AMD Sempron LE-1100 vs Intel Pentium Dual-Core E2180

Comparative analysis of AMD Sempron LE-1100 and Intel Pentium Dual-Core E2180 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Memory, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

AMD Sempron LE-1100

Intel Pentium Dual-Core E2180

Differences

Reasons to consider the AMD Sempron LE-1100

Around 44% lower typical power consumption: 45 Watt vs 65 Watt

Thermal Design Power (TDP)	45 Watt vs 65 Watt

Reasons to consider the Intel Pentium Dual-Core E2180

1 more cores, run more applications at once: 2 vs 1
Around 5% higher clock speed: 2 GHz vs 1.9 GHz
4x more L2 cache, more data can be stored in the L2 cache for quick access later
Around 45% better performance in PassMark - Single thread mark: 736 vs 509
2.2x better performance in PassMark - CPU mark: 683 vs 315

Specifications (specs)
Number of cores	2 vs 1
Maximum frequency	2 GHz vs 1.9 GHz
L2 cache	1024 KB (shared) vs 256 KB
Benchmarks
PassMark - Single thread mark	736 vs 509
PassMark - CPU mark	683 vs 315

Compare benchmarks

CPU 1: AMD Sempron LE-1100
CPU 2: Intel Pentium Dual-Core E2180

PassMark - Single thread mark

CPU 1

CPU 2

509

736

PassMark - CPU mark

CPU 1

CPU 2

315

683

Name	AMD Sempron LE-1100	Intel Pentium Dual-Core E2180
PassMark - Single thread mark	509	736
PassMark - CPU mark	315	683
Geekbench 4 - Single Core		242
Geekbench 4 - Multi-Core		423

Compare specifications (specs)

	AMD Sempron LE-1100	Intel Pentium Dual-Core E2180
Essentials
Architecture codename	Sparta	Conroe
Launch date	August 2007	August 2007
Place in performance rating	2990	2991
Vertical segment	Desktop	Desktop
Processor Number		E2180
Series		Legacy Intel® Pentium® Processor
Status		Discontinued
Performance
64 bit support
L1 cache	128 KB	64 KB (per core)
L2 cache	256 KB	1024 KB (shared)
Manufacturing process technology	65 nm	65 nm
Maximum frequency	1.9 GHz	2 GHz
Number of cores	1	2
Base frequency		2.00 GHz
Bus Speed		800 MHz FSB
Die size		77 mm2
Maximum core temperature		73.3°C
Transistor count		105 million
VID voltage range		0.8500V-1.5V
Compatibility
Max number of CPUs in a configuration	1	1
Sockets supported	AM2	LGA775
Thermal Design Power (TDP)	45 Watt	65 Watt
Low Halogen Options Available
Package Size		37.5mm x 37.5mm
Memory
Supported memory types		DDR1, DDR2, DDR3
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)