Intel Celeron M U3600 vs AMD Athlon II N370
Comparative analysis of Intel Celeron M U3600 and AMD Athlon II N370 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Celeron M U3600
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
- Around 94% lower typical power consumption: 18 Watt vs 35 Watt
Manufacturing process technology | 32 nm vs 45 nm |
Thermal Design Power (TDP) | 18 Watt vs 35 Watt |
Reasons to consider the AMD Athlon II N370
- Around 108% higher clock speed: 2.5 GHz vs 1.2 GHz
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 75% better performance in PassMark - Single thread mark: 913 vs 523
- Around 55% better performance in PassMark - CPU mark: 899 vs 579
Specifications (specs) | |
Maximum frequency | 2.5 GHz vs 1.2 GHz |
L2 cache | 1024 KB vs 512 KB |
Benchmarks | |
PassMark - Single thread mark | 913 vs 523 |
PassMark - CPU mark | 899 vs 579 |
Compare benchmarks
CPU 1: Intel Celeron M U3600
CPU 2: AMD Athlon II N370
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Celeron M U3600 | AMD Athlon II N370 |
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PassMark - Single thread mark | 523 | 913 |
PassMark - CPU mark | 579 | 899 |
Geekbench 4 - Single Core | 899 | |
Geekbench 4 - Multi-Core | 1483 |
Compare specifications (specs)
Intel Celeron M U3600 | AMD Athlon II N370 | |
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Essentials |
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Architecture codename | Arrandale | Champlain |
Launch date | 18 December 2010 | 16 December 2010 |
Place in performance rating | 2623 | 2409 |
Processor Number | U3600 | |
Series | Legacy Intel® Celeron® Processor | AMD Athlon II |
Status | Discontinued | |
Vertical segment | Mobile | Laptop |
Performance |
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64 bit support | ||
Base frequency | 1.20 GHz | |
Bus Speed | 2.5 GT/s DMI | |
Die size | 81 mm2 | 117.5 mm |
Front-side bus (FSB) | 2500 MHz | 3200 MHz |
L2 cache | 512 KB | 1024 KB |
L3 cache | 2048 KB | |
Manufacturing process technology | 32 nm | 45 nm |
Maximum core temperature | 105°C | |
Maximum frequency | 1.2 GHz | 2.5 GHz |
Number of cores | 2 | 2 |
Number of threads | 2 | 2 |
Transistor count | 382 million | 234 Million |
L1 cache | 256 KB | |
Memory |
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Max memory channels | 2 | |
Maximum memory bandwidth | 12.8 GB/s | |
Maximum memory size | 8 GB | |
Supported memory types | DDR3 800 | |
Graphics |
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Graphics base frequency | 166 MHz | |
Graphics max dynamic frequency | 500 MHz | |
Intel® Clear Video technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Processor graphics | Intel HD Graphics | |
Graphics interfaces |
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Number of displays supported | 2 | |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | |
Package Size | BGA 34mm x 28mm | |
Sockets supported | BGA1288 | S1 |
Thermal Design Power (TDP) | 18 Watt | 35 Watt |
Peripherals |
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Max number of PCIe lanes | 16 | |
PCI Express revision | 2.0 | |
PCIe configurations | 1x16 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Physical Address Extensions (PAE) | 36-bit | |
Thermal Monitoring | ||
VirusProtect | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
AMD Virtualization (AMD-V™) |