Intel Atom Z3580 vs Intel Core 2 Duo T6670
Comparative analysis of Intel Atom Z3580 and Intel Core 2 Duo T6670 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Atom Z3580
- 2 more cores, run more applications at once: 4 vs 2
- 2 more threads: 4 vs 2
- Around 6% higher clock speed: 2.33 GHz vs 2.2 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 45 nm
Number of cores | 4 vs 2 |
Number of threads | 4 vs 2 |
Maximum frequency | 2.33 GHz vs 2.2 GHz |
Manufacturing process technology | 22 nm vs 45 nm |
Reasons to consider the Intel Core 2 Duo T6670
- Around 17% higher maximum core temperature: 105°C vs 90°C
- Around 50% better performance in PassMark - Single thread mark: 881 vs 587
- Around 2% better performance in PassMark - CPU mark: 818 vs 802
Specifications (specs) | |
Maximum core temperature | 105°C vs 90°C |
Benchmarks | |
PassMark - Single thread mark | 881 vs 587 |
PassMark - CPU mark | 818 vs 802 |
Compare benchmarks
CPU 1: Intel Atom Z3580
CPU 2: Intel Core 2 Duo T6670
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Atom Z3580 | Intel Core 2 Duo T6670 |
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PassMark - Single thread mark | 587 | 881 |
PassMark - CPU mark | 802 | 818 |
Geekbench 4 - Single Core | 281 | |
Geekbench 4 - Multi-Core | 494 |
Compare specifications (specs)
Intel Atom Z3580 | Intel Core 2 Duo T6670 | |
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Essentials |
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Architecture codename | Moorefield | Penryn |
Launch date | Q2'14 | 1 January 2009 |
Place in performance rating | 2827 | 2833 |
Processor Number | Z3580 | T6670 |
Series | Intel® Atom™ Processor Z Series | Legacy Intel® Core™ Processors |
Status | Launched | Discontinued |
Vertical segment | Mobile | Mobile |
Performance |
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64 bit support | ||
Manufacturing process technology | 22 nm | 45 nm |
Maximum core temperature | 90°C | 105°C |
Maximum frequency | 2.33 GHz | 2.2 GHz |
Number of cores | 4 | 2 |
Number of threads | 4 | 2 |
VID voltage range | AVID | |
Base frequency | 2.20 GHz | |
Bus Speed | 800 MHz FSB | |
Die size | 107 mm2 | |
Front-side bus (FSB) | 800 MHz | |
L2 cache | 2048 KB | |
Transistor count | 410 million | |
Memory |
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Max memory channels | 2 | |
Maximum memory bandwidth | 12.8 GB/s | |
Maximum memory size | 4 GB | |
Supported memory types | LPDDR3 1600 | |
Graphics |
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Graphics base frequency | 457 MHz | |
Graphics max frequency | 533 MHz | |
Graphics interfaces |
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MIPI-DSI | ||
Number of displays supported | 2 | |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | |
Package Size | 14x14mm | 35mm x 35mm |
Sockets supported | PGA478 | |
Thermal Design Power (TDP) | 35 Watt | |
Peripherals |
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Number of USB ports | 2 | |
UART | ||
USB revision | 2.0/3.0 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Secure Key technology | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
General-Purpose Input/Output (GPIO) | ||
Idle States | ||
Instruction set extensions | Intel® SSE2, Intel® SSE3, Intel® SSSE3, Intel® SSE4.1, Intel® SSE4.2 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Physical Address Extensions (PAE) | 32-bit | |
Smart Idle | ||
Thermal Monitoring | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) |