718 Intel Core i7-5550U
PassMark - Single thread mark 2240 1703
PassMark - CPU mark 16075 2864
Geekbench 4 - Single Core 3316
Geekbench 4 - Multi-Core 6083

Compare specifications (specs)

AMD Ryzen Embedded V2718 Intel Core i7-5550U

Essentials

Architecture codename Zen 2 Broadwell
Launch date 10 Nov 2020 5 January 2015
OPN Tray 100-000000242
Place in performance rating 970 932
Launch price (MSRP) $426
Processor Number i7-5550U
Series 5th Generation Intel® Core™ i7 Processors
Status Launched
Vertical segment Mobile

Performance

Base frequency 1.7 GHz 2.00 GHz
L1 cache 512 KB 128 KB
L2 cache 4 MB 512 KB
L3 cache 8 MB 4 MB
Manufacturing process technology 7 nm 14 nm
Maximum core temperature 105 °C 105°C
Maximum frequency 4.15 GHz 3.00 GHz
Number of cores 8 2
Number of threads 16 4
64 bit support
Bus Speed 5 GT/s DMI2
Die size 133 mm
Maximum case temperature (TCase) 105 °C
Transistor count 1900 Million

Memory

ECC memory support
Max memory channels 2 2
Maximum memory bandwidth 63.58 GB/s 25.6 GB/s
Maximum memory size 64 GB 16 GB
Supported memory types DDR4-3200, LPDDR4x-4266 DDR3L 1333/1600, LPDDR3 1600/1866

Graphics

Graphics max frequency 1600 MHz 1 GHz
iGPU core count 7
Number of pipelines 448
Processor graphics Radeon Vega 7 Intel® HD Graphics 6000
Device ID 0x1626
Graphics base frequency 300 MHz
Graphics max dynamic frequency 1.00 GHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Max video memory 16 GB

Graphics interfaces

DisplayPort
HDMI
Number of displays supported 4 3
eDP
Wireless Display (WiDi) support

Graphics image quality

Max resolution over DisplayPort 4096x2160 3840x2160@60Hz
Max resolution over HDMI 1.4 4096x2160 2560x1600@60Hz

Compatibility

Configurable TDP 10-25 Watt
Max number of CPUs in a configuration 1 1
Sockets supported FP6 FCBGA1168
Thermal Design Power (TDP) 15 Watt 15 Watt
Configurable TDP-down 9.5 W
Configurable TDP-down Frequency 600 MHz
Low Halogen Options Available
Package Size 40mm x24mm x 1.3mm

Peripherals

Max number of PCIe lanes 20 12
PCI Express revision 3.0 2.0
PCIe configurations 4x1, 2x4

Graphics API support

DirectX 11.2/12
OpenGL 4.3

Security & Reliability

Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® OS Guard
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2
Intel 64
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® Smart Response technology
Intel® Stable Image Platform Program (SIPP)
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring

Virtualization

AMD Virtualization (AMD-V™)
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)