AMD Turion Neo X2 L625 vs Intel Celeron Dual-Core T3000
Comparative analysis of AMD Turion Neo X2 L625 and Intel Celeron Dual-Core T3000 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Advanced Technologies. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the AMD Turion Neo X2 L625
- CPU is newer: launch date 5 month(s) later
- 2x more L1 cache, more data can be stored in the L1 cache for quick access later
- Around 94% lower typical power consumption: 18 Watt vs 35 Watt
Launch date | 1 October 2009 vs 1 May 2009 |
L1 cache | 128 KB vs 64 KB |
Thermal Design Power (TDP) | 18 Watt vs 35 Watt |
Reasons to consider the Intel Celeron Dual-Core T3000
- Around 13% higher clock speed: 1.8 GHz vs 1.6 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 65 nm
- Around 50% better performance in PassMark - Single thread mark: 728 vs 486
- 2.5x better performance in PassMark - CPU mark: 1084 vs 432
Specifications (specs) | |
Maximum frequency | 1.8 GHz vs 1.6 GHz |
Manufacturing process technology | 45 nm vs 65 nm |
Benchmarks | |
PassMark - Single thread mark | 728 vs 486 |
PassMark - CPU mark | 1084 vs 432 |
Compare benchmarks
CPU 1: AMD Turion Neo X2 L625
CPU 2: Intel Celeron Dual-Core T3000
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD Turion Neo X2 L625 | Intel Celeron Dual-Core T3000 |
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PassMark - Single thread mark | 486 | 728 |
PassMark - CPU mark | 432 | 1084 |
Geekbench 4 - Single Core | 219 | |
Geekbench 4 - Multi-Core | 377 |
Compare specifications (specs)
AMD Turion Neo X2 L625 | Intel Celeron Dual-Core T3000 | |
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Essentials |
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Architecture codename | Congo | Penryn-1M |
Launch date | 1 October 2009 | 1 May 2009 |
Place in performance rating | 3023 | 3006 |
Series | 2x AMD Turion Neo | Intel Celeron Dual-Core |
Vertical segment | Laptop | Laptop |
Performance |
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64 bit support | ||
Front-side bus (FSB) | 800 MHz | 800 MHz |
L1 cache | 128 KB | 64 KB |
L2 cache | 1024 KB | 1024 KB |
Manufacturing process technology | 65 nm | 45 nm |
Maximum core temperature | 95 °C | |
Maximum frequency | 1.6 GHz | 1.8 GHz |
Number of cores | 2 | 2 |
Number of threads | 2 | 2 |
Die size | 107 mm | |
Transistor count | 410 Million | |
Compatibility |
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Sockets supported | ASB1 BGA | P (478) |
Thermal Design Power (TDP) | 18 Watt | 35 Watt |
Advanced Technologies |
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