Intel Core 2 Duo L7400 vs Intel Pentium Dual Core T4400

Comparative analysis of Intel Core 2 Duo L7400 and Intel Pentium Dual Core T4400 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Core 2 Duo L7400

  • 2.1x lower typical power consumption: 17 Watt vs 35 Watt
Thermal Design Power (TDP) 17 Watt vs 35 Watt

Reasons to consider the Intel Pentium Dual Core T4400

  • Around 5% higher maximum core temperature: 105°C vs 100°C
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 65 nm
  • Around 52% better performance in PassMark - Single thread mark: 845 vs 555
  • Around 50% better performance in PassMark - CPU mark: 775 vs 516
Specifications (specs)
Maximum core temperature 105°C vs 100°C
Manufacturing process technology 45 nm vs 65 nm
Benchmarks
PassMark - Single thread mark 845 vs 555
PassMark - CPU mark 775 vs 516

Compare benchmarks

CPU 1: Intel Core 2 Duo L7400
CPU 2: Intel Pentium Dual Core T4400

PassMark - Single thread mark
CPU 1
CPU 2
555
845
PassMark - CPU mark
CPU 1
CPU 2
516
775
Name Intel Core 2 Duo L7400 Intel Pentium Dual Core T4400
PassMark - Single thread mark 555 845
PassMark - CPU mark 516 775
Geekbench 4 - Single Core 258
Geekbench 4 - Multi-Core 445

Compare specifications (specs)

Intel Core 2 Duo L7400 Intel Pentium Dual Core T4400

Essentials

Architecture codename Merom Penryn
Launch date Q3'06 1 December 2009
Place in performance rating 2885 2876
Processor Number L7400 T4400
Series Legacy Intel® Core™ Processors Legacy Intel® Pentium® Processor
Status Discontinued Discontinued
Vertical segment Mobile Mobile

Performance

64 bit support
Base frequency 1.50 GHz 2.20 GHz
Bus Speed 667 MHz FSB 800 MHz FSB
Die size 143 mm2 107 mm2
Manufacturing process technology 65 nm 45 nm
Maximum core temperature 100°C 105°C
Number of cores 2 2
Transistor count 291 million 410 million
VID voltage range 0.9V-1.1V
Front-side bus (FSB) 800 MHz
L1 cache 128 KB
L2 cache 1024 KB
Maximum frequency 2.2 GHz
Number of threads 2

Compatibility

Low Halogen Options Available
Package Size 35mm x 35mm 35mm x 35mm
Sockets supported PBGA479 PGA478
Thermal Design Power (TDP) 17 Watt 35 Watt

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)