Intel Atom 330 vs AMD Phenom X3 8450
Comparative analysis of Intel Atom 330 and AMD Phenom X3 8450 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Atom 330
- CPU is newer: launch date 5 month(s) later
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 65 nm
- 11.9x lower typical power consumption: 8 Watt vs 95 Watt
Launch date | 22 September 2008 vs April 2008 |
Manufacturing process technology | 45 nm vs 65 nm |
Thermal Design Power (TDP) | 8 Watt vs 95 Watt |
Reasons to consider the AMD Phenom X3 8450
- 1 more cores, run more applications at once: 3 vs 2
- Around 31% higher clock speed: 2.1 GHz vs 1.6 GHz
- 3x more L1 cache, more data can be stored in the L1 cache for quick access later
- Around 50% more L2 cache; more data can be stored in the L2 cache for quick access later
Number of cores | 3 vs 2 |
Maximum frequency | 2.1 GHz vs 1.6 GHz |
L1 cache | 128 KB (per core) vs 64 KB (per core) |
L2 cache | 512 KB (per core) vs 1024 KB |
Compare benchmarks
CPU 1: Intel Atom 330
CPU 2: AMD Phenom X3 8450
Name | Intel Atom 330 | AMD Phenom X3 8450 |
---|---|---|
PassMark - Single thread mark | 255 | |
PassMark - CPU mark | 363 | |
Geekbench 4 - Single Core | 247 | |
Geekbench 4 - Multi-Core | 636 |
Compare specifications (specs)
Intel Atom 330 | AMD Phenom X3 8450 | |
---|---|---|
Essentials |
||
Architecture codename | Diamondville | Toliman |
Launch date | 22 September 2008 | April 2008 |
Launch price (MSRP) | $43 | |
Place in performance rating | 3266 | 3243 |
Processor Number | 330 | |
Series | Legacy Intel Atom® Processors | |
Status | Discontinued | |
Vertical segment | Desktop | Desktop |
Performance |
||
64 bit support | ||
Base frequency | 1.60 GHz | |
Bus Speed | 533 MHz FSB | |
Die size | 52 mm2 | 285 mm |
Front-side bus (FSB) | 533 MHz | |
L1 cache | 64 KB (per core) | 128 KB (per core) |
L2 cache | 1024 KB | 512 KB (per core) |
Manufacturing process technology | 45 nm | 65 nm |
Maximum core temperature | 85.2°C | |
Maximum frequency | 1.6 GHz | 2.1 GHz |
Number of cores | 2 | 3 |
Number of threads | 4 | |
Transistor count | 94 million | 450 million |
VID voltage range | 0.9V-1.1625V | |
L3 cache | 2048 KB (shared) | |
Compatibility |
||
Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 22mm x 22mm | |
Sockets supported | PBGA437 | AM2+ |
Thermal Design Power (TDP) | 8 Watt | 95 Watt |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
FSB parity | ||
Instruction set extensions | Intel® SSE2, Intel® SSE3, Intel® SSSE3 | |
Intel 64 | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Thermal Monitoring | ||
Virtualization |
||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
AMD Virtualization (AMD-V™) |