Intel Celeron G4900T vs AMD Phenom II X3 B75
Comparative analysis of Intel Celeron G4900T and AMD Phenom II X3 B75 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Celeron G4900T
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 45 nm
- 2.7x lower typical power consumption: 35 Watt vs 95 Watt
- Around 38% better performance in PassMark - Single thread mark: 1737 vs 1256
- Around 26% better performance in PassMark - CPU mark: 2239 vs 1781
Specifications (specs) | |
Manufacturing process technology | 14 nm vs 45 nm |
Thermal Design Power (TDP) | 35 Watt vs 95 Watt |
Benchmarks | |
PassMark - Single thread mark | 1737 vs 1256 |
PassMark - CPU mark | 2239 vs 1781 |
Reasons to consider the AMD Phenom II X3 B75
- 1 more cores, run more applications at once: 3 vs 2
- 1 more threads: 3 vs 2
Number of cores | 3 vs 2 |
Number of threads | 3 vs 2 |
Compare benchmarks
CPU 1: Intel Celeron G4900T
CPU 2: AMD Phenom II X3 B75
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Celeron G4900T | AMD Phenom II X3 B75 |
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PassMark - Single thread mark | 1737 | 1256 |
PassMark - CPU mark | 2239 | 1781 |
Geekbench 4 - Single Core | 1905 | |
Geekbench 4 - Multi-Core | 4439 |
Compare specifications (specs)
Intel Celeron G4900T | AMD Phenom II X3 B75 | |
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Essentials |
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Architecture codename | Coffee Lake | Heka |
Launch date | Q2'18 | October 2009 |
Place in performance rating | 1509 | 1502 |
Processor Number | G4900T | |
Series | Intel® Celeron® Processor G Series | AMD Business Class - AMD Phenom X3 Triple-Core |
Status | Launched | |
Vertical segment | Desktop | Desktop |
Family | AMD Phenom | |
OPN Tray | HDXB75WFK3DGM | |
Price now | $39.99 | |
Value for money (0-100) | 21.61 | |
Performance |
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64 bit support | ||
Base frequency | 2.90 GHz | 3 GHz |
Bus Speed | 8 GT/s DMI3 | |
Manufacturing process technology | 14 nm | 45 nm |
Maximum core temperature | 88°C | |
Number of cores | 2 | 3 |
Number of threads | 2 | 3 |
Die size | 258 mm | |
L1 cache | 128 KB (per core) | |
L2 cache | 512 KB (per core) | |
L3 cache | 6144 KB (shared) | |
Maximum frequency | 3 GHz | |
Transistor count | 758 million | |
Unlocked | ||
Memory |
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Max memory channels | 2 | |
Maximum memory bandwidth | 37.5 GB/s | |
Maximum memory size | 64 GB | |
Supported memory types | DDR4-2400 | DDR3 |
Graphics |
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Device ID | 0x3E93 | |
Graphics base frequency | 350 MHz | |
Graphics max dynamic frequency | 1.00 GHz | |
Intel® Clear Video HD technology | ||
Intel® Clear Video technology | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Max video memory | 64 GB | |
Processor graphics | Intel® UHD Graphics 610 | |
Graphics interfaces |
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Number of displays supported | 3 | |
Graphics image quality |
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4K resolution support | ||
Max resolution over DisplayPort | 4096x2304@60Hz | |
Max resolution over eDP | 4096x2304@60Hz | |
Max resolution over HDMI 1.4 | 4096x2304@24Hz | |
Graphics API support |
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DirectX | 12 | |
OpenGL | 4.5 | |
Compatibility |
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Configurable TDP-down | 25 W | |
Configurable TDP-down Frequency | 1.80 GHz | |
Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 37.5mm x 37.5mm | |
Sockets supported | FCLGA1151 | AM3 |
Thermal Design Power (TDP) | 35 Watt | 95 Watt |
Thermal Solution | PCG 2015A (35W) | |
Peripherals |
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Max number of PCIe lanes | 16 | |
PCI Express revision | 3.0 | |
PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | |
Scalability | 1S Only | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Memory Protection Extensions (Intel® MPX) | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Intel® Trusted Execution technology (TXT) | ||
Secure Boot | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Optane™ Memory Supported | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |