Intel Celeron P4505 vs Intel Celeron 550

Comparative analysis of Intel Celeron P4505 and Intel Celeron 550 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Celeron P4505

  • 1 more cores, run more applications at once: 2 vs 1
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
  • Around 24% better performance in PassMark - Single thread mark: 820 vs 662
  • 2.1x better performance in PassMark - CPU mark: 689 vs 334
Specifications (specs)
Number of cores 2 vs 1
Manufacturing process technology 32 nm vs 65 nm
Benchmarks
PassMark - Single thread mark 820 vs 662
PassMark - CPU mark 689 vs 334

Reasons to consider the Intel Celeron 550

  • Around 11% higher maximum core temperature: 100°C vs 90°C
  • Around 13% lower typical power consumption: 31 Watt vs 35 Watt
Maximum core temperature 100°C vs 90°C
Thermal Design Power (TDP) 31 Watt vs 35 Watt

Compare benchmarks

CPU 1: Intel Celeron P4505
CPU 2: Intel Celeron 550

PassMark - Single thread mark
CPU 1
CPU 2
820
662
PassMark - CPU mark
CPU 1
CPU 2
689
334
Name Intel Celeron P4505 Intel Celeron 550
PassMark - Single thread mark 820 662
PassMark - CPU mark 689 334
Geekbench 4 - Single Core 955
Geekbench 4 - Multi-Core 918

Compare specifications (specs)

Intel Celeron P4505 Intel Celeron 550

Essentials

Architecture codename Arrandale Merom
Launch date Q1'10 Q3'06
Place in performance rating 2440 2459
Processor Number P4505 550
Series Legacy Intel® Celeron® Processor Legacy Intel® Celeron® Processor
Status Launched Discontinued
Vertical segment Mobile Mobile

Performance

64 bit support
Base frequency 1.86 GHz 2.00 GHz
Bus Speed 2.5 GT/s DMI 533 MHz FSB
Die size 81 mm2 143 mm2
Manufacturing process technology 32 nm 65 nm
Maximum core temperature 90°C 100°C
Number of cores 2 1
Number of threads 2
Transistor count 382 million 291 million
VID voltage range 0.95V-1.30V

Memory

Max memory channels 2
Maximum memory bandwidth 17.1 GB/s
Maximum memory size 8 GB
Supported memory types DDR3 800/1066

Graphics

Graphics base frequency 500 MHz
Graphics max dynamic frequency 667 MHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® Flexible Display Interface (Intel® FDI)
Processor graphics Intel HD Graphics

Graphics interfaces

Number of displays supported 2

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1
Package Size BGA 34mmX28mm 35mm x 35mm
Sockets supported BGA1288 PPGA478, PBGA479
Thermal Design Power (TDP) 35 Watt 31 Watt

Peripherals

Max number of PCIe lanes 16
PCI Express revision 2.0
PCIe configurations 1X16, 2X8

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Intel 64
Intel® AES New Instructions
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Physical Address Extensions (PAE) 36-bit
Thermal Monitoring
FSB parity
Intel® Demand Based Switching

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)