Intel Celeron 6600HE vs AMD Ryzen Embedded R1600

Comparative analysis of Intel Celeron 6600HE and AMD Ryzen Embedded R1600 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the Intel Celeron 6600HE

  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 10 nm SuperFin vs 14 nm
  • 2x more L3 cache, more data can be stored in the L3 cache for quick access later
  • Around 2% better performance in PassMark - Single thread mark: 1764 vs 1724
Specifications (specs)
Manufacturing process technology 10 nm SuperFin vs 14 nm
L3 cache 8 MB vs 4 MB
Benchmarks
PassMark - Single thread mark 1764 vs 1724
PassMark - CPU mark 3286 vs 3276

Reasons to consider the AMD Ryzen Embedded R1600

  • 2 more threads: 4 vs 2
  • Around 5% higher maximum core temperature: 105 °C vs 100°C
  • 2.3x lower typical power consumption: 15 Watt vs 35 Watt
Number of threads 4 vs 2
Maximum core temperature 105 °C vs 100°C
Thermal Design Power (TDP) 15 Watt vs 35 Watt

Compare benchmarks

CPU 1: Intel Celeron 6600HE
CPU 2: AMD Ryzen Embedded R1600

PassMark - Single thread mark
CPU 1
CPU 2
1764
1724
PassMark - CPU mark
CPU 1
CPU 2
3286
3276
Name Intel Celeron 6600HE AMD Ryzen Embedded R1600
PassMark - Single thread mark 1764 1724
PassMark - CPU mark 3286 3276

Compare specifications (specs)

Intel Celeron 6600HE AMD Ryzen Embedded R1600

Essentials

Architecture codename Tiger Lake Zen
Launch date Q3'21 25 Feb 2020
Launch price (MSRP) $107
Place in performance rating 1463 1496
Processor Number 6600HE
Series Intel Celeron Processor 6000 Series
Vertical segment Embedded Mobile

Performance

64 bit support
Base frequency 2.60 GHz 2.6 GHz
L3 cache 8 MB 4 MB
Manufacturing process technology 10 nm SuperFin 14 nm
Maximum core temperature 100°C 105 °C
Number of cores 2 2
Number of threads 2 4
Die size 209.8 mm²
L1 cache 192 KB
L2 cache 1 MB
Maximum frequency 3.1 GHz
Transistor count 4950 million
Unlocked

Memory

Max memory channels 2 2
Maximum memory size 128 GB
Supported memory types DDR4-3200 DDR4-2400
ECC memory support

Graphics

Device ID 0x9A68
Execution Units 16
Graphics base frequency 350 MHz
Graphics max dynamic frequency 1.10 GHz
Intel® Quick Sync Video
Processor graphics Intel UHD Graphics for 11th Gen Intel Processors

Graphics interfaces

Number of displays supported 4

Graphics image quality

Max resolution over DisplayPort 7680x4320@60Hz
Max resolution over eDP 4096x2304@60Hz

Graphics API support

DirectX 12.1
OpenGL 4.6

Compatibility

Max number of CPUs in a configuration 1 1
Package Size 50 x 26.5
Sockets supported FCBGA1787
Thermal Design Power (TDP) 35 Watt 15 Watt
Configurable TDP-down 12 Watt
Configurable TDP-up 25 Watt
Socket Count FP5

Peripherals

Max number of PCIe lanes 20 8
PCIe configurations Up to 1x16+1x4, 2x8+1x4, 1x8+3x4
PCI Express revision 3.0

Security & Reliability

Intel® OS Guard
Intel® Software Guard Extensions (Intel® SGX)
Intel® Trusted Execution technology (TXT)
Secure Boot

Advanced Technologies

Instruction set extensions Intel SSE4.1, Intel SSE4.2, Intel AVX2, Intel AVX-512
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® Volume Management Device (VMD)
Number of AVX-512 FMA Units 2
Speed Shift technology
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)