Intel Celeron 2002E vs Intel Core i5-430UM
Comparative analysis of Intel Celeron 2002E and Intel Core i5-430UM processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Celeron 2002E
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
- 4x more maximum memory size: 32 GB vs 8 GB
- Around 81% better performance in PassMark - Single thread mark: 871 vs 481
- Around 74% better performance in PassMark - CPU mark: 1091 vs 627
Specifications (specs) | |
Manufacturing process technology | 22 nm vs 32 nm |
Maximum memory size | 32 GB vs 8 GB |
Benchmarks | |
PassMark - Single thread mark | 871 vs 481 |
PassMark - CPU mark | 1091 vs 627 |
Reasons to consider the Intel Core i5-430UM
- 2 more threads: 4 vs 2
- Around 5% higher maximum core temperature: 105°C vs 100°C
- Around 39% lower typical power consumption: 18 Watt vs 25 Watt
Number of threads | 4 vs 2 |
Maximum core temperature | 105°C vs 100°C |
Thermal Design Power (TDP) | 18 Watt vs 25 Watt |
Compare benchmarks
CPU 1: Intel Celeron 2002E
CPU 2: Intel Core i5-430UM
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Celeron 2002E | Intel Core i5-430UM |
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PassMark - Single thread mark | 871 | 481 |
PassMark - CPU mark | 1091 | 627 |
Geekbench 4 - Single Core | 1171 | |
Geekbench 4 - Multi-Core | 2043 |
Compare specifications (specs)
Intel Celeron 2002E | Intel Core i5-430UM | |
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Essentials |
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Architecture codename | Haswell | Arrandale |
Launch date | Q1'14 | 24 May 2010 |
Place in performance rating | 2443 | 2429 |
Processor Number | 2002E | i5-430UM |
Series | Intel® Celeron® Processor 2000 Series | Legacy Intel® Core™ Processors |
Status | Launched | Discontinued |
Vertical segment | Embedded | Mobile |
Performance |
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64 bit support | ||
Base frequency | 1.50 GHz | 1.20 GHz |
Bus Speed | 5 GT/s DMI2 | 2.5 GT/s DMI |
Manufacturing process technology | 22 nm | 32 nm |
Maximum core temperature | 100°C | 105°C |
Number of cores | 2 | 2 |
Number of threads | 2 | 4 |
Die size | 81 mm2 | |
Front-side bus (FSB) | 2500 MHz | |
L2 cache | 512 KB | |
L3 cache | 3 MB | |
Maximum frequency | 1.73 GHz | |
Transistor count | 382 million | |
Memory |
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Max memory channels | 2 | 2 |
Maximum memory bandwidth | 25.6 GB/s | 12.8 GB/s |
Maximum memory size | 32 GB | 8 GB |
Supported memory types | DDR3L 1333/1600 | DDR3 800 |
Graphics |
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Graphics base frequency | 400 MHz | 166 MHz |
Graphics max dynamic frequency | 900 MHz | 500 MHz |
Intel® Flexible Display Interface (Intel® FDI) | ||
Max video memory | 1 GB | |
Processor graphics | Intel HD Graphics | Intel HD Graphics |
Graphics max frequency | 500 MHz | |
Intel® Clear Video HD technology | ||
Intel® Clear Video technology | ||
Graphics interfaces |
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DisplayPort | ||
eDP | ||
HDMI | ||
Number of displays supported | 3 | 2 |
VGA | ||
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 37.5mm x 32mm x 1.6mm | BGA 34mm x 28mm |
Sockets supported | FCBGA1364 | BGA1288 |
Thermal Design Power (TDP) | 25 Watt | 18 Watt |
Peripherals |
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Max number of PCIe lanes | 16 | 16 |
PCI Express revision | 3.0 | 2.0 |
PCIe configurations | 1x16 or 2x8 or 1x8 2x4 | 1x16 |
Scalability | 1S Only | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 | Intel® SSE4.1, Intel® SSE4.2 |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Flexible Display interface (FDI) | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Physical Address Extensions (PAE) | 36-bit | |
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |