Intel Core 2 Duo L7500 vs Intel Core i3-2365M

Comparative analysis of Intel Core 2 Duo L7500 and Intel Core i3-2365M processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Graphics, Graphics interfaces, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Core 2 Duo L7500

Intel Core i3-2365M

Differences

Reasons to consider the Intel Core 2 Duo L7500

Around 9% better performance in PassMark - Single thread mark: 664 vs 608

Benchmarks
PassMark - Single thread mark	664 vs 608

Reasons to consider the Intel Core i3-2365M

A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
Around 25% better performance in PassMark - CPU mark: 819 vs 657
Around 7% better performance in Geekbench 4 - Single Core: 244 vs 228
Around 43% better performance in Geekbench 4 - Multi-Core: 546 vs 383

Specifications (specs)
Manufacturing process technology	32 nm vs 65 nm
Benchmarks
PassMark - CPU mark	819 vs 657
Geekbench 4 - Single Core	244 vs 228
Geekbench 4 - Multi-Core	546 vs 383

Compare benchmarks

CPU 1: Intel Core 2 Duo L7500
CPU 2: Intel Core i3-2365M

PassMark - Single thread mark

CPU 1

CPU 2

664

608

PassMark - CPU mark

CPU 1

CPU 2

657

819

Geekbench 4 - Single Core

CPU 1

CPU 2

228

244

Geekbench 4 - Multi-Core

CPU 1

CPU 2

383

546

Name	Intel Core 2 Duo L7500	Intel Core i3-2365M
PassMark - Single thread mark	664	608
PassMark - CPU mark	657	819
Geekbench 4 - Single Core	228	244
Geekbench 4 - Multi-Core	383	546

Compare specifications (specs)

	Intel Core 2 Duo L7500	Intel Core i3-2365M
Essentials
Architecture codename	Merom	Sandy Bridge
Launch date	Q3'06	27 June 2011
Place in performance rating	3053	3057
Processor Number	L7500	i3-2365M
Series	Legacy Intel® Core™ Processors	Legacy Intel® Core™ Processors
Status	Discontinued	Launched
Vertical segment	Mobile	Mobile
Performance
64 bit support
Base frequency	1.60 GHz	1.40 GHz
Bus Speed	800 MHz FSB	5 GT/s DMI
Die size	143 mm2	149 mm
Manufacturing process technology	65 nm	32 nm
Maximum core temperature	100°C	100 °C
Number of cores	2	2
Transistor count	291 million	624 Million
VID voltage range	0.975V - 1.062V
L1 cache		128 KB
L2 cache		512 KB
L3 cache		3072 KB
Maximum frequency		1.4 GHz
Number of threads		4
Compatibility
Low Halogen Options Available
Package Size	35mm x 35mm	31.0mm x 24.0mm (BGA1023)
Sockets supported	PBGA479	FCBGA1023
Thermal Design Power (TDP)	17 Watt	17 Watt
Max number of CPUs in a configuration		1
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Anti-Theft technology
Intel® Identity Protection technology
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
4G WiMAX Wireless
Flexible Display interface (FDI)
Instruction set extensions		Intel® AVX
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® My WiFi technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
AMD Virtualization (AMD-V™)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
Memory
Max memory channels		2
Maximum memory size		16 GB
Supported memory types		DDR3 1066/1333
Graphics
Graphics base frequency		350 MHz
Graphics max dynamic frequency		1.00 GHz
Graphics max frequency		1 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Graphics interfaces
CRT
DisplayPort
eDP
HDMI
Number of displays supported		2
SDVO
Wireless Display (WiDi) support
Peripherals
Max number of PCIe lanes		16
PCI Express revision		2.0
PCIe configurations		1x16, 2x8, 1x8 2x4