Intel Celeron 6305 vs Intel Celeron 1020E
Comparative analysis of Intel Celeron 6305 and Intel Celeron 1020E processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Celeron 6305
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 10 nm SuperFin vs 22 nm
- 4x more maximum memory size: 64 GB vs 16 GB
- Around 48% better performance in PassMark - CPU mark: 2080 vs 1406
Specifications (specs) | |
Manufacturing process technology | 10 nm SuperFin vs 22 nm |
Maximum memory size | 64 GB vs 16 GB |
Benchmarks | |
PassMark - CPU mark | 2080 vs 1406 |
Reasons to consider the Intel Celeron 1020E
- Around 5% higher maximum core temperature: 105 °C vs 100°C
- Around 2% better performance in PassMark - Single thread mark: 1224 vs 1195
Specifications (specs) | |
Maximum core temperature | 105 °C vs 100°C |
Benchmarks | |
PassMark - Single thread mark | 1224 vs 1195 |
Compare benchmarks
CPU 1: Intel Celeron 6305
CPU 2: Intel Celeron 1020E
PassMark - Single thread mark |
|
|
||||
PassMark - CPU mark |
|
|
Name | Intel Celeron 6305 | Intel Celeron 1020E |
---|---|---|
PassMark - Single thread mark | 1195 | 1224 |
PassMark - CPU mark | 2080 | 1406 |
Compare specifications (specs)
Intel Celeron 6305 | Intel Celeron 1020E | |
---|---|---|
Essentials |
||
Architecture codename | Tiger Lake | Ivy Bridge |
Launch date | Q4'20 | 1 January 2013 |
Place in performance rating | 2044 | 2036 |
Processor Number | 6305 | 1020E |
Series | Intel Celeron Processor 6000 Series | Intel® Celeron® Processor 1000 Series |
Status | Launched | Launched |
Vertical segment | Mobile | Embedded |
Performance |
||
64 bit support | ||
Bus Speed | 4 GT/s | 5 GT/s DMI |
Manufacturing process technology | 10 nm SuperFin | 22 nm |
Maximum core temperature | 100°C | 105 °C |
Number of cores | 2 | 2 |
Number of threads | 2 | 2 |
Base frequency | 2.20 GHz | |
Die size | 118 mm | |
L1 cache | 128 KB | |
L2 cache | 512 KB | |
L3 cache | 2048 KB | |
Maximum case temperature (TCase) | 105 °C | |
Maximum frequency | 2.2 GHz | |
Transistor count | 1400 million | |
Memory |
||
Max memory channels | 2 | 2 |
Maximum memory size | 64 GB | 16 GB |
Supported memory types | DDR4-3200, LPDDR4x-3733 | DDR3/DDR3L 1333/1600 |
ECC memory support | ||
Maximum memory bandwidth | 25.6 GB/s | |
Graphics |
||
Device ID | 0x9A78 | |
Execution Units | 48 | |
Graphics max dynamic frequency | 1.25 GHz | 1.00 GHz |
Intel® Clear Video HD technology | ||
Intel® Quick Sync Video | ||
Processor graphics | Intel UHD Graphics | Intel HD Graphics |
Graphics base frequency | 650 MHz | |
Graphics max frequency | 1 GHz | |
Intel® InTru™ 3D technology | ||
Graphics interfaces |
||
Number of displays supported | 4 | 3 |
CRT | ||
DisplayPort | ||
eDP | ||
HDMI | ||
SDVO | ||
Wireless Display (WiDi) support | ||
Graphics image quality |
||
Max resolution over DisplayPort | 7680x4320@60Hz | |
Max resolution over eDP | 4096x2304@60Hz | |
Graphics API support |
||
DirectX | 12.1 | |
OpenGL | 4.6 | |
Compatibility |
||
Configurable TDP-up | 15 Watt | |
Configurable TDP-up Frequency | 1.80 GHz | |
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 46.5x25 | 37.5mm x 37.5mm (rPGA988B); 31mm x 24mm (BGA1023) |
Sockets supported | FCBGA1449 | FCPGA988, FCBGA1023 |
Low Halogen Options Available | ||
Thermal Design Power (TDP) | 35 Watt | |
Security & Reliability |
||
Intel® OS Guard | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Intel® Trusted Execution technology (TXT) | ||
Mode-based Execute Control (MBE) | ||
Secure Boot | ||
Anti-Theft technology | ||
Execute Disable Bit (EDB) | ||
Advanced Technologies |
||
Idle States | ||
Instruction set extensions | Intel SSE4.1, Intel SSE4.2, Intel AVX2 | Intel® SSE4.1, Intel® SSE4.2 |
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Optane™ Memory Supported | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® Turbo Boost technology | ||
Intel® Volume Management Device (VMD) | ||
Speed Shift technology | ||
Thermal Monitoring | ||
Enhanced Intel SpeedStep® technology | ||
Intel 64 | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® My WiFi technology | ||
Intel® vPro™ Platform Eligibility | ||
Virtualization |
||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
Peripherals |
||
Max number of PCIe lanes | 1 | |
PCI Express revision | 2.0 | |
PCIe configurations | 1x16, 2x8, 1x8 & 2x4 |