Intel Celeron M 743 vs Intel Celeron D 350

Comparative analysis of Intel Celeron M 743 and Intel Celeron D 350 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

Intel Celeron M 743

Intel Celeron D 350

Differences

Reasons to consider the Intel Celeron M 743

CPU is newer: launch date 4 year(s) 3 month(s) later
Around 49% higher maximum core temperature: 100°C vs 67°C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 90 nm
4x more L1 cache, more data can be stored in the L1 cache for quick access later
4x more L2 cache, more data can be stored in the L2 cache for quick access later
7.3x lower typical power consumption: 10 Watt vs 73 Watt

Launch date	1 September 2009 vs June 2005
Maximum core temperature	100°C vs 67°C
Manufacturing process technology	45 nm vs 90 nm
L1 cache	64 KB vs 16 KB
L2 cache	1 MB vs 256 KB
Thermal Design Power (TDP)	10 Watt vs 73 Watt

Reasons to consider the Intel Celeron D 350

Around 146% higher clock speed: 3.2 GHz vs 1.3 GHz

Maximum frequency	3.2 GHz vs 1.3 GHz

Compare benchmarks

CPU 1: Intel Celeron M 743
CPU 2: Intel Celeron D 350

Name	Intel Celeron M 743	Intel Celeron D 350
PassMark - Single thread mark	496
PassMark - CPU mark	275

Compare specifications (specs)

	Intel Celeron M 743	Intel Celeron D 350
Essentials
Architecture codename	Penryn	Prescott
Launch date	1 September 2009	June 2005
Launch price (MSRP)	$107
Place in performance rating	3017	not rated
Processor Number	743	350
Series	Legacy Intel® Celeron® Processor	Legacy Intel® Celeron® Processor
Status	Discontinued	Discontinued
Vertical segment	Mobile	Desktop
Performance
64 bit support
Base frequency	1.30 GHz	3.20 GHz
Bus Speed	800 MHz FSB	533 MHz FSB
Die size	107 mm2	112 mm2
Front-side bus (FSB)	800 MHz
L1 cache	64 KB	16 KB
L2 cache	1 MB	256 KB
Manufacturing process technology	45 nm	90 nm
Maximum core temperature	100°C	67°C
Maximum frequency	1.3 GHz	3.2 GHz
Number of cores	1	1
Number of threads	1
Transistor count	410 million	125 million
VID voltage range		1.250V-1.400V
Compatibility
Low Halogen Options Available
Package Size	22mm x 22mm	35mm x 35mm
Sockets supported	BGA956	PPGA478
Thermal Design Power (TDP)	10 Watt	73 Watt
Max number of CPUs in a configuration		1
Security & Reliability
Intel® Trusted Execution technology (TXT)
Execute Disable Bit (EDB)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Intel® Turbo Boost technology
FSB parity
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Physical Address Extensions (PAE)		32-bit
Virtualization
Intel® Virtualization Technology (VT-x)
Memory
Supported memory types		DDR1, DDR2