Intel Celeron 887 vs Intel Core 2 Duo T7100

Comparative analysis of Intel Celeron 887 and Intel Core 2 Duo T7100 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Celeron 887

  • CPU is newer: launch date 5 year(s) 4 month(s) later
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
  • 2x more L1 cache, more data can be stored in the L1 cache for quick access later
  • 2.1x lower typical power consumption: 17 Watt vs 35 Watt
  • Around 1% better performance in PassMark - Single thread mark: 699 vs 690
  • Around 25% better performance in PassMark - CPU mark: 756 vs 607
  • Around 6% better performance in Geekbench 4 - Multi-Core: 410 vs 388
Specifications (specs)
Launch date 1 October 2012 vs 9 May 2007
Manufacturing process technology 32 nm vs 65 nm
L1 cache 128 KB vs 64 KB
Thermal Design Power (TDP) 17 Watt vs 35 Watt
Benchmarks
PassMark - Single thread mark 699 vs 690
PassMark - CPU mark 756 vs 607
Geekbench 4 - Multi-Core 410 vs 388

Reasons to consider the Intel Core 2 Duo T7100

  • Around 20% higher clock speed: 1.8 GHz vs 1.5 GHz
  • 4x more L2 cache, more data can be stored in the L2 cache for quick access later
  • Around 8% better performance in Geekbench 4 - Single Core: 241 vs 224
Specifications (specs)
Maximum frequency 1.8 GHz vs 1.5 GHz
L2 cache 2048 KB vs 512 KB
Benchmarks
Geekbench 4 - Single Core 241 vs 224

Compare benchmarks

CPU 1: Intel Celeron 887
CPU 2: Intel Core 2 Duo T7100

PassMark - Single thread mark
CPU 1
CPU 2
699
690
PassMark - CPU mark
CPU 1
CPU 2
756
607
Geekbench 4 - Single Core
CPU 1
CPU 2
224
241
Geekbench 4 - Multi-Core
CPU 1
CPU 2
410
388
Name Intel Celeron 887 Intel Core 2 Duo T7100
PassMark - Single thread mark 699 690
PassMark - CPU mark 756 607
Geekbench 4 - Single Core 224 241
Geekbench 4 - Multi-Core 410 388

Compare specifications (specs)

Intel Celeron 887 Intel Core 2 Duo T7100

Essentials

Architecture codename Sandy Bridge Merom
Launch date 1 October 2012 9 May 2007
Launch price (MSRP) $86 $197
Place in performance rating 3025 3031
Processor Number 887 T7100
Series Legacy Intel® Celeron® Processor Legacy Intel® Core™ Processors
Status Launched Discontinued
Vertical segment Mobile Mobile
Price now $21.99
Value for money (0-100) 13.62

Performance

64 bit support
Base frequency 1.50 GHz 1.80 GHz
Bus Speed 5 GT/s DMI 800 MHz FSB
Die size 131 mm 143 mm2
L1 cache 128 KB 64 KB
L2 cache 512 KB 2048 KB
L3 cache 2048 KB
Manufacturing process technology 32 nm 65 nm
Maximum core temperature 100 °C 100°C
Maximum frequency 1.5 GHz 1.8 GHz
Number of cores 2 2
Number of threads 2 2
Transistor count 504 million 291 million
Front-side bus (FSB) 800 MHz

Memory

Max memory channels 2
Maximum memory bandwidth 21.3 GB/s
Maximum memory size 16 GB
Supported memory types DDR3 1066/1333

Graphics

Graphics base frequency 350 MHz
Graphics max dynamic frequency 1.00 GHz
Graphics max frequency 1 GHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics Intel HD Graphics

Graphics interfaces

CRT
DisplayPort
eDP
HDMI
Number of displays supported 2
SDVO
Wireless Display (WiDi) support

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1 1
Package Size 31.0mm x 24.0mm (BGA1023) 35mm x 35mm
Sockets supported FCBGA1023 PPGA478, PBGA479
Thermal Design Power (TDP) 17 Watt 35 Watt

Peripherals

Max number of PCIe lanes 16
PCI Express revision 2.0
PCIe configurations 1x16, 2x8, 1x8 2x4

Security & Reliability

Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

4G WiMAX Wireless
Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
FSB parity

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)