Intel Celeron G6900TE vs Intel Core i7-4710HQ
Comparative analysis of Intel Celeron G6900TE and Intel Core i7-4710HQ processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Fps).
Differences
Reasons to consider the Intel Celeron G6900TE
- CPU is newer: launch date 7 year(s) 8 month(s) later
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm vs 22 nm
- 2.5x more L2 cache, more data can be stored in the L2 cache for quick access later
- 4x more maximum memory size: 128 GB vs 32 GB
- Around 34% lower typical power consumption: 35 Watt vs 47 Watt
Launch date | 4 Jan 2022 vs 14 April 2014 |
Manufacturing process technology | 7 nm vs 22 nm |
L2 cache | 2.5 MB vs 1 MB |
Maximum memory size | 128 GB vs 32 GB |
Thermal Design Power (TDP) | 35 Watt vs 47 Watt |
Reasons to consider the Intel Core i7-4710HQ
- 2 more cores, run more applications at once: 4 vs 2
- 6 more threads: 8 vs 2
- Around 60% more L1 cache; more data can be stored in the L1 cache for quick access later
- Around 50% more L3 cache; more data can be stored in the L3 cache for quick access later
- Around 28% better performance in PassMark - Single thread mark: 1780 vs 1393
- 2.3x better performance in PassMark - CPU mark: 5534 vs 2373
Specifications (specs) | |
Number of cores | 4 vs 2 |
Number of threads | 8 vs 2 |
L1 cache | 256 KB vs 160 KB |
L3 cache | 6 MB vs 4 MB |
Benchmarks | |
PassMark - Single thread mark | 1780 vs 1393 |
PassMark - CPU mark | 5534 vs 2373 |
Compare benchmarks
CPU 1: Intel Celeron G6900TE
CPU 2: Intel Core i7-4710HQ
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Celeron G6900TE | Intel Core i7-4710HQ |
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PassMark - Single thread mark | 1393 | 1780 |
PassMark - CPU mark | 2373 | 5534 |
Geekbench 4 - Single Core | 758 | |
Geekbench 4 - Multi-Core | 2678 | |
3DMark Fire Strike - Physics Score | 3209 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 4.727 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 78.893 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.564 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 2.224 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 5.332 | |
GFXBench 4.0 - Car Chase Offscreen (Frames) | 1045 | |
GFXBench 4.0 - Manhattan (Frames) | 1982 | |
GFXBench 4.0 - T-Rex (Frames) | 3673 | |
GFXBench 4.0 - Car Chase Offscreen (Fps) | 1045 | |
GFXBench 4.0 - Manhattan (Fps) | 1982 | |
GFXBench 4.0 - T-Rex (Fps) | 3673 |
Compare specifications (specs)
Intel Celeron G6900TE | Intel Core i7-4710HQ | |
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Essentials |
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Architecture codename | Alder Lake | Haswell |
Launch date | 4 Jan 2022 | 14 April 2014 |
Launch price (MSRP) | $53 | $378 |
Place in performance rating | 1808 | 1792 |
Processor Number | G6900TE | i7-4710HQ |
Series | Intel Celeron Processor G Series | 4th Generation Intel® Core™ i7 Processors |
Vertical segment | Embedded | Mobile |
Status | Launched | |
Performance |
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64 bit support | ||
L1 cache | 160 KB | 256 KB |
L2 cache | 2.5 MB | 1 MB |
L3 cache | 4 MB | 6 MB |
Manufacturing process technology | 7 nm | 22 nm |
Maximum core temperature | 100°C | 100°C |
Number of cores | 2 | 4 |
Number of threads | 2 | 8 |
Base frequency | 2.50 GHz | |
Bus Speed | 5 GT/s DMI2 | |
Die size | 177 mm | |
Maximum case temperature (TCase) | 100 °C | |
Maximum frequency | 3.50 GHz | |
Transistor count | 1400 Million | |
Memory |
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Max memory channels | 2 | 2 |
Maximum memory bandwidth | 76.8 GB/s | 25.6 GB/s |
Maximum memory size | 128 GB | 32 GB |
Supported memory types | Up to DDR5 4800 MT/s Up to DDR4 3200 MT/s | DDR3L 1333/1600 |
Graphics |
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Device ID | 0x4693 | 0x416 |
Execution Units | 16 | |
Graphics base frequency | 300 MHz | 400 MHz |
Graphics max dynamic frequency | 1.30 GHz | 1.20 GHz |
Intel® Clear Video HD technology | ||
Intel® Quick Sync Video | ||
Processor graphics | Intel UHD Graphics 710 | Intel® HD Graphics 4600 |
Graphics max frequency | 1.2 GHz | |
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Max video memory | 2 GB | |
Graphics interfaces |
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Number of displays supported | 4 | 3 |
DisplayPort | ||
eDP | ||
HDMI | ||
VGA | ||
Wireless Display (WiDi) support | ||
Graphics image quality |
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Max resolution over DisplayPort | 7680 x 4320 @ 60Hz | 3840x2160@60Hz |
Max resolution over eDP | 5120 x 3200 @ 120Hz | |
Max resolution over HDMI 1.4 | 3840x2160@60Hz | |
Max resolution over VGA | 2880x1800@60Hz | |
Graphics API support |
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DirectX | 12 | 11.2/12 |
OpenGL | 4.5 | 4.3 |
Compatibility |
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Max number of CPUs in a configuration | 1 | 1 |
Package Size | 45.0 mm x 37.5 mm | 37.5mm x 32mm x 1.6mm |
Sockets supported | FCLGA1700 | FCBGA1364 |
Thermal Design Power (TDP) | 35 Watt | 47 Watt |
Thermal Solution | PCG 2020D | |
Low Halogen Options Available | ||
Peripherals |
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Max number of PCIe lanes | 20 | 16 |
PCI Express revision | 5.0 and 4.0 | 3 |
PCIe configurations | Up to 1x16+4, 2x8+4 | 1x16, 2x8, 1x8 2x4 |
Scalability | 1S Only | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Secure Boot | ||
Anti-Theft technology | ||
Intel® Identity Protection technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel SSE4.1, Intel SSE4.2, Intel AVX2 | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Optane™ Memory Supported | ||
Intel® Turbo Boost technology | ||
Intel® Volume Management Device (VMD) | ||
Speed Shift technology | ||
Thermal Monitoring | ||
Flexible Display interface (FDI) | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® TSX-NI | ||
Intel® vPro™ Platform Eligibility | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
AMD Virtualization (AMD-V™) |