AMD Sempron X2 2300 vs Intel Core 2 Duo E4700
Comparative analysis of AMD Sempron X2 2300 and Intel Core 2 Duo E4700 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Memory, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the AMD Sempron X2 2300
- 2x more L1 cache, more data can be stored in the L1 cache for quick access later
- Around 9% better performance in PassMark - CPU mark: 982 vs 900
| Specifications (specs) | |
| L1 cache | 128 KB vs 64 KB |
| Max number of CPUs in a configuration | 2 vs 1 |
| Benchmarks | |
| PassMark - CPU mark | 982 vs 900 |
Reasons to consider the Intel Core 2 Duo E4700
- Around 18% higher clock speed: 2.6 GHz vs 2.2 GHz
- 8x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 53% better performance in PassMark - Single thread mark: 949 vs 621
| Specifications (specs) | |
| Maximum frequency | 2.6 GHz vs 2.2 GHz |
| L2 cache | 2048 KB vs 256 KB |
| Benchmarks | |
| PassMark - Single thread mark | 949 vs 621 |
Compare benchmarks
CPU 1: AMD Sempron X2 2300
CPU 2: Intel Core 2 Duo E4700
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | AMD Sempron X2 2300 | Intel Core 2 Duo E4700 |
|---|---|---|
| PassMark - Single thread mark | 621 | 949 |
| PassMark - CPU mark | 982 | 900 |
| Geekbench 4 - Single Core | 311 | |
| Geekbench 4 - Multi-Core | 512 |
Compare specifications (specs)
| AMD Sempron X2 2300 | Intel Core 2 Duo E4700 | |
|---|---|---|
Essentials |
||
| Architecture codename | Brisbane | Conroe |
| Launch date | March 2008 | March 2008 |
| Place in performance rating | 2805 | 2787 |
| Vertical segment | Desktop | Desktop |
| Price now | $26.99 | |
| Processor Number | E4700 | |
| Series | Legacy Intel® Core™ Processors | |
| Status | Discontinued | |
| Value for money (0-100) | 16.19 | |
Performance |
||
| 64 bit support | ||
| Die size | 118 mm | 111 mm2 |
| L1 cache | 128 KB | 64 KB |
| L2 cache | 256 KB | 2048 KB |
| Manufacturing process technology | 65 nm | 65 nm |
| Maximum frequency | 2.2 GHz | 2.6 GHz |
| Number of cores | 2 | 2 |
| Transistor count | 221 million | 167 million |
| Base frequency | 2.60 GHz | |
| Bus Speed | 800 MHz FSB | |
| Maximum core temperature | 73.3°C | |
| VID voltage range | 0.8500V-1.5V | |
Compatibility |
||
| Max number of CPUs in a configuration | 2 | 1 |
| Sockets supported | AM2 | PLGA775 |
| Thermal Design Power (TDP) | 65 Watt | 65 Watt |
| Low Halogen Options Available | ||
| Package Size | 37.5mm x 37.5mm | |
Memory |
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| Supported memory types | DDR1, DDR2, DDR3 | |
Security & Reliability |
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| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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| Enhanced Intel SpeedStep® technology | ||
| FSB parity | ||
| Idle States | ||
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Demand Based Switching | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
| Thermal Monitoring | ||
Virtualization |
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| Intel® Virtualization Technology (VT-x) | ||