AMD Sempron 2600+ vs Intel Pentium III 1400

Comparative analysis of AMD Sempron 2600+ and Intel Pentium III 1400 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the AMD Sempron 2600+

  • CPU is newer: launch date 2 year(s) 8 month(s) later
  • Around 14% higher clock speed: 1.6 GHz vs 1.4 GHz
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 90 nm vs 130 nm
  • 16x more L1 cache, more data can be stored in the L1 cache for quick access later
  • Around 19% better performance in PassMark - Single thread mark: 325 vs 272
  • Around 31% better performance in PassMark - CPU mark: 253 vs 193
Specifications (specs)
Launch date August 2004 vs December 2001
Maximum frequency 1.6 GHz vs 1.4 GHz
Manufacturing process technology 90 nm vs 130 nm
L1 cache 128 KB vs 8 KB
Benchmarks
PassMark - Single thread mark 325 vs 272
PassMark - CPU mark 253 vs 193

Reasons to consider the Intel Pentium III 1400

  • 2x more L2 cache, more data can be stored in the L2 cache for quick access later
  • 2x lower typical power consumption: 31.2 Watt vs 62 Watt
L2 cache 256 KB vs 128 KB
Thermal Design Power (TDP) 31.2 Watt vs 62 Watt

Compare benchmarks

CPU 1: AMD Sempron 2600+
CPU 2: Intel Pentium III 1400

PassMark - Single thread mark
CPU 1
CPU 2
325
272
PassMark - CPU mark
CPU 1
CPU 2
253
193
Name AMD Sempron 2600+ Intel Pentium III 1400
PassMark - Single thread mark 325 272
PassMark - CPU mark 253 193

Compare specifications (specs)

AMD Sempron 2600+ Intel Pentium III 1400

Essentials

Architecture codename Palermo Tualatin
Launch date August 2004 December 2001
Launch price (MSRP) $60
Place in performance rating 3223 3256
Price now $34.95
Value for money (0-100) 3.14
Vertical segment Desktop Desktop
Series Legacy Intel® Pentium® Processor
Status Discontinued

Performance

64 bit support
Die size 84 mm 80 mm2
L1 cache 128 KB 8 KB
L2 cache 128 KB 256 KB
Manufacturing process technology 90 nm 130 nm
Maximum frequency 1.6 GHz 1.4 GHz
Number of cores 1 1
Transistor count 63 million 44 million
Base frequency 1.40 GHz
Bus Speed 133 MHz FSB
Maximum case temperature (TCase) 69 °C
Maximum core temperature 69°C
VID voltage range 1.5V

Compatibility

Max number of CPUs in a configuration 1 1
Sockets supported 754 PPGA370
Thermal Design Power (TDP) 62 Watt 31.2 Watt
Low Halogen Options Available

Advanced Technologies

Intel® Turbo Boost technology

Virtualization

Intel® Virtualization Technology (VT-x)