Intel Celeron 6600HE vs Intel Pentium Gold 6500Y
Comparative analysis of Intel Celeron 6600HE and Intel Pentium Gold 6500Y processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Celeron 6600HE
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 10 nm SuperFin vs 14 nm
- 8x more maximum memory size: 128 GB vs 16 GB
- Around 9% better performance in PassMark - CPU mark: 3286 vs 3024
| Specifications (specs) | |
| Manufacturing process technology | 10 nm SuperFin vs 14 nm |
| Maximum memory size | 128 GB vs 16 GB |
| Benchmarks | |
| PassMark - Single thread mark | 1764 vs 1758 |
| PassMark - CPU mark | 3286 vs 3024 |
Reasons to consider the Intel Pentium Gold 6500Y
- 7x lower typical power consumption: 5 Watt vs 35 Watt
| Thermal Design Power (TDP) | 5 Watt vs 35 Watt |
Compare benchmarks
CPU 1: Intel Celeron 6600HE
CPU 2: Intel Pentium Gold 6500Y
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | Intel Celeron 6600HE | Intel Pentium Gold 6500Y |
|---|---|---|
| PassMark - Single thread mark | 1764 | 1758 |
| PassMark - CPU mark | 3286 | 3024 |
Compare specifications (specs)
| Intel Celeron 6600HE | Intel Pentium Gold 6500Y | |
|---|---|---|
Essentials |
||
| Architecture codename | Tiger Lake | Amber Lake Y |
| Launch date | Q3'21 | Q1'21 |
| Launch price (MSRP) | $107 | |
| Place in performance rating | 1471 | 1477 |
| Processor Number | 6600HE | 6500Y |
| Series | Intel Celeron Processor 6000 Series | Intel Pentium Gold Processor Series |
| Vertical segment | Embedded | Mobile |
| Status | Launched | |
Performance |
||
| 64 bit support | ||
| Base frequency | 2.60 GHz | 1.10 GHz |
| L3 cache | 8 MB | |
| Manufacturing process technology | 10 nm SuperFin | 14 nm |
| Maximum core temperature | 100°C | 100°C |
| Number of cores | 2 | |
| Number of threads | 2 | |
| Bus Speed | 4 GT/s | |
| Maximum frequency | 3.40 GHz | |
Memory |
||
| Max memory channels | 2 | 2 |
| Maximum memory size | 128 GB | 16 GB |
| Supported memory types | DDR4-3200 | LPDDR3-1866, DDR3L-1600 |
| Maximum memory bandwidth | 33.3 GB/s | |
Graphics |
||
| Device ID | 0x9A68 | 0x591C |
| Execution Units | 16 | 23 |
| Graphics base frequency | 350 MHz | 300 MHz |
| Graphics max dynamic frequency | 1.10 GHz | 900 MHz |
| Intel® Quick Sync Video | ||
| Processor graphics | Intel UHD Graphics for 11th Gen Intel Processors | Intel UHD Graphics 615 |
| Intel® Clear Video HD technology | ||
| Intel® Clear Video technology | ||
| Max video memory | 16 GB | |
Graphics interfaces |
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| Number of displays supported | 4 | 3 |
| DisplayPort | ||
| DVI | ||
| eDP | ||
| HDMI | ||
Graphics image quality |
||
| Max resolution over DisplayPort | 7680x4320@60Hz | 3840x2160@60Hz |
| Max resolution over eDP | 4096x2304@60Hz | 3840x2160@60Hz |
| 4K resolution support | ||
Graphics API support |
||
| DirectX | 12.1 | 12 |
| OpenGL | 4.6 | 4.5 |
Compatibility |
||
| Max number of CPUs in a configuration | 1 | 1 |
| Package Size | 50 x 26.5 | 20mm X 16.5mm |
| Sockets supported | FCBGA1787 | |
| Thermal Design Power (TDP) | 35 Watt | 5 Watt |
| Configurable TDP-down | 3.5 Watt | |
| Configurable TDP-down Frequency | 600 MHz | |
| Configurable TDP-up | 7 Watt | |
| Configurable TDP-up Frequency | 1.60 GHz | |
Peripherals |
||
| Max number of PCIe lanes | 20 | 10 |
| PCIe configurations | Up to 1x16+1x4, 2x8+1x4, 1x8+3x4 | 1x4, 2x2, 1x2+2x1 and 4x1 |
| PCI Express revision | 3.0 | |
Security & Reliability |
||
| Intel® OS Guard | ||
| Intel® Software Guard Extensions (Intel® SGX) | ||
| Intel® Trusted Execution technology (TXT) | ||
| Secure Boot | ||
| Execute Disable Bit (EDB) | ||
| Intel® Identity Protection technology | ||
| Intel® Memory Protection Extensions (Intel® MPX) | ||
| Intel® Secure Key technology | ||
Advanced Technologies |
||
| Instruction set extensions | Intel SSE4.1, Intel SSE4.2, Intel AVX2, Intel AVX-512 | Intel SSE4.1, Intel SSE4.2, Intel AVX2 |
| Intel® AES New Instructions | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
| Intel® Volume Management Device (VMD) | ||
| Number of AVX-512 FMA Units | 2 | |
| Speed Shift technology | ||
| Thermal Monitoring | ||
| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Intel 64 | ||
| Intel® Flex Memory Access | ||
| Intel® Stable Image Platform Program (SIPP) | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
