Intel Atom Z3580 vs Intel Core 2 Duo T6670

Comparative analysis of Intel Atom Z3580 and Intel Core 2 Duo T6670 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Atom Z3580

  • 2 more cores, run more applications at once: 4 vs 2
  • 2 more threads: 4 vs 2
  • Around 6% higher clock speed: 2.33 GHz vs 2.2 GHz
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 45 nm
Number of cores 4 vs 2
Number of threads 4 vs 2
Maximum frequency 2.33 GHz vs 2.2 GHz
Manufacturing process technology 22 nm vs 45 nm

Reasons to consider the Intel Core 2 Duo T6670

  • Around 17% higher maximum core temperature: 105°C vs 90°C
  • Around 51% better performance in PassMark - Single thread mark: 886 vs 587
  • Around 3% better performance in PassMark - CPU mark: 827 vs 802
Specifications (specs)
Maximum core temperature 105°C vs 90°C
Benchmarks
PassMark - Single thread mark 886 vs 587
PassMark - CPU mark 827 vs 802

Compare benchmarks

CPU 1: Intel Atom Z3580
CPU 2: Intel Core 2 Duo T6670

PassMark - Single thread mark
CPU 1
CPU 2
587
886
PassMark - CPU mark
CPU 1
CPU 2
802
827
Name Intel Atom Z3580 Intel Core 2 Duo T6670
PassMark - Single thread mark 587 886
PassMark - CPU mark 802 827
Geekbench 4 - Single Core 281
Geekbench 4 - Multi-Core 494

Compare specifications (specs)

Intel Atom Z3580 Intel Core 2 Duo T6670

Essentials

Architecture codename Moorefield Penryn
Launch date Q2'14 1 January 2009
Place in performance rating 2827 2833
Processor Number Z3580 T6670
Series Intel® Atom™ Processor Z Series Legacy Intel® Core™ Processors
Status Launched Discontinued
Vertical segment Mobile Mobile

Performance

64 bit support
Manufacturing process technology 22 nm 45 nm
Maximum core temperature 90°C 105°C
Maximum frequency 2.33 GHz 2.2 GHz
Number of cores 4 2
Number of threads 4 2
VID voltage range AVID
Base frequency 2.20 GHz
Bus Speed 800 MHz FSB
Die size 107 mm2
Front-side bus (FSB) 800 MHz
L2 cache 2048 KB
Transistor count 410 million

Memory

Max memory channels 2
Maximum memory bandwidth 12.8 GB/s
Maximum memory size 4 GB
Supported memory types LPDDR3 1600

Graphics

Graphics base frequency 457 MHz
Graphics max frequency 533 MHz

Graphics interfaces

MIPI-DSI
Number of displays supported 2

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1
Package Size 14x14mm 35mm x 35mm
Sockets supported PGA478
Thermal Design Power (TDP) 35 Watt

Peripherals

Number of USB ports 2
UART
USB revision 2.0/3.0

Security & Reliability

Execute Disable Bit (EDB)
Intel® Secure Key technology

Advanced Technologies

Enhanced Intel SpeedStep® technology
General-Purpose Input/Output (GPIO)
Idle States
Instruction set extensions Intel® SSE2, Intel® SSE3, Intel® SSSE3, Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Physical Address Extensions (PAE) 32-bit
Smart Idle
Thermal Monitoring
Intel® Hyper-Threading technology
Intel® Turbo Boost technology

Virtualization

Intel® Virtualization Technology (VT-x)