AMD Turion Neo X2 L625 vs Intel Celeron Dual-Core T3000

Comparative analysis of AMD Turion Neo X2 L625 and Intel Celeron Dual-Core T3000 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Advanced Technologies. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the AMD Turion Neo X2 L625

  • CPU is newer: launch date 5 month(s) later
  • 2x more L1 cache, more data can be stored in the L1 cache for quick access later
  • Around 94% lower typical power consumption: 18 Watt vs 35 Watt
Launch date 1 October 2009 vs 1 May 2009
L1 cache 128 KB vs 64 KB
Thermal Design Power (TDP) 18 Watt vs 35 Watt

Reasons to consider the Intel Celeron Dual-Core T3000

  • Around 13% higher clock speed: 1.8 GHz vs 1.6 GHz
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 65 nm
  • Around 50% better performance in PassMark - Single thread mark: 728 vs 486
  • 2.5x better performance in PassMark - CPU mark: 1084 vs 432
Specifications (specs)
Maximum frequency 1.8 GHz vs 1.6 GHz
Manufacturing process technology 45 nm vs 65 nm
Benchmarks
PassMark - Single thread mark 728 vs 486
PassMark - CPU mark 1084 vs 432

Compare benchmarks

CPU 1: AMD Turion Neo X2 L625
CPU 2: Intel Celeron Dual-Core T3000

PassMark - Single thread mark
CPU 1
CPU 2
486
728
PassMark - CPU mark
CPU 1
CPU 2
432
1084
Name AMD Turion Neo X2 L625 Intel Celeron Dual-Core T3000
PassMark - Single thread mark 486 728
PassMark - CPU mark 432 1084
Geekbench 4 - Single Core 219
Geekbench 4 - Multi-Core 377

Compare specifications (specs)

AMD Turion Neo X2 L625 Intel Celeron Dual-Core T3000

Essentials

Architecture codename Congo Penryn-1M
Launch date 1 October 2009 1 May 2009
Place in performance rating 3024 3007
Series 2x AMD Turion Neo Intel Celeron Dual-Core
Vertical segment Laptop Laptop

Performance

64 bit support
Front-side bus (FSB) 800 MHz 800 MHz
L1 cache 128 KB 64 KB
L2 cache 1024 KB 1024 KB
Manufacturing process technology 65 nm 45 nm
Maximum core temperature 95 °C
Maximum frequency 1.6 GHz 1.8 GHz
Number of cores 2 2
Number of threads 2 2
Die size 107 mm
Transistor count 410 Million

Compatibility

Sockets supported ASB1 BGA P (478)
Thermal Design Power (TDP) 18 Watt 35 Watt

Advanced Technologies

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