Intel Celeron 2002E processor review
Celeron 2002E processor released by Intel; release date: Q1'14. The processor is designed for embedded-computers and based on Haswell microarchitecture.
CPU is locked to prevent overclocking. Total number of cores - 2, threads - 2. Maximum operating temperature - 100°C. Manufacturing process technology - 22 nm.
Supported memory types: DDR3L 1333/1600. Maximum memory size: 32 GB.
Supported socket types: FCBGA1364. Maximum number of processors in a configuration - 1. Power consumption (TDP): 25 Watt.
The processor has integrated graphics Intel HD Graphics with the following parameters: maximum video memory size - 1 GB.
Benchmarks
| PassMark Single thread mark |
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| PassMark CPU mark |
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| Name | Value |
|---|---|
| PassMark - Single thread mark | 871 |
| PassMark - CPU mark | 1091 |
Specifications (specs)
Essentials |
|
| Architecture codename | Haswell |
| Launch date | Q1'14 |
| Place in performance rating | 2454 |
| Processor Number | 2002E |
| Series | Intel® Celeron® Processor 2000 Series |
| Status | Launched |
| Vertical segment | Embedded |
Performance |
|
| 64 bit support | |
| Base frequency | 1.50 GHz |
| Bus Speed | 5 GT/s DMI2 |
| Manufacturing process technology | 22 nm |
| Maximum core temperature | 100°C |
| Number of cores | 2 |
| Number of threads | 2 |
Memory |
|
| Max memory channels | 2 |
| Maximum memory bandwidth | 25.6 GB/s |
| Maximum memory size | 32 GB |
| Supported memory types | DDR3L 1333/1600 |
Graphics |
|
| Graphics base frequency | 400 MHz |
| Graphics max dynamic frequency | 900 MHz |
| Intel® Flexible Display Interface (Intel® FDI) | |
| Max video memory | 1 GB |
| Processor graphics | Intel HD Graphics |
Graphics interfaces |
|
| DisplayPort | |
| eDP | |
| HDMI | |
| Number of displays supported | 3 |
| VGA | |
Compatibility |
|
| Low Halogen Options Available | |
| Max number of CPUs in a configuration | 1 |
| Package Size | 37.5mm x 32mm x 1.6mm |
| Sockets supported | FCBGA1364 |
| Thermal Design Power (TDP) | 25 Watt |
Peripherals |
|
| Max number of PCIe lanes | 16 |
| PCI Express revision | 3.0 |
| PCIe configurations | 1x16 or 2x8 or 1x8 2x4 |
| Scalability | 1S Only |
Security & Reliability |
|
| Execute Disable Bit (EDB) | |
| Intel® Identity Protection technology | |
| Intel® Secure Key technology | |
| Intel® Trusted Execution technology (TXT) | |
Advanced Technologies |
|
| Enhanced Intel SpeedStep® technology | |
| Idle States | |
| Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 |
| Intel 64 | |
| Intel® AES New Instructions | |
| Intel® Hyper-Threading technology | |
| Intel® Stable Image Platform Program (SIPP) | |
| Intel® TSX-NI | |
| Intel® Turbo Boost technology | |
| Intel® vPro™ Platform Eligibility | |
| Thermal Monitoring | |
Virtualization |
|
| Intel® Virtualization Technology (VT-x) | |
| Intel® Virtualization Technology for Directed I/O (VT-d) | |
| Intel® VT-x with Extended Page Tables (EPT) | |
